Class information for:
Level 2: LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
816 11969 21.4 54%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
16 1                   LEAD FREE SOLDER//SOLDER//PB FREE SOLDER 5368
8930 1                   UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING 1204
10992 1                   CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES 1017
13066 1                   WIRE BONDING//THERMOSONIC WIRE BONDING//COPPER WIRE BONDING 863
16594 1                   FLUXLESS BONDING//AU SN//AU SN SOLDER 646
16728 1                   ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT 639
20299 1                   ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT 467
20590 1                   DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE 453
21469 1                   TIN WHISKERS//SN WHISKER//WHISKER GROWTH 417
23618 1                   DISCRETE CRACK MODELS//OPT FILMS MAT//AEM GRP 340
24771 1                   SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING 302
33029 1                   LASER SOLDERING//INNER LEAD BONDING ILB//THERMAL PERFORMANCE DESIGN 130
33581 1                   ACOUSTIC MICRO IMAGING//OPEN BUMPS//QUALITY SIGNATURE 123

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 LEAD FREE SOLDER authKW 1922185 8% 81% 926
2 SOLDER authKW 1232880 6% 65% 743
3 SOLDERING & SURFACE MOUNT TECHNOLOGY journal 653497 3% 81% 315
4 SOLDER JOINT authKW 573997 2% 77% 291
5 PB FREE SOLDER authKW 539863 2% 83% 255
6 JOURNAL OF ELECTRONIC MATERIALS journal 516162 12% 15% 1402
7 FLIP CHIP authKW 503102 3% 55% 358
8 JOURNAL OF ELECTRONIC PACKAGING journal 431574 4% 37% 457
9 INTERMETALLIC COMPOUNDS authKW 351740 6% 20% 700
10 MICROELECTRONICS RELIABILITY journal 313926 8% 13% 924

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Materials Science, Multidisciplinary 93170 61% 1% 7269
2 Engineering, Electrical & Electronic 64900 43% 1% 5205
3 Engineering, Manufacturing 48001 11% 1% 1334
4 Metallurgy & Metallurgical Engineering 46326 21% 1% 2551
5 Physics, Applied 32895 35% 0% 4172
6 Nanoscience & Nanotechnology 17042 13% 0% 1612
7 Engineering, Mechanical 2917 6% 0% 706
8 Physics, Condensed Matter 1341 8% 0% 926
9 Materials Science, Characterization, Testing 1108 1% 0% 162
10 Mechanics 980 4% 0% 501

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 MICROJOINING 152312 1% 85% 70
2 ELECT PACKAGING MAT 89716 0% 80% 44
3 ELECT PACKAGING 78580 1% 43% 72
4 ST S RELIABIL 71173 0% 85% 33
5 COMPONENT QUAL TECHNOL GRP 56083 0% 100% 22
6 ELECT MFG ENGN GRP 53843 0% 81% 26
7 MAT SCI ENGN 52149 20% 1% 2395
8 ADV MAT JOINING 41009 0% 34% 48
9 CALCE 39112 0% 35% 44
10 ADV PACKAGING 34940 0% 57% 24

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 SOLDERING & SURFACE MOUNT TECHNOLOGY 653497 3% 81% 315
2 JOURNAL OF ELECTRONIC MATERIALS 516162 12% 15% 1402
3 JOURNAL OF ELECTRONIC PACKAGING 431574 4% 37% 457
4 MICROELECTRONICS RELIABILITY 313926 8% 13% 924
5 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 288644 3% 31% 361
6 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 195200 1% 44% 174
7 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 143649 2% 21% 275
8 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 111724 2% 18% 238
9 IEEE TRANSACTIONS ON ADVANCED PACKAGING 97540 2% 19% 197
10 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 75090 4% 6% 497

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 LEAD FREE SOLDER 1922185 8% 81% 926 Search LEAD+FREE+SOLDER Search LEAD+FREE+SOLDER
2 SOLDER 1232880 6% 65% 743 Search SOLDER Search SOLDER
3 SOLDER JOINT 573997 2% 77% 291 Search SOLDER+JOINT Search SOLDER+JOINT
4 PB FREE SOLDER 539863 2% 83% 255 Search PB+FREE+SOLDER Search PB+FREE+SOLDER
5 FLIP CHIP 503102 3% 55% 358 Search FLIP+CHIP Search FLIP+CHIP
6 INTERMETALLIC COMPOUNDS 351740 6% 20% 700 Search INTERMETALLIC+COMPOUNDS Search INTERMETALLIC+COMPOUNDS
7 INTERFACIAL REACTION 271836 3% 34% 316 Search INTERFACIAL+REACTION Search INTERFACIAL+REACTION
8 SN AG CU 253277 1% 90% 111 Search SN+AG+CU Search SN+AG+CU
9 UNDERFILL 241345 1% 76% 125 Search UNDERFILL Search UNDERFILL
10 TIN WHISKERS 225545 1% 93% 95 Search TIN+WHISKERS Search TIN+WHISKERS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 MU, DK , MCDONALD, SD , READ, J , HUANG, H , NOGITA, K , (2016) CRITICAL PROPERTIES OF CU6SN5 IN ELECTRONIC DEVICES: RECENT PROGRESS AND A REVIEW.CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE. VOL. 20. ISSUE 2. P. 55 -76 172 97% 2
2 ZHANG, L , TU, KN , (2014) STRUCTURE AND PROPERTIES OF LEAD-FREE SOLDERS BEARING MICRO AND NANO PARTICLES.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 82. ISSUE . P. 1 -32 143 92% 38
3 ZHANG, L , HE, CW , GUO, YH , HAN, JG , ZHANG, YW , WANG, XY , (2012) DEVELOPMENT OF SNAG-BASED LEAD FREE SOLDERS IN ELECTRONICS PACKAGING.MICROELECTRONICS RELIABILITY. VOL. 52. ISSUE 3. P. 559 -578 142 97% 31
4 KOTADIA, HR , HOWES, PD , MANNAN, SH , (2014) A REVIEW: ON THE DEVELOPMENT OF LOW MELTING TEMPERATURE PB-FREE SOLDERS.MICROELECTRONICS RELIABILITY. VOL. 54. ISSUE 6-7. P. 1253 -1273 104 96% 44
5 LIU, S , XUE, SB , XUE, P , LUO, DX , (2015) PRESENT STATUS OF SN-ZN LEAD-FREE SOLDERS BEARING ALLOYING ELEMENTS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 26. ISSUE 7. P. 4389 -4411 122 98% 5
6 SHNAWAH, DA , SAID, SBM , SABRI, MFM , BADRUDDIN, IA , CHE, FX , (2012) HIGH-RELIABILITY LOW-AG-CONTENT SN-AG-CU SOLDER JOINTS FOR ELECTRONICS APPLICATIONS.JOURNAL OF ELECTRONIC MATERIALS. VOL. 41. ISSUE 9. P. 2631 -2658 127 97% 17
7 WU, J , XUE, SB , WANG, JW , LIU, S , HAN, YL , WANG, LJ , (2016) RECENT PROGRESS OF SN-AG-CU LEAD-FREE SOLDERS BEARING ALLOY ELEMENTS AND NANOPARTICLES IN ELECTRONIC PACKAGING.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 27. ISSUE 12. P. 12729 -12763 125 95% 0
8 LIU, S , XUE, SB , (2015) RELIABILITY STUDY OF LEAD-FREE SOLDERS UNDER SPECIFIC CONDITIONS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 26. ISSUE 12. P. 9424 -9442 112 97% 3
9 TAN, AT , TAN, AW , YUSOF, F , (2015) INFLUENCE OF NANOPARTICLE ADDITION ON THE FORMATION AND GROWTH OF INTERMETALLIC COMPOUNDS (IMCS) IN CU/SN-AG-CU/CU SOLDER JOINT DURING DIFFERENT THERMAL CONDITIONS.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS. VOL. 16. ISSUE 3. P. - 110 93% 4
10 ZENG, G , XUE, SB , ZHANG, L , GAO, LL , DAI, W , LUO, JD , (2010) A REVIEW ON THE INTERFACIAL INTERMETALLIC COMPOUNDS BETWEEN SN-AG-CU BASED SOLDERS AND SUBSTRATES.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 21. ISSUE 5. P. 421 -440 104 98% 62

Classes with closest relation at Level 2


Rank Class id link
1 2642 THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA
2 1837 CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY//PHASE DIAGRAM//LIQUID ALLOYS
3 2485 ELECTROMIGRATION//ELECTROMIGRATION EM//SOLID STATE DEWETTING
4 2862 INKJET PRINTING//PRINTED ELECTRONICS//CONDUCTIVE INK
5 3252 JUNCTION TEMPERATURE//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT
6 3123 ELECTROMAGNETIC LEVITATION//PULSE HEATING//NORMAL SPECTRAL EMISSIVITY
7 2536 DIFFUS SOLIDS GRP//KIRKENDALL EFFECT//DICTRA
8 1560 BRAZING//DIFFUSION BONDING//ACCUMULATIVE ROLL BONDING
9 3184 THICK FILM RESISTORS//LTCC//MICROSYST ELECT PHOTON
10 3188 NEAT ORU//PETER A ROCK THERMOCHEM//PROBLEMS GEOTHERMY

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