Class information for:
Level 2: ELECTROMIGRATION//ELECTROMIGRATION EM//SOLID STATE DEWETTING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
2485 3937 23.1 58%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2485 2             ELECTROMIGRATION//ELECTROMIGRATION EM//SOLID STATE DEWETTING 3937
2714 1                   ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION 2166
14055 1                   SOLID STATE DEWETTING//MATH DESIGN MAT//SURFACE ENERGY ANISOTROPY 796
15027 1                   ITO AG ITO//LOW EMISSIVITY COATING//AZO AG AZO 735
26984 1                   AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION 240

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECTROMIGRATION authKW 803056 9% 31% 339
2 ELECTROMIGRATION EM authKW 119175 1% 55% 28
3 SOLID STATE DEWETTING authKW 99246 0% 80% 16
4 MATH DESIGN MAT address 69787 0% 100% 9
5 SURFACE ENERGY ANISOTROPY authKW 69072 0% 64% 14
6 SURFACE DIFFUSION authKW 68374 3% 7% 125
7 STRESS INDUCED MIGRATION authKW 67013 0% 79% 11
8 STRESS MIGRATION authKW 64604 0% 56% 15
9 PRC MER address 62544 0% 73% 11
10 STRESS VOIDING authKW 62033 0% 100% 8

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Physics, Applied 31818 57% 0% 2253
2 Materials Science, Coatings & Films 11179 12% 0% 491
3 Materials Science, Multidisciplinary 10601 37% 0% 1473
4 Nanoscience & Nanotechnology 5716 14% 0% 535
5 Physics, Condensed Matter 4374 19% 0% 750
6 Engineering, Electrical & Electronic 3403 19% 0% 755
7 Metallurgy & Metallurgical Engineering 3393 11% 0% 418
8 Materials Science, Ceramics 688 3% 0% 117
9 Optics 183 4% 0% 171
10 Materials Science, Characterization, Testing 101 1% 0% 31

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MATH DESIGN MAT 69787 0% 100% 9
2 PRC MER 62544 0% 73% 11
3 EE PHYS ELECT 38771 0% 100% 5
4 INTERCONNECT PACKAGING 33020 0% 30% 14
5 SUR E EVALUAT 31016 0% 100% 4
6 NSF LOW POWER ELECT 31012 0% 67% 6
7 LOW POWER ELECT 28706 0% 37% 10
8 CRYSTAL GROWTH GRP 28417 0% 33% 11
9 IMMEUBLE CCE 24812 0% 80% 4
10 ADV PROC DEV PROJECT TEAM 23262 0% 100% 3

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROELECTRONICS RELIABILITY 34086 4% 3% 175
2 THIN SOLID FILMS 15631 7% 1% 273
3 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 12126 1% 4% 41
4 JOURNAL OF APPLIED PHYSICS 12016 10% 0% 413
5 MICROELECTRONIC ENGINEERING 7189 2% 1% 98
6 ACTA MATERIALIA 6486 3% 1% 103
7 APPLIED PHYSICS LETTERS 4193 6% 0% 254
8 JOURNAL OF ELECTRONIC MATERIALS 3794 2% 1% 70
9 JOURNAL OF MATERIALS RESEARCH 2670 2% 1% 65
10 SCRIPTA MATERIALIA 2061 1% 1% 54

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ELECTROMIGRATION 803056 9% 31% 339 Search ELECTROMIGRATION Search ELECTROMIGRATION
2 ELECTROMIGRATION EM 119175 1% 55% 28 Search ELECTROMIGRATION+EM Search ELECTROMIGRATION+EM
3 SOLID STATE DEWETTING 99246 0% 80% 16 Search SOLID+STATE+DEWETTING Search SOLID+STATE+DEWETTING
4 SURFACE ENERGY ANISOTROPY 69072 0% 64% 14 Search SURFACE+ENERGY+ANISOTROPY Search SURFACE+ENERGY+ANISOTROPY
5 SURFACE DIFFUSION 68374 3% 7% 125 Search SURFACE+DIFFUSION Search SURFACE+DIFFUSION
6 STRESS INDUCED MIGRATION 67013 0% 79% 11 Search STRESS+INDUCED+MIGRATION Search STRESS+INDUCED+MIGRATION
7 STRESS MIGRATION 64604 0% 56% 15 Search STRESS+MIGRATION Search STRESS+MIGRATION
8 STRESS VOIDING 62033 0% 100% 8 Search STRESS+VOIDING Search STRESS+VOIDING
9 CU INTERCONNECT 61479 1% 27% 29 Search CU+INTERCONNECT Search CU+INTERCONNECT
10 GRAIN BOUNDARY GROOVING 58441 0% 54% 14 Search GRAIN+BOUNDARY+GROOVING Search GRAIN+BOUNDARY+GROOVING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 TAN, CM , ROY, A , (2007) ELECTROMIGRATION IN ULSI INTERCONNECTS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 58. ISSUE 1-2. P. 3-75 116 75% 23
2 LANSAKER, P , PETERSSON, P , NIKLASSON, GA , GRANQVIST, CG , (2013) THIN SPUTTER DEPOSITED GOLD FILMS ON IN2O3:SN, SNO2:IN, TIO2 AND GLASS: OPTICAL, ELECTRICAL AND STRUCTURAL EFFECTS.SOLAR ENERGY MATERIALS AND SOLAR CELLS. VOL. 117. ISSUE . P. 462 -470 76 68% 10
3 OGAWA, ET , LEE, KD , BLASCHKE, VA , HO, PS , (2002) ELECTROMIGRATION RELIABILITY ISSUES IN DUAL-DAMASCENE CU INTERCONNECTIONS.IEEE TRANSACTIONS ON RELIABILITY. VOL. 51. ISSUE 4. P. 403 -419 78 78% 127
4 DE ORIO, RL , CERIC, H , SELBERHERR, S , (2010) PHYSICALLY BASED MODELS OF ELECTROMIGRATION: FROM BLACK'S EQUATION TO MODERN TCAD MODELS.MICROELECTRONICS RELIABILITY. VOL. 50. ISSUE 6. P. 775-789 57 83% 23
5 SELBERHERR, S , CERIC, H , (2011) ELECTROMIGRATION IN SUBMICRON INTERCONNECT FEATURES OF INTEGRATED CIRCUITS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 71. ISSUE 5-6. P. 53 -86 57 79% 15
6 THOMPSON, CV , (2012) SOLID-STATE DEWETTING OF THIN FILMS.ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 42. VOL. 42. ISSUE . P. 399 -434 47 54% 235
7 NIEKIEL, F , SCHWEIZER, P , KRASCHEWSKI, SM , BUTZ, B , SPIECKER, E , (2015) THE PROCESS OF SOLID-STATE DEWETTING OF AU THIN FILMS STUDIED BY IN SITU SCANNING TRANSMISSION ELECTRON MICROSCOPY.ACTA MATERIALIA. VOL. 90. ISSUE . P. 118 -132 52 73% 7
8 BOU, A , TORCHIO, P , BARAKEL, D , THOULON, PY , RICCI, M , (2016) NUMERICAL AND EXPERIMENTAL INVESTIGATION OF TRANSPARENT AND CONDUCTIVE TIOX/AG/TIOX ELECTRODE.THIN SOLID FILMS. VOL. 617. ISSUE . P. 86 -94 47 77% 1
9 LEROY, F , BOROWIK, L , CHEYNIS, F , ALMADORI, Y , CURIOTTO, S , TRAUTMANN, M , BARBE, JC , MULLER, P , (2016) HOW TO CONTROL SOLID STATE DEWETTING: A SHORT REVIEW.SURFACE SCIENCE REPORTS. VOL. 71. ISSUE 2. P. 391 -409 55 53% 4
10 BOU, A , CHALH, M , VEDRAINE, S , LUCAS, B , BARAKEL, D , PERES, L , THOULON, PY , RICCI, M , TORCHIO, P , (2016) OPTICAL ROLE OF THE THIN METAL LAYER IN A TIOX/AG/TIOX TRANSPARENT AND CONDUCTIVE ELECTRODE FOR ORGANIC SOLAR CELLS.RSC ADVANCES. VOL. 6. ISSUE 109. P. 108034 -108044 47 78% 0

Classes with closest relation at Level 2


Rank Class id link
1 3223 EMBEDDED RESISTOR//RESISTIVE FILMS//THIN FILM RESISTOR
2 2189 BLISTER TEST//LIQUID SUBSTRATE//SURFACE WRINKLING
3 527 SURFACE & COATINGS TECHNOLOGY//MATERIALS SCIENCE, COATINGS & FILMS//TITANIUM NITRIDE
4 816 LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY
5 2014 BETA DIKETONATE//DIMETHYLALUMINUM HYDRIDE//CHEMICAL VAPOR DEPOSITION
6 2642 THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA
7 1545 PLASMA POLYMERIZATION//LOW K//PLASMA PROCESSES AND POLYMERS
8 294 GAS SENSOR//SNO2//TIN OXIDE
9 3065 ION BEAM ENGN EXPT//GAS CLUSTER ION BEAM//CLUSTER ION BEAM
10 2536 DIFFUS SOLIDS GRP//KIRKENDALL EFFECT//DICTRA

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