Class information for:
Level 1: CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
10992 1017 19.9 56%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
10992 1                   CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES 1017

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 CONDUCTIVE ADHESIVE authKW 1425233 6% 73% 65
2 ANISOTROPIC CONDUCTIVE FILM ACF authKW 1134439 5% 82% 46
3 ELECTRICALLY CONDUCTIVE ADHESIVES authKW 980746 4% 78% 42
4 ANISOTROPIC CONDUCTIVE FILM authKW 934125 4% 84% 37
5 ANISOTROPIC CONDUCTIVE ADHESIVE authKW 860399 3% 87% 33
6 ANISOTROPIC CONDUCTIVE ADHESIVE ACA authKW 690538 2% 100% 23
7 ISOTROPIC CONDUCTIVE ADHESIVES authKW 374127 2% 69% 18
8 CHIP ON GLASS COG authKW 355534 1% 79% 15
9 ELECTRICALLY CONDUCTIVE ADHESIVES ECAS authKW 300234 1% 100% 10
10 FLIP CHIP authKW 295930 8% 12% 80

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Multidisciplinary 8176 62% 0% 627
2 Engineering, Manufacturing 7840 15% 0% 156
3 Engineering, Electrical & Electronic 6197 46% 0% 467
4 Physics, Applied 2008 30% 0% 306
5 Nanoscience & Nanotechnology 1840 15% 0% 153
6 Engineering, Chemical 670 12% 0% 121
7 Mechanics 617 9% 0% 96
8 Metallurgy & Metallurgical Engineering 525 8% 0% 86
9 Polymer Science 146 6% 0% 58
10 Materials Science, Composites 104 2% 0% 17

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 NANO PACKAGING INTERCONNECT 230945 1% 77% 10
2 KEY STATE NEW DISPLAYS SYST PLICAT 181632 1% 55% 11
3 ELECT PROD 173193 1% 38% 15
4 NTNU NANOMECH 130996 1% 36% 12
5 NSF PACKAGING 96073 0% 80% 4
6 AUTOMAT MECH ENGN 74122 1% 22% 11
7 MODULES COMPONENTS 67551 0% 75% 3
8 SMIT 61956 2% 13% 16
9 MAT SCI ENGN PACKAGING 60047 0% 100% 2
10 MECH AERONAUT ENGN ADV MAT PROC 60047 0% 100% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 127906 7% 6% 70
2 SOLDERING & SURFACE MOUNT TECHNOLOGY 94972 3% 9% 35
3 JOURNAL OF ELECTRONICS MANUFACTURING 79497 2% 13% 20
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 53782 5% 4% 49
5 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 37410 2% 6% 22
6 JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY 32253 6% 2% 60
7 MICROELECTRONICS RELIABILITY 29104 8% 1% 82
8 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 19428 2% 4% 16
9 IEEE TRANSACTIONS ON ADVANCED PACKAGING 18512 2% 2% 25
10 JOURNAL OF ELECTRONIC PACKAGING 16423 3% 2% 26

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 CONDUCTIVE ADHESIVE 1425233 6% 73% 65 Search CONDUCTIVE+ADHESIVE Search CONDUCTIVE+ADHESIVE
2 ANISOTROPIC CONDUCTIVE FILM ACF 1134439 5% 82% 46 Search ANISOTROPIC+CONDUCTIVE+FILM+ACF Search ANISOTROPIC+CONDUCTIVE+FILM+ACF
3 ELECTRICALLY CONDUCTIVE ADHESIVES 980746 4% 78% 42 Search ELECTRICALLY+CONDUCTIVE+ADHESIVES Search ELECTRICALLY+CONDUCTIVE+ADHESIVES
4 ANISOTROPIC CONDUCTIVE FILM 934125 4% 84% 37 Search ANISOTROPIC+CONDUCTIVE+FILM Search ANISOTROPIC+CONDUCTIVE+FILM
5 ANISOTROPIC CONDUCTIVE ADHESIVE 860399 3% 87% 33 Search ANISOTROPIC+CONDUCTIVE+ADHESIVE Search ANISOTROPIC+CONDUCTIVE+ADHESIVE
6 ANISOTROPIC CONDUCTIVE ADHESIVE ACA 690538 2% 100% 23 Search ANISOTROPIC+CONDUCTIVE+ADHESIVE+ACA Search ANISOTROPIC+CONDUCTIVE+ADHESIVE+ACA
7 ISOTROPIC CONDUCTIVE ADHESIVES 374127 2% 69% 18 Search ISOTROPIC+CONDUCTIVE+ADHESIVES Search ISOTROPIC+CONDUCTIVE+ADHESIVES
8 CHIP ON GLASS COG 355534 1% 79% 15 Search CHIP+ON+GLASS+COG Search CHIP+ON+GLASS+COG
9 ELECTRICALLY CONDUCTIVE ADHESIVES ECAS 300234 1% 100% 10 Search ELECTRICALLY+CONDUCTIVE+ADHESIVES+ECAS Search ELECTRICALLY+CONDUCTIVE+ADHESIVES+ECAS
10 FLIP CHIP 295930 8% 12% 80 Search FLIP+CHIP Search FLIP+CHIP

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 KIM, SC , KIM, YH , (2013) FLIP CHIP BONDING WITH ANISOTROPIC CONDUCTIVE FILM (ACF) AND NONCONDUCTIVE ADHESIVE (NCA).CURRENT APPLIED PHYSICS. VOL. 13. ISSUE . P. S14-S25 65 96% 13
2 LIN, YC , ZHONG, J , (2008) A REVIEW OF THE INFLUENCING FACTORS ON ANISOTROPIC CONDUCTIVE ADHESIVES JOINING TECHNOLOGY IN ELECTRICAL APPLICATIONS.JOURNAL OF MATERIALS SCIENCE. VOL. 43. ISSUE 9. P. 3072 -3093 65 84% 71
3 GAO, LL , GAO, H , CHEN, X , (2015) RECENT ADVANCES IN MECHANICAL PROPERTIES OF ANISOTROPIC CONDUCTIVE ADHESIVE FILM FOR MICROELECTRONIC PACKAGING.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 27. ISSUE 4. P. 164 -177 55 82% 1
4 CHEN, X , LIN, YC , (2008) RELIABILITY OF ANISOTROPIC CONDUCTIVE ADHESIVE JOINTS IN ELECTRONIC PACKAGING APPLICATIONS.JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY. VOL. 22. ISSUE 14. P. 1631 -1657 55 89% 12
5 YIM, MJ , LI, Y , MOON, KS , PAIK, KW , WONG, CP , (2008) REVIEW OF RECENT ADVANCES IN ELECTRICALLY CONDUCTIVE ADHESIVE MATERIALS AND TECHNOLOGIES IN ELECTRONIC PACKAGING.JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY. VOL. 22. ISSUE 14. P. 1593 -1630 54 78% 54
6 YIM, MJ , PAIK, KW , (2006) REVIEW OF ELECTRICALLY CONDUCTIVE ADHESIVE TECHNOLOGIES FOR ELECTRONIC PACKAGING.ELECTRONIC MATERIALS LETTERS. VOL. 2. ISSUE 3. P. 183 -194 43 98% 17
7 LI, Y , WONG, CP , (2006) RECENT ADVANCES OF CONDUCTIVE ADHESIVES AS A LEAD-FREE ALTERNATIVE IN ELECTRONIC PACKAGING: MATERIALS, PROCESSING, RELIABILITY AND APPLICATIONS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 51. ISSUE 1-3. P. 1 -35 31 72% 338
8 JI, YH , LIU, Y , HUANG, GW , SHEN, XJ , XIAO, HM , FU, SY , (2015) TERNARY AG/EPOXY ADHESIVE WITH EXCELLENT OVERALL PERFORMANCE.ACS APPLIED MATERIALS & INTERFACES. VOL. 7. ISSUE 15. P. 8041 -8052 31 69% 11
9 GAO, LL , CHEN, X , GAO, H , (2012) MECHANICAL PROPERTIES OF ANISOTROPIC CONDUCTIVE ADHESIVE FILM UNDER HYGROTHERMAL AGING AND THERMAL CYCLING.JOURNAL OF ELECTRONIC MATERIALS. VOL. 41. ISSUE 7. P. 2001 -2009 25 100% 3
10 GAO, H , ZHANG, WG , ZHANG, Z , GAO, LL , CHEN, G , (2016) STUDY ON FATIGUE LIFE AND ELECTRICAL PROPERTY OF COG ASSEMBLY UNDER THERMAL-ELECTRIC-MECHANICAL COUPLED LOADS.MICROELECTRONICS RELIABILITY. VOL. 56. ISSUE . P. 148 -154 24 86% 0

Classes with closest relation at Level 1


Rank Class id link
1 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
2 33029 LASER SOLDERING//INNER LEAD BONDING ILB//THERMAL PERFORMANCE DESIGN
3 20590 DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE
4 24771 SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING
5 31479 PASSIVE INTERMODULATION PIM//PASSIVE INTERMODULATION//PASSIVE INTERMODULATION DISTORTION PIM
6 13066 WIRE BONDING//THERMOSONIC WIRE BONDING//COPPER WIRE BONDING
7 5356 INKJET PRINTING//PRINTED ELECTRONICS//CONDUCTIVE INK
8 20299 ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT
9 19226 MICROWAVE CURING//ELECTRON BEAM CURING//RADIATION CURING
10 8345 THERMAL INTERFACE MATERIAL//THERMAL CONDUCTIVITY//THERMAL PASTE

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