Class information for:
Level 1: ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
16728 639 19.5 35%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
16728 1                   ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT 639

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV DESIGN MFG RELIABIL MEMS NEMS ODES address 203705 1% 47% 9
2 DROP TEST authKW 199072 3% 21% 20
3 SOLDER JOINT authKW 193230 6% 10% 39
4 PORTABLE ELECTRONIC PRODUCTS authKW 191140 1% 100% 4
5 ST S RELIABIL address 176420 2% 31% 12
6 BOARD LEVEL DROP TEST authKW 172021 1% 60% 6
7 BOARD LEVEL RELIABILITY authKW 170657 1% 71% 5
8 WLCSP authKW 167240 1% 50% 7
9 JOURNAL OF ELECTRONIC PACKAGING journal 158748 10% 5% 64
10 JEDEC authKW 152910 1% 80% 4

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Electrical & Electronic 5565 54% 0% 347
2 Engineering, Manufacturing 5131 16% 0% 100
3 Engineering, Mechanical 2191 19% 0% 124
4 Nanoscience & Nanotechnology 1991 19% 0% 124
5 Materials Science, Multidisciplinary 1339 33% 0% 214
6 Physics, Applied 888 26% 0% 165
7 Mechanics 614 12% 0% 74
8 Materials Science, Characterization, Testing 327 3% 0% 19
9 Engineering, General 128 4% 0% 25
10 Materials Science, Composites 101 2% 0% 13

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV DESIGN MFG RELIABIL MEMS NEMS ODES 203705 1% 47% 9
2 ST S RELIABIL 176420 2% 31% 12
3 MAT MICROSTRUCT INTEGR 137725 1% 41% 7
4 NSF ELECT CAVE3 109219 1% 57% 4
5 NSF ADV VEHICLE EXTREME ENVIRONM ELECT CAVE 107515 0% 75% 3
6 ADV VEHICLE ELECT 106420 1% 32% 7
7 MECH INTELLIGENT SYST ENG 95570 0% 100% 2
8 OME WORKS 95570 0% 100% 2
9 ADV DESIGN MFG RELIABIL MEMS NEMS 95566 1% 50% 4
10 ADV MICROSYST PACKAGING NANOMECH 89936 1% 24% 8

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF ELECTRONIC PACKAGING 158748 10% 5% 64
2 MICROELECTRONICS RELIABILITY 80588 17% 2% 108
3 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 56863 6% 3% 37
4 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 45380 5% 3% 35
5 IEEE TRANSACTIONS ON ADVANCED PACKAGING 31900 4% 3% 26
6 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 24091 4% 2% 26
7 INTERCONNECTION TECHNOLOGY 23891 0% 50% 1
8 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 12078 2% 3% 10
9 MICROELECTRONICS INTERNATIONAL 9224 1% 2% 8
10 SOLDERING & SURFACE MOUNT TECHNOLOGY 7887 1% 2% 8

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 DROP TEST 199072 3% 21% 20 Search DROP+TEST Search DROP+TEST
2 SOLDER JOINT 193230 6% 10% 39 Search SOLDER+JOINT Search SOLDER+JOINT
3 PORTABLE ELECTRONIC PRODUCTS 191140 1% 100% 4 Search PORTABLE+ELECTRONIC+PRODUCTS Search PORTABLE+ELECTRONIC+PRODUCTS
4 BOARD LEVEL DROP TEST 172021 1% 60% 6 Search BOARD+LEVEL+DROP+TEST Search BOARD+LEVEL+DROP+TEST
5 BOARD LEVEL RELIABILITY 170657 1% 71% 5 Search BOARD+LEVEL+RELIABILITY Search BOARD+LEVEL+RELIABILITY
6 WLCSP 167240 1% 50% 7 Search WLCSP Search WLCSP
7 JEDEC 152910 1% 80% 4 Search JEDEC Search JEDEC
8 JESD22 B111 152910 1% 80% 4 Search JESD22+B111 Search JESD22+B111
9 PBGA 139000 1% 36% 8 Search PBGA Search PBGA
10 SOLDER JOINT RELIABILITY 112784 2% 20% 12 Search SOLDER+JOINT+RELIABILITY Search SOLDER+JOINT+RELIABILITY

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 YAU, YH , HUA, SN , (2011) A COMPREHENSIVE REVIEW OF DROP IMPACT MODELING ON PORTABLE ELECTRONIC DEVICES.APPLIED MECHANICS REVIEWS. VOL. 64. ISSUE 2. P. - 27 100% 1
2 YANG, F , MEGUID, SA , (2013) EFFICIENT MULTI-LEVEL MODELING TECHNIQUE FOR DETERMINING EFFECTIVE BOARD DROP RELIABILITY OF PCB ASSEMBLY.MICROELECTRONICS RELIABILITY. VOL. 53. ISSUE 7. P. 975 -984 20 80% 6
3 SUHIR, E , (2010) PREDICTIVE MODELING OF THE DYNAMIC RESPONSE OF ELECTRONIC SYSTEMS TO SHOCKS AND VIBRATIONS.APPLIED MECHANICS REVIEWS. VOL. 63. ISSUE 5. P. - 19 86% 1
4 LIU, F , LU, Y , WANG, Z , ZHANG, ZM , (2015) NUMERICAL SIMULATION AND FATIGUE LIFE ESTIMATION OF BGA PACKAGES UNDER RANDOM VIBRATION LOADING.MICROELECTRONICS RELIABILITY. VOL. 55. ISSUE 12. P. 2777 -2785 12 100% 3
5 YEH, CL , LAI, YS , (2008) INVESTIGATIONS OF SOLDER JOINT DAMAGE POTENTIALS FOR BOARD-LEVEL CHIP-SCALE PACKAGES SUBJECTED TO CONSECUTIVE DROPS.MICROELECTRONICS RELIABILITY. VOL. 48. ISSUE 2. P. 282-292 18 82% 4
6 AMY, RA , AGLIETTI, GS , RICHARDSON, G , (2010) ACCURACY OF SIMPLIFIED PRINTED CIRCUIT BOARD FINITE ELEMENT MODELS.MICROELECTRONICS RELIABILITY. VOL. 50. ISSUE 1. P. 86-97 14 93% 16
7 ZHANG, B , XI, JS , LIU, PK , DING, H , (2013) FAILURE ANALYSIS OF BOARD-LEVEL SN-AG-CU SOLDER INTERCONNECTIONS UNDER JEDEC STANDARD DROP TEST.JOURNAL OF ELECTRONIC MATERIALS. VOL. 42. ISSUE 9. P. 2848-2855 14 88% 3
8 LIU, F , MENG, G , (2014) RANDOM VIBRATION RELIABILITY OF BGA LEAD-FREE SOLDER JOINT.MICROELECTRONICS RELIABILITY. VOL. 54. ISSUE 1. P. 226-232 12 92% 7
9 KIM, YK , HWANG, DS , (2015) PBGA PACKAGING RELIABILITY ASSESSMENTS UNDER RANDOM VIBRATIONS FOR SPACE APPLICATIONS.MICROELECTRONICS RELIABILITY. VOL. 55. ISSUE 1. P. 172 -179 12 80% 6
10 LI, GY , LI, B , XIA, J , CHENG, LX , (2016) OPTIMAL DESIGN FOR VIBRATION RELIABILITY OF PACKAGE-ON-PACKAGE ASSEMBLY USING FEA AND TAGUCHI METHOD.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 10. P. 1482 -1487 15 68% 0

Classes with closest relation at Level 1


Rank Class id link
1 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
2 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
3 33581 ACOUSTIC MICRO IMAGING//OPEN BUMPS//QUALITY SIGNATURE
4 23618 DISCRETE CRACK MODELS//OPT FILMS MAT//AEM GRP
5 25446 MECHANICAL RELIABILITY PREDICTION//NO FAULT FOUND//NO FAULT FOUND NFF
6 34607 ENDICOTT ELECT PACKAGING//PLATED THROUGH HOLE//CYCLE TO FAILURE
7 24771 SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING
8 25993 PROBE CARD//COMPLIANT INTERCONNECTS//MEMS PROBE CARD
9 33029 LASER SOLDERING//INNER LEAD BONDING ILB//THERMAL PERFORMANCE DESIGN
10 17051 FLUIDIC SELF ASSEMBLY//SELF ALIGNMENT//FLUIDIC SELF ASSEMBLY FSA

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