Class information for:
Level 1: LASER SOLDERING//INNER LEAD BONDING ILB//THERMAL PERFORMANCE DESIGN

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
33029 130 14.0 27%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
33029 1                   LASER SOLDERING//INNER LEAD BONDING ILB//THERMAL PERFORMANCE DESIGN 130

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 LASER SOLDERING authKW 861245 8% 33% 11
2 INNER LEAD BONDING ILB authKW 751643 3% 80% 4
3 THERMAL PERFORMANCE DESIGN authKW 469778 2% 100% 2
4 INNER LEAD BONDING authKW 422798 2% 60% 3
5 AUTOMATED DOSIMETRY authKW 234889 1% 100% 1
6 AXIAL INJECTION LINE OF CYCLOTRON authKW 234889 1% 100% 1
7 BEAM POWER DENSITY authKW 234889 1% 100% 1
8 BONDING RECIPE authKW 234889 1% 100% 1
9 CARRIER LIFETIME TUNING authKW 234889 1% 100% 1
10 CO 60 RADIATION FACILITIES authKW 234889 1% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 1461 18% 0% 24
2 Engineering, Electrical & Electronic 517 38% 0% 49
3 Nuclear Science & Technology 156 11% 0% 14
4 Instruments & Instrumentation 114 10% 0% 13
5 Materials Science, Multidisciplinary 96 22% 0% 28
6 Engineering, Industrial 56 4% 0% 5
7 Physics, Atomic, Molecular & Chemical 54 9% 0% 12
8 Engineering, General 38 5% 0% 6
9 Food Science & Technology 34 7% 0% 9
10 Physics, Nuclear 31 5% 0% 7

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 EUROPEAN SALES OFF 234889 1% 100% 1
2 LCDD PROJECT ENGN 234889 1% 100% 1
3 MAT PHYS S 234889 1% 100% 1
4 MODELING RELIABIL PROGRAM 234889 1% 100% 1
5 NA INT ATOM ENERGY AGCY 234889 1% 100% 1
6 RADIAT TECH 234889 1% 100% 1
7 RECH LOUIS BLERIOT 234889 1% 100% 1
8 SPORTS HIGH RIO MAIOR 234889 1% 100% 1
9 TEST FIELD QUAL ASSURANCE 234889 1% 100% 1
10 SPECIAL PROJECT GRP 117443 1% 50% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 11656 6% 1% 8
2 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 9805 3% 1% 4
3 QUALITY PROGRESS 7312 4% 1% 5
4 FOOD TECHNOLOGY 7149 6% 0% 8
5 SOLDERING & SURFACE MOUNT TECHNOLOGY 5457 2% 1% 3
6 ARCHAOLOGISCHES NACHRICHTENBLATT 2863 1% 1% 1
7 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 2375 2% 1% 2
8 RADIATION PHYSICS AND CHEMISTRY 1973 7% 0% 9
9 JOURNAL OF ELECTRONICS MANUFACTURING 1554 1% 1% 1
10 NUKLEONIKA 1423 2% 0% 3

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 LASER SOLDERING 861245 8% 33% 11 Search LASER+SOLDERING Search LASER+SOLDERING
2 INNER LEAD BONDING ILB 751643 3% 80% 4 Search INNER+LEAD+BONDING+ILB Search INNER+LEAD+BONDING+ILB
3 THERMAL PERFORMANCE DESIGN 469778 2% 100% 2 Search THERMAL+PERFORMANCE+DESIGN Search THERMAL+PERFORMANCE+DESIGN
4 INNER LEAD BONDING 422798 2% 60% 3 Search INNER+LEAD+BONDING Search INNER+LEAD+BONDING
5 AUTOMATED DOSIMETRY 234889 1% 100% 1 Search AUTOMATED+DOSIMETRY Search AUTOMATED+DOSIMETRY
6 AXIAL INJECTION LINE OF CYCLOTRON 234889 1% 100% 1 Search AXIAL+INJECTION+LINE+OF+CYCLOTRON Search AXIAL+INJECTION+LINE+OF+CYCLOTRON
7 BEAM POWER DENSITY 234889 1% 100% 1 Search BEAM+POWER+DENSITY Search BEAM+POWER+DENSITY
8 BONDING RECIPE 234889 1% 100% 1 Search BONDING+RECIPE Search BONDING+RECIPE
9 CARRIER LIFETIME TUNING 234889 1% 100% 1 Search CARRIER+LIFETIME+TUNING Search CARRIER+LIFETIME+TUNING
10 CO 60 RADIATION FACILITIES 234889 1% 100% 1 Search CO+60+RADIATION+FACILITIES Search CO+60+RADIATION+FACILITIES

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 LIN, CF , CHEN, CM , DOW, WP , LIU, HH , TIEN, HC , LEE, SF , CHEN, WM , (2014) INTERMETALLIC COMPOUND FORMATION AND MECHANICAL PROPERTY OF INNER LEAD BONDING JOINTS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 4. ISSUE 10. P. 1739 -1744 8 73% 0
2 CHEN, ZH , HE, C , ZHENG, Y , SHI, XL , SONG, T , (2015) A NOVEL THERMODYNAMIC MODEL AND TEMPERATURE CONTROL METHOD OF LASER SOLDERING SYSTEMS.MATHEMATICAL PROBLEMS IN ENGINEERING. VOL. . ISSUE . P. - 7 44% 0
3 LIU, DS , LU, CJ , HUNG, CW , HUANG, YC , (2016) EXPERIMENTAL METHOD AND FINITE-ELEMENT SIMULATION MODEL FOR INVESTIGATION INTO FLIP-CHIP-ON-FILM INNER LEAD BONDING PARAMETERS.IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. VOL. 16. ISSUE 2. P. 194 -199 6 46% 0
4 KORDAS, K , PAP, AE , TOTH, G , PUDAS, M , JAASKELAINEN, J , UUSIMAKI, A , VAHAKANGAS, J , (2006) LASER SOLDERING OF FLIP-CHIPS.OPTICS AND LASERS IN ENGINEERING. VOL. 44. ISSUE 2. P. 112-121 6 55% 11
5 GILBERT, JM , DABESTANI, Z , (2006) LASER SOLDERING CONTROL USING OPTICAL IMAGING.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 18. ISSUE 4. P. 3-11 4 80% 0
6 DRNDAREVIC, V , (2008) CONTROL OF GAMMA IRRADIATION FACILITY WITH IMPROVED SAFETY SYSTEM.JOURNAL OF NUCLEAR SCIENCE AND TECHNOLOGY. VOL. 45. ISSUE 4. P. 361-367 4 67% 0
7 LIU, DM , LU, YF , YUAN, Y , CHEN, T , PREMATILLEKE, L , (2001) PLASTIC BALL GRID ARRAY REFLOW USING A FAST-MODULATED CW LASER.JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS. VOL. 40. ISSUE 1. P. 177 -182 4 80% 0
8 NICOLICS, J , SCHROTTMAYER, D , MUSIEJOVSKY, L , (1994) SELECTION OF IR DETECTORS FOR A FAST LASER SOLDERING PROCESS WITH SIMULTANEOUS SOLDER JOINT QUALIFICATION.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING. VOL. 17. ISSUE 4. P. 596-602 6 67% 3
9 CAMPERI, JA , (1994) VENDOR APPROVAL AND AUDITS IN TOTAL QUALITY MANAGEMENT.FOOD TECHNOLOGY. VOL. 48. ISSUE 9. P. 160-162 4 100% 1
10 XIONG, ZH , ZOU, XJ , WANG, YL , DING, H , (2010) DEVELOPMENT AND ERROR COMPENSATION OF LASER SOLDERING SYSTEM.ASSEMBLY AUTOMATION. VOL. 30. ISSUE 3. P. 213 -220 2 100% 0

Classes with closest relation at Level 1


Rank Class id link
1 10992 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES
2 37614 RESPONSE MODELING METHODOLOGY//DISTRIBUTION FITTING//SHORES APPROXIMATIONS
3 28180 CHANNEL ENTRANCE REGION//EUROPEAN PROGRAMS//EUROPEAN STRATEGY
4 16594 FLUXLESS BONDING//AU SN//AU SN SOLDER
5 26528 SUPPORT WORKERS//GENERIC WORKERS//HEALTH CARE SUPPORT WORKERS
6 26276 GAAS MMIC//POWER SENSOR//MICROWAVE POWER SENSOR
7 16728 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT
8 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
9 34607 ENDICOTT ELECT PACKAGING//PLATED THROUGH HOLE//CYCLE TO FAILURE
10 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER

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