Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 23618 | 340 | 19.4 | 40% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 2 | 4 | MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER | 2836879 |
| 178 | 3 | GAN//PHYSICS, APPLIED//GALLIUM NITRIDE | 57874 |
| 816 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 11969 |
| 23618 | 1 | DISCRETE CRACK MODELS//OPT FILMS MAT//AEM GRP | 340 |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | DISCRETE CRACK MODELS | authKW | 179619 | 1% | 100% | 2 |
| 2 | OPT FILMS MAT | address | 179619 | 1% | 100% | 2 |
| 3 | AEM GRP | address | 119744 | 1% | 67% | 2 |
| 4 | THERMOPLASTIC ADHESIVES | authKW | 119744 | 1% | 67% | 2 |
| 5 | PEELING STRESS | authKW | 119740 | 1% | 33% | 4 |
| 6 | ACF ASSEMBLY | authKW | 89809 | 0% | 100% | 1 |
| 7 | ANTIREFLECTION COATNGS | authKW | 89809 | 0% | 100% | 1 |
| 8 | AZ4620 PHOTORESIST FILM | authKW | 89809 | 0% | 100% | 1 |
| 9 | BI MATERIAL LAYER | authKW | 89809 | 0% | 100% | 1 |
| 10 | BIMATERIAL ASSEMBLY | authKW | 89809 | 0% | 100% | 1 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Physics, Applied | 908 | 34% | 0% | 117 |
| 2 | Mechanics | 906 | 19% | 0% | 63 |
| 3 | Materials Science, Multidisciplinary | 516 | 29% | 0% | 99 |
| 4 | Engineering, Electrical & Electronic | 487 | 24% | 0% | 81 |
| 5 | Materials Science, Composites | 469 | 6% | 0% | 19 |
| 6 | Engineering, Mechanical | 336 | 11% | 0% | 37 |
| 7 | Materials Science, Coatings & Films | 217 | 6% | 0% | 21 |
| 8 | Materials Science, Characterization, Testing | 208 | 3% | 0% | 11 |
| 9 | Engineering, Manufacturing | 169 | 4% | 0% | 14 |
| 10 | Art | 87 | 1% | 0% | 5 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | OPT FILMS MAT | 179619 | 1% | 100% | 2 |
| 2 | AEM GRP | 119744 | 1% | 67% | 2 |
| 3 | COUNCIL ITALY ISTI | 89809 | 0% | 100% | 1 |
| 4 | DEVICE PACKAGE | 89809 | 0% | 100% | 1 |
| 5 | ILUMINATING ENGN LIGHT SOURCES | 89809 | 0% | 100% | 1 |
| 6 | MEMS NANO SYST PACKAGING | 89809 | 0% | 100% | 1 |
| 7 | MTECH PROGRAM | 89809 | 0% | 100% | 1 |
| 8 | PACKAGING DEV ASSEMBLEY | 89809 | 0% | 100% | 1 |
| 9 | QUAL ASSURANCE REB | 89809 | 0% | 100% | 1 |
| 10 | SATELLITE TECHNOL DEV OFF | 89809 | 0% | 100% | 1 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | JOURNAL OF ELECTRONIC PACKAGING | 49228 | 8% | 2% | 26 |
| 2 | WAFFEN-UND KOSTUMKUNDE | 36838 | 1% | 10% | 4 |
| 3 | MECHANICS OF COMPOSITE MATERIALS AND STRUCTURES | 9977 | 0% | 11% | 1 |
| 4 | JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 4037 | 5% | 0% | 16 |
| 5 | MICROELECTRONICS RELIABILITY | 2900 | 4% | 0% | 15 |
| 6 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2744 | 5% | 0% | 16 |
| 7 | ZAMM-ZEITSCHRIFT FUR ANGEWANDTE MATHEMATIK UND MECHANIK | 2539 | 1% | 1% | 5 |
| 8 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 2077 | 1% | 1% | 3 |
| 9 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1944 | 1% | 0% | 5 |
| 10 | JOURNAL OF THERMAL STRESSES | 1937 | 2% | 0% | 6 |
Author Key Words |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | DISCRETE CRACK MODELS | 179619 | 1% | 100% | 2 | Search DISCRETE+CRACK+MODELS | Search DISCRETE+CRACK+MODELS |
| 2 | THERMOPLASTIC ADHESIVES | 119744 | 1% | 67% | 2 | Search THERMOPLASTIC+ADHESIVES | Search THERMOPLASTIC+ADHESIVES |
| 3 | PEELING STRESS | 119740 | 1% | 33% | 4 | Search PEELING+STRESS | Search PEELING+STRESS |
| 4 | ACF ASSEMBLY | 89809 | 0% | 100% | 1 | Search ACF+ASSEMBLY | Search ACF+ASSEMBLY |
| 5 | ANTIREFLECTION COATNGS | 89809 | 0% | 100% | 1 | Search ANTIREFLECTION+COATNGS | Search ANTIREFLECTION+COATNGS |
| 6 | AZ4620 PHOTORESIST FILM | 89809 | 0% | 100% | 1 | Search AZ4620+PHOTORESIST+FILM | Search AZ4620+PHOTORESIST+FILM |
| 7 | BI MATERIAL LAYER | 89809 | 0% | 100% | 1 | Search BI+MATERIAL+LAYER | Search BI+MATERIAL+LAYER |
| 8 | BIMATERIAL ASSEMBLY | 89809 | 0% | 100% | 1 | Search BIMATERIAL+ASSEMBLY | Search BIMATERIAL+ASSEMBLY |
| 9 | BIMATERIAL SAMPLE | 89809 | 0% | 100% | 1 | Search BIMATERIAL+SAMPLE | Search BIMATERIAL+SAMPLE |
| 10 | BIMETALLIC BEAM | 89809 | 0% | 100% | 1 | Search BIMETALLIC+BEAM | Search BIMETALLIC+BEAM |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | SUHIR, E , GHAFFARIAN, R , (2015) PREDICTED STRESSES IN A BALL-GRID-ARRAY (BGA)/COLUMN-GRID-ARRAY (CGA) ASSEMBLY WITH A LOW MODULUS SOLDER AT ITS ENDS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 26. ISSUE 12. P. 9680 -9688 | 21 | 100% | 2 |
| 2 | SUHIR, E , GHAFFARIAN, R , (2016) PREDICTED STRESSES IN A BALL-GRID-ARRAY (BGA)/COLUMN-GRID-ARRAY (CGA) ASSEMBLY WITH AN EPOXY ADHESIVE AT ITS ENDS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 27. ISSUE 5. P. 4399 -4409 | 22 | 96% | 0 |
| 3 | SUHIR, E , (2013) THERMAL STRESS FAILURES IN ELECTRONICS AND PHOTONICS: PHYSICS, MODELING, PREVENTION.JOURNAL OF THERMAL STRESSES. VOL. 36. ISSUE 6. P. 537 -563 | 21 | 62% | 2 |
| 4 | WONG, EH , (2016) DESIGN ANALYSIS OF SANDWICHED STRUCTURES EXPERIENCING DIFFERENTIAL THERMAL EXPANSION AND DIFFERENTIAL FREE-EDGE STRETCHING.INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES. VOL. 65. ISSUE . P. 19 -27 | 13 | 87% | 0 |
| 5 | SUHIR, E , (2009) PREDICTIVE ANALYTICAL THERMAL STRESS MODELING IN ELECTRONICS AND PHOTONICS.APPLIED MECHANICS REVIEWS. VOL. 62. ISSUE 4. P. - | 27 | 45% | 9 |
| 6 | SUHIR, E , GHAFFARIAN, R , YI, S , (2017) RELIABILITY PHYSICS BEHIND THE QFN STATE OF STRESS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 28. ISSUE 2. P. 2160 -2171 | 10 | 100% | 0 |
| 7 | SUHIR, E , GHAFFARIAN, R , YI, S , (2017) PROBABILISTIC PALMGREN-MINER RULE, WITH APPLICATION TO SOLDER MATERIALS EXPERIENCING ELASTIC DEFORMATIONS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 28. ISSUE 3. P. 2680 -2685 | 13 | 76% | 0 |
| 8 | SUHIR, E , (2016) BI-MATERIAL ASSEMBLY WITH A LOW-MODULUS-AND/OR-LOW-FABRICATION-TEMPERATURE BONDING MATERIAL AT ITS ENDS: OPTIMIZED STRESS RELIEF.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 27. ISSUE 5. P. 4816 -4825 | 9 | 90% | 1 |
| 9 | HSUEH, HC , CHIANG, DY , LEE, S , (2010) MODELING OF RELAXATION OF VISCOELASTIC STRESSES IN MULTI-LAYERED THIN FILMS/SUBSTRATE SYSTEMS DUE TO THERMAL MISMATCH.THIN SOLID FILMS. VOL. 518. ISSUE 24. P. 7497-7500 | 15 | 63% | 2 |
| 10 | SUHIR, E , (2016) EXPECTED STRESS RELIEF IN A BI-MATERIAL INHOMOGENEOUSLY BONDED ASSEMBLY WITH A LOW-MODULUS-AND/OR-LOW-FABRICATION-TEMPERATURE BONDING MATERIAL AT THE ENDS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 27. ISSUE 6. P. 5563 -5574 | 9 | 90% | 0 |
Classes with closest relation at Level 1 |