Class information for:
Level 1: WIRE BONDING//THERMOSONIC WIRE BONDING//COPPER WIRE BONDING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
13066 863 18.4 44%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
13066 1                   WIRE BONDING//THERMOSONIC WIRE BONDING//COPPER WIRE BONDING 863

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 WIRE BONDING authKW 2512772 14% 57% 125
2 THERMOSONIC WIRE BONDING authKW 568065 2% 94% 17
3 COPPER WIRE BONDING authKW 530720 2% 100% 15
4 THERMOSONIC BONDING authKW 398626 2% 87% 13
5 ULTRASONIC WEDGE BONDING authKW 389195 1% 100% 11
6 FREE AIR BALL authKW 353813 1% 100% 10
7 MICROJOINING address 338243 3% 34% 28
8 ULTRASONIC WIRE BONDING authKW 299694 1% 71% 12
9 THERMOSONIC authKW 285404 1% 73% 11
10 BONDABILITY authKW 249132 2% 54% 13

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 7029 16% 0% 136
2 Engineering, Electrical & Electronic 6606 51% 0% 441
3 Materials Science, Multidisciplinary 3536 45% 0% 390
4 Nanoscience & Nanotechnology 3432 22% 0% 188
5 Physics, Applied 3356 41% 0% 352
6 Metallurgy & Metallurgical Engineering 1112 13% 0% 110
7 Materials Science, Coatings & Films 216 4% 0% 35
8 Engineering, Mechanical 192 6% 0% 49
9 Physics, Condensed Matter 125 8% 0% 73
10 Optics 79 5% 0% 47

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROJOINING 338243 3% 34% 28
2 ADV MAT JOINING 208036 3% 20% 29
3 PACKAGING RND ADV MFG ENGN 106144 0% 100% 3
4 NANOELECT ENGN INEE 79607 0% 75% 3
5 CENT CHARACTERISAT 70763 0% 100% 2
6 GLOBAL PACKAGING ENGN 70763 0% 100% 2
7 SCG IND M SDN BHD 70763 0% 100% 2
8 ULTRASON BONDING 70763 0% 100% 2
9 MAT PLICAT 69886 1% 22% 9
10 MICROELECT NANO ENGN 53069 0% 50% 3

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROELECTRONICS RELIABILITY 69984 14% 2% 117
2 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 35531 4% 3% 36
3 MICROELECTRONICS INTERNATIONAL 34599 2% 5% 18
4 JOURNAL OF ELECTRONIC PACKAGING 22461 3% 2% 28
5 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 20765 3% 2% 26
6 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 20677 3% 2% 28
7 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 20125 2% 4% 15
8 JOURNAL OF ELECTRONIC MATERIALS 11371 6% 1% 56
9 GOLD BULLETIN 10196 1% 3% 11
10 IEEE TRANSACTIONS ON ADVANCED PACKAGING 7845 2% 1% 15

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 WIRE BONDING 2512772 14% 57% 125 Search WIRE+BONDING Search WIRE+BONDING
2 THERMOSONIC WIRE BONDING 568065 2% 94% 17 Search THERMOSONIC+WIRE+BONDING Search THERMOSONIC+WIRE+BONDING
3 COPPER WIRE BONDING 530720 2% 100% 15 Search COPPER+WIRE+BONDING Search COPPER+WIRE+BONDING
4 THERMOSONIC BONDING 398626 2% 87% 13 Search THERMOSONIC+BONDING Search THERMOSONIC+BONDING
5 ULTRASONIC WEDGE BONDING 389195 1% 100% 11 Search ULTRASONIC+WEDGE+BONDING Search ULTRASONIC+WEDGE+BONDING
6 FREE AIR BALL 353813 1% 100% 10 Search FREE+AIR+BALL Search FREE+AIR+BALL
7 ULTRASONIC WIRE BONDING 299694 1% 71% 12 Search ULTRASONIC+WIRE+BONDING Search ULTRASONIC+WIRE+BONDING
8 THERMOSONIC 285404 1% 73% 11 Search THERMOSONIC Search THERMOSONIC
9 BONDABILITY 249132 2% 54% 13 Search BONDABILITY Search BONDABILITY
10 AG 8AU 3PD ALLOY WIRE 247669 1% 100% 7 Search AG+8AU+3PD+ALLOY+WIRE Search AG+8AU+3PD+ALLOY+WIRE

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 GAN, CL , HASHIM, U , (2015) EVOLUTIONS OF BONDING WIRES USED IN SEMICONDUCTOR ELECTRONICS: PERSPECTIVE OVER 25 YEARS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 26. ISSUE 7. P. 4412 -4424 49 98% 4
2 BREACH, CD , WULFF, FW , (2010) A BRIEF REVIEW OF SELECTED ASPECTS OF THE MATERIALS SCIENCE OF BALL BONDING.MICROELECTRONICS RELIABILITY. VOL. 50. ISSUE 1. P. 1 -20 66 67% 54
3 SCHNEIDER-RAMELOW, M , GEISSLER, U , SCHMITZ, S , GRUBL, W , SCHUCH, B , (2013) DEVELOPMENT AND STATUS OF CU BALL/WEDGE BONDING IN 2012.JOURNAL OF ELECTRONIC MATERIALS. VOL. 42. ISSUE 3. P. 558-595 40 100% 9
4 CHAUHAN, P , ZHONG, ZW , PECHT, M , (2013) COPPER WIRE BONDING CONCERNS AND BEST PRACTICES.JOURNAL OF ELECTRONIC MATERIALS. VOL. 42. ISSUE 8. P. 2415 -2434 38 93% 21
5 GAN, CL , CLASSE, F , CHAN, BL , HASHIM, U , (2014) FUTURE AND TECHNICAL CONSIDERATIONS OF GOLD WIREBONDING IN SEMICONDUCTOR PACKAGING - A TECHNICAL REVIEW.MICROELECTRONICS INTERNATIONAL. VOL. 31. ISSUE 2. P. 121 -128 35 100% 3
6 LI, JH , ZHANG, XL , LIU, LG , HAN, L , (2013) INTERFACIAL CHARACTERISTICS AND DYNAMIC PROCESS OF AU- AND CU-WIRE BONDING AND OVERHANG BONDING IN MICROELECTRONICS PACKAGING.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 22. ISSUE 3. P. 560-568 31 89% 6
7 ZHONG, ZW , (2011) OVERVIEW OF WIRE BONDING USING COPPER WIRE OR INSULATED WIRE.MICROELECTRONICS RELIABILITY. VOL. 51. ISSUE 1. P. 4 -12 42 61% 42
8 LIU, PS , TONG, LY , WANG, JL , SHI, L , TANG, H , (2012) CHALLENGES AND DEVELOPMENTS OF COPPER WIRE BONDING TECHNOLOGY.MICROELECTRONICS RELIABILITY. VOL. 52. ISSUE 6. P. 1092 -1098 25 93% 23
9 LI, JH , LIU, LG , DENG, LH , MA, BK , WANG, FL , HAN, L , (2011) INTERFACIAL MICROSTRUCTURES AND THERMODYNAMICS OF THERMOSONIC CU-WIRE BONDING.IEEE ELECTRON DEVICE LETTERS. VOL. 32. ISSUE 10. P. 1433-1435 23 100% 19
10 ZULKIFLI, MN , ABDULLAH, S , OTHMAN, NK , JALAR, A , (2012) SOME THOUGHTS ON BONDABILITY AND STRENGTH OF GOLD WIRE BONDING.GOLD BULLETIN. VOL. 45. ISSUE 3. P. 115-125 23 100% 7

Classes with closest relation at Level 1


Rank Class id link
1 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
2 32024 AUAL2//PTAL2//PTGA2
3 22359 ULTRASONIC PLASTIC WELDING//FREQUENCY CHARACTERISTICS OF PLASTIC WELDING//HIGH FREQUENCY ULTRASONIC PLASTIC WELDING
4 35164 JETTING DISPENSER//TIME PRESSURE DISPENSING//PIEZOSTACK ACTUATOR
5 10992 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES
6 8314 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION
7 36044 ACID DECAPSULATION//ACOUSTIC BALL BOND INSPECTION//ACOUSTIC GHZ MICROSCOPY
8 25993 PROBE CARD//COMPLIANT INTERCONNECTS//MEMS PROBE CARD
9 10056 ULTRASONIC CONSOLIDATION//ULTRASONIC WELDING//ULTRASONIC SPOT WELDING
10 20299 ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT

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