Class information for:
Level 1: ACOUSTIC MICRO IMAGING//OPEN BUMPS//QUALITY SIGNATURE

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
33581 123 15.7 47%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
33581 1                   ACOUSTIC MICRO IMAGING//OPEN BUMPS//QUALITY SIGNATURE 123

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ACOUSTIC MICRO IMAGING authKW 1241284 4% 100% 5
2 OPEN BUMPS authKW 496513 2% 100% 2
3 QUALITY SIGNATURE authKW 496513 2% 100% 2
4 SOLDER BUMP INSPECTION authKW 496513 2% 100% 2
5 FLEX CRACKS authKW 331008 2% 67% 2
6 MICROELECTRONIC PACKAGES authKW 331008 2% 67% 2
7 SOLDER BUMP authKW 304663 7% 14% 9
8 ACOUSTIC GIGAHERTZ MICROSCOPY authKW 248257 1% 100% 1
9 ACOUSTIC MICROIMAGING AMI authKW 248257 1% 100% 1
10 AUTOMATIC VISUAL LOCATION SYSTEM authKW 248257 1% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Characterization, Testing 860 11% 0% 13
2 Engineering, Electrical & Electronic 577 41% 0% 50
3 Acoustics 367 11% 0% 13
4 Engineering, Manufacturing 313 9% 0% 11
5 Audiology & Speech-Language Pathology 294 7% 0% 8
6 Nanoscience & Nanotechnology 292 17% 0% 21
7 Materials Science, Multidisciplinary 177 28% 0% 35
8 Engineering, Mechanical 156 12% 0% 15
9 Physics, Applied 150 24% 0% 30
10 Instruments & Instrumentation 143 11% 0% 14

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECT ULTRASON ENGN GRP 248257 1% 100% 1
2 TAHGSHAN MECHATRON 248257 1% 100% 1
3 TANGSHAN MECHATRON 248257 1% 100% 1
4 GEN ENGN 147769 13% 4% 16
5 PACKAGE ENGN TEAM 124127 1% 50% 1
6 DELPHI ELECT SAFETY 62063 1% 25% 1
7 GWW 62063 1% 25% 1
8 STATE DIGITAL MFG EQUIPMENT TECHNOL 46895 11% 1% 14
9 FRAUNHOFER MECH MAT IWM 35464 1% 14% 1
10 GWW MECH ENGN 22793 2% 3% 3

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON ADVANCED PACKAGING 19872 7% 1% 9
2 MICROELECTRONICS RELIABILITY 8068 12% 0% 15
3 JOURNAL OF ELECTRONIC PACKAGING 7242 5% 0% 6
4 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 5392 4% 0% 5
5 MATERIALS EVALUATION 5385 5% 0% 6
6 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 4629 4% 0% 5
7 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 2555 2% 1% 2
8 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 2510 2% 1% 2
9 NDT & E INTERNATIONAL 2225 3% 0% 4
10 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 1182 3% 0% 4

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ACOUSTIC MICRO IMAGING 1241284 4% 100% 5 Search ACOUSTIC+MICRO+IMAGING Search ACOUSTIC+MICRO+IMAGING
2 OPEN BUMPS 496513 2% 100% 2 Search OPEN+BUMPS Search OPEN+BUMPS
3 QUALITY SIGNATURE 496513 2% 100% 2 Search QUALITY+SIGNATURE Search QUALITY+SIGNATURE
4 SOLDER BUMP INSPECTION 496513 2% 100% 2 Search SOLDER+BUMP+INSPECTION Search SOLDER+BUMP+INSPECTION
5 FLEX CRACKS 331008 2% 67% 2 Search FLEX+CRACKS Search FLEX+CRACKS
6 MICROELECTRONIC PACKAGES 331008 2% 67% 2 Search MICROELECTRONIC+PACKAGES Search MICROELECTRONIC+PACKAGES
7 SOLDER BUMP 304663 7% 14% 9 Search SOLDER+BUMP Search SOLDER+BUMP
8 ACOUSTIC GIGAHERTZ MICROSCOPY 248257 1% 100% 1 Search ACOUSTIC+GIGAHERTZ+MICROSCOPY Search ACOUSTIC+GIGAHERTZ+MICROSCOPY
9 ACOUSTIC MICROIMAGING AMI 248257 1% 100% 1 Search ACOUSTIC+MICROIMAGING+AMI Search ACOUSTIC+MICROIMAGING+AMI
10 AUTOMATIC VISUAL LOCATION SYSTEM 248257 1% 100% 1 Search AUTOMATIC+VISUAL+LOCATION+SYSTEM Search AUTOMATIC+VISUAL+LOCATION+SYSTEM

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 LU, XN , SHI, TL , WANG, SY , LI, LY , SU, L , LIAO, GL , (2015) INTELLIGENT DIAGNOSIS OF THE SOLDER BUMPS DEFECTS USING FUZZY C-MEANS ALGORITHM WITH THE WEIGHTED COEFFICIENTS.SCIENCE CHINA-TECHNOLOGICAL SCIENCES. VOL. 58. ISSUE 10. P. 1689 -1695 10 71% 1
2 LEE, CS , ZHANG, GM , HARVEY, DM , QI, AL , (2016) CHARACTERIZATION OF MICRO-CRACK PROPAGATION THROUGH ANALYSIS OF EDGE EFFECT IN ACOUSTIC MICROIMAGING OF MICROELECTRONIC PACKAGES.NDT & E INTERNATIONAL. VOL. 79. ISSUE . P. 1 -6 6 86% 1
3 ERDAHL, DS , ALLEN, MS , UME, IC , GINSBERG, JH , (2008) STRUCTURAL MODAL ANALYSIS FOR DETECTING OPEN SOLDER BUMPS ON FLIP CHIPS.IEEE TRANSACTIONS ON ADVANCED PACKAGING. VOL. 31. ISSUE 1. P. 118 -126 9 69% 1
4 UME, C , GONG, J , AHMAD, R , VALDES, A , (2011) LASER ULTRASONIC INSPECTION OF SOLDER BUMPS IN FLIP-CHIP PACKAGES USING VIRTUAL CHIP PACKAGE AS REFERENCE.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 1. ISSUE 11. P. 1739-1746 7 78% 3
5 ERDAHL, DS , UME, IC , (2006) DETERMINATION OF MEASUREMENT LIMIT FOR OPEN SOLDER BUMPS ON A FLIP-CHIP PACKAGE USING A LASER ULTRASONIC INSPECTION SYSTEM.IEEE TRANSACTIONS ON ADVANCED PACKAGING. VOL. 29. ISSUE 1. P. 178 -185 6 100% 8
6 ZHANG, YC , SHI, TL , SU, L , WANG, X , HONG, Y , CHEN, KP , LIAO, GL , (2016) SPARSE RECONSTRUCTION FOR MICRO DEFECT DETECTION IN ACOUSTIC MICRO IMAGING.SENSORS. VOL. 16. ISSUE 10. P. - 10 45% 0
7 YANG, L , GONG, J , UME, IC , (2015) FUNDAMENTAL STUDY OF MICROELECTRONIC CHIPS' RESPONSE UNDER LASER EXCITATION AND SIGNAL PROCESSING METHODS.JOURNAL OF NONDESTRUCTIVE EVALUATION. VOL. 34. ISSUE 3. P. - 6 75% 1
8 LEE, CS , ZHANG, GM , HARVEY, DM , MA, HW , (2015) DEVELOPMENT OF C-LINE PLOT TECHNIQUE FOR THE CHARACTERIZATION OF EDGE EFFECTS IN ACOUSTIC IMAGING: A CASE STUDY USING FLIP CHIP PACKAGE GEOMETRY.MICROELECTRONICS RELIABILITY. VOL. 55. ISSUE 12. P. 2762 -2768 5 83% 1
9 WEI, W , WEI, L , NIE, L , SU, L , LU, XN , (2015) USING ACTIVE THERMOGRAPHY AND MODIFIED SVM FOR INTELLIGENT DIAGNOSIS OF SOLDER BUMPS.INFRARED PHYSICS & TECHNOLOGY. VOL. 72. ISSUE . P. 163 -169 5 83% 1
10 SU, L , SHI, TL , LIU, ZP , ZHOU, HD , DU, L , LIAO, GL , (2017) NONDESTRUCTIVE DIAGNOSIS OF FLIP CHIPS BASED ON VIBRATION ANALYSIS USING PCA-RBF.MECHANICAL SYSTEMS AND SIGNAL PROCESSING. VOL. 85. ISSUE . P. 849 -856 9 45% 0

Classes with closest relation at Level 1


Rank Class id link
1 16449 SPLIT SPECTRUM PROCESSING//INSIGHT//MATERIALS EVALUATION
2 30107 KERAM KOMPONENTEN MA INENBAU//DELL SERV FED GOVT INC//MLCC SPECIALTY RD
3 36044 ACID DECAPSULATION//ACOUSTIC BALL BOND INSPECTION//ACOUSTIC GHZ MICROSCOPY
4 16728 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT
5 7791 DEFECT DETECTION//SURFACE INSPECTION//FABRIC DEFECTS
6 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
7 16832 ULTRASONIC REFLECTION//OIL FILM MEASUREMENT//INTERFACIAL STIFFNESS
8 29830 PACKAGE INTEGRITY//CONTAINER CLOSURE INTEGRITY//SEAL INSPECTION
9 35191 LEAST COMMITMENT LEARNING//MEMORY BASED MODELING//PILLOWING DEFORMATION
10 24771 SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING

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