Class information for:
Level 1: LEAD FREE SOLDER//SOLDER//PB FREE SOLDER

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
16 5368 23.3 65%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
16 1                   LEAD FREE SOLDER//SOLDER//PB FREE SOLDER 5368

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 LEAD FREE SOLDER authKW 3689954 16% 76% 859
2 SOLDER authKW 1596013 11% 50% 566
3 PB FREE SOLDER authKW 1040298 4% 77% 237
4 SOLDER JOINT authKW 738472 4% 59% 221
5 JOURNAL OF ELECTRONIC MATERIALS journal 664325 20% 11% 1064
6 INTERFACIAL REACTION authKW 546956 6% 32% 300
7 INTERMETALLIC COMPOUNDS authKW 524615 11% 16% 572
8 SN AG CU authKW 505561 2% 85% 105
9 SOLDERING & SURFACE MOUNT TECHNOLOGY journal 414527 3% 43% 168
10 INTERMETALLIC COMPOUND IMC authKW 358447 1% 80% 79

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Materials Science, Multidisciplinary 68250 76% 0% 4105
2 Metallurgy & Metallurgical Engineering 51104 33% 1% 1762
3 Engineering, Electrical & Electronic 27096 42% 0% 2258
4 Physics, Applied 21837 42% 0% 2235
5 Engineering, Manufacturing 6185 6% 0% 328
6 Nanoscience & Nanotechnology 5382 11% 0% 616
7 Physics, Condensed Matter 983 9% 0% 494
8 Mining & Mineral Processing 910 1% 0% 77
9 Engineering, Mechanical 482 4% 0% 213
10 Chemistry, Physical 422 9% 0% 494

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 ELECT PACKAGING MAT 173779 1% 75% 41
2 ELECT PACKAGING 117749 1% 35% 59
3 COMPONENT QUAL TECHNOL GRP 113986 0% 95% 21
4 MICROJOINING 89834 1% 44% 36
5 MAT SCI ENGN 61084 32% 1% 1708
6 14 49776 1% 30% 29
7 TIANJIN ADV JOINTING TECHNOL 44398 0% 46% 17
8 ELECT PROD TECHNOL 35705 0% 37% 17
9 ASSEMBLY TEST GLOBAL MAT 34119 0% 100% 6
10 KEY STATE NEW DISPLAYS SYST INTEGRAT 34119 0% 100% 6

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 JOURNAL OF ELECTRONIC MATERIALS 664325 20% 11% 1064
2 SOLDERING & SURFACE MOUNT TECHNOLOGY 414527 3% 43% 168
3 JOURNAL OF ELECTRONIC PACKAGING 94133 3% 12% 143
4 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 85841 7% 4% 355
5 MICROELECTRONICS RELIABILITY 65481 5% 4% 283
6 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 27699 1% 7% 75
7 JOURNAL OF ALLOYS AND COMPOUNDS 20210 7% 1% 383
8 MATERIALS TRANSACTIONS 19141 3% 2% 156
9 JOURNAL OF MATERIALS RESEARCH 16614 3% 2% 187
10 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 15617 1% 8% 33

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 LEAD FREE SOLDER 3689954 16% 76% 859 Search LEAD+FREE+SOLDER Search LEAD+FREE+SOLDER
2 SOLDER 1596013 11% 50% 566 Search SOLDER Search SOLDER
3 PB FREE SOLDER 1040298 4% 77% 237 Search PB+FREE+SOLDER Search PB+FREE+SOLDER
4 SOLDER JOINT 738472 4% 59% 221 Search SOLDER+JOINT Search SOLDER+JOINT
5 INTERFACIAL REACTION 546956 6% 32% 300 Search INTERFACIAL+REACTION Search INTERFACIAL+REACTION
6 INTERMETALLIC COMPOUNDS 524615 11% 16% 572 Search INTERMETALLIC+COMPOUNDS Search INTERMETALLIC+COMPOUNDS
7 SN AG CU 505561 2% 85% 105 Search SN+AG+CU Search SN+AG+CU
8 INTERMETALLIC COMPOUND IMC 358447 1% 80% 79 Search INTERMETALLIC+COMPOUND+IMC Search INTERMETALLIC+COMPOUND+IMC
9 ELECTROMIGRATION 290073 4% 21% 238 Search ELECTROMIGRATION Search ELECTROMIGRATION
10 COMPOSITE SOLDER 280227 1% 93% 53 Search COMPOSITE+SOLDER Search COMPOSITE+SOLDER

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 MU, DK , MCDONALD, SD , READ, J , HUANG, H , NOGITA, K , (2016) CRITICAL PROPERTIES OF CU6SN5 IN ELECTRONIC DEVICES: RECENT PROGRESS AND A REVIEW.CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE. VOL. 20. ISSUE 2. P. 55 -76 172 97% 2
2 ZHANG, L , TU, KN , (2014) STRUCTURE AND PROPERTIES OF LEAD-FREE SOLDERS BEARING MICRO AND NANO PARTICLES.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 82. ISSUE . P. 1 -32 143 92% 38
3 ZHANG, L , HE, CW , GUO, YH , HAN, JG , ZHANG, YW , WANG, XY , (2012) DEVELOPMENT OF SNAG-BASED LEAD FREE SOLDERS IN ELECTRONICS PACKAGING.MICROELECTRONICS RELIABILITY. VOL. 52. ISSUE 3. P. 559 -578 142 97% 31
4 KOTADIA, HR , HOWES, PD , MANNAN, SH , (2014) A REVIEW: ON THE DEVELOPMENT OF LOW MELTING TEMPERATURE PB-FREE SOLDERS.MICROELECTRONICS RELIABILITY. VOL. 54. ISSUE 6-7. P. 1253 -1273 103 95% 44
5 LIU, S , XUE, SB , XUE, P , LUO, DX , (2015) PRESENT STATUS OF SN-ZN LEAD-FREE SOLDERS BEARING ALLOYING ELEMENTS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 26. ISSUE 7. P. 4389 -4411 121 98% 5
6 SHNAWAH, DA , SAID, SBM , SABRI, MFM , BADRUDDIN, IA , CHE, FX , (2012) HIGH-RELIABILITY LOW-AG-CONTENT SN-AG-CU SOLDER JOINTS FOR ELECTRONICS APPLICATIONS.JOURNAL OF ELECTRONIC MATERIALS. VOL. 41. ISSUE 9. P. 2631 -2658 125 95% 17
7 TAN, AT , TAN, AW , YUSOF, F , (2015) INFLUENCE OF NANOPARTICLE ADDITION ON THE FORMATION AND GROWTH OF INTERMETALLIC COMPOUNDS (IMCS) IN CU/SN-AG-CU/CU SOLDER JOINT DURING DIFFERENT THERMAL CONDITIONS.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS. VOL. 16. ISSUE 3. P. - 110 93% 4
8 WU, J , XUE, SB , WANG, JW , LIU, S , HAN, YL , WANG, LJ , (2016) RECENT PROGRESS OF SN-AG-CU LEAD-FREE SOLDERS BEARING ALLOY ELEMENTS AND NANOPARTICLES IN ELECTRONIC PACKAGING.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 27. ISSUE 12. P. 12729 -12763 117 89% 0
9 ZENG, G , XUE, SB , ZHANG, L , GAO, LL , DAI, W , LUO, JD , (2010) A REVIEW ON THE INTERFACIAL INTERMETALLIC COMPOUNDS BETWEEN SN-AG-CU BASED SOLDERS AND SUBSTRATES.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 21. ISSUE 5. P. 421 -440 103 97% 62
10 CHAN, YC , YANG, D , (2010) FAILURE MECHANISMS OF SOLDER INTERCONNECTS UNDER CURRENT STRESSING IN ADVANCED ELECTRONIC PACKAGES.PROGRESS IN MATERIALS SCIENCE. VOL. 55. ISSUE 5. P. 428 -475 92 95% 94

Classes with closest relation at Level 1


Rank Class id link
1 16728 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT
2 16594 FLUXLESS BONDING//AU SN//AU SN SOLDER
3 21469 TIN WHISKERS//SN WHISKER//WHISKER GROWTH
4 24832 IMPRESSION CREEP//INDENTATION CREEP TESTING//FINITE ELEMENT CREEP STRESS ANALYSIS
5 20590 DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE
6 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
7 10756 CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY//GENERAL SOLUTION MODEL//ALLOY THERMODYNAMICS
8 32003 CONTINUOUS UNIDIRECTIONAL SOLIDIFICATION//OHNO CONTINUOUS CASTING//BEIJING METALL MAT PROC MODERN TRANSPORTAT
9 22642 LEAD FREE SOLDERING ALLOYS//EDSHAMMAR POLYHEDRON//FERRIMAGNETIC CURIE TEMPERATURE
10 25069 FUSIBLE ALLOYS//HARDNESS INDENTATION//ZINC TITANIUM ALLOYS

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