Class information for:
Level 1: UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
8930 1204 18.0 43%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
8930 1                   UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING 1204

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 UNDERFILL authKW 1446054 8% 59% 97
2 FLIP CHIP authKW 414378 9% 16% 103
3 JOURNAL OF ELECTRONIC PACKAGING journal 397465 12% 11% 139
4 FLIP CHIP PACKAGE authKW 298336 2% 59% 20
5 NO FLOW UNDERFILL authKW 292381 1% 82% 14
6 UNDERFILL FLOW authKW 236040 1% 85% 11
7 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES journal 233967 9% 9% 103
8 WARPAGE authKW 202920 4% 19% 43
9 BUMP PITCH authKW 177520 1% 100% 7
10 LEADFRAME authKW 153418 1% 55% 11

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 14635 19% 0% 231
2 Engineering, Electrical & Electronic 9400 52% 0% 621
3 Materials Science, Multidisciplinary 4502 43% 0% 522
4 Nanoscience & Nanotechnology 3270 18% 0% 219
5 Engineering, Mechanical 2516 15% 0% 185
6 Physics, Applied 1333 23% 0% 282
7 Mechanics 781 10% 0% 117
8 Materials Science, Composites 299 2% 0% 30
9 Metallurgy & Metallurgical Engineering 294 6% 0% 74
10 Materials Science, Characterization, Testing 176 2% 0% 20

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ATO INNOVAT 67624 0% 67% 4
2 WORLDWIDE MFG GRP 57058 0% 75% 3
3 BUSINESS TEAM 50720 0% 100% 2
4 LOCTITE ELECT MAT 50720 0% 100% 2
5 MAT EQUIPMENT ENGN 50720 0% 100% 2
6 NEPZ ZONE 50720 0% 100% 2
7 ELECT ASSEMBLY PACKAGING 45279 0% 36% 5
8 MECH RELIABIL MICRO MAT 45080 0% 44% 4
9 ADV CIRCUIT INTERCONNECT RD 33812 0% 67% 2
10 DAIMLERCHRYSLER SIM 33812 0% 67% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF ELECTRONIC PACKAGING 397465 12% 11% 139
2 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 233967 9% 9% 103
3 MICROELECTRONICS RELIABILITY 110969 14% 3% 174
4 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 97582 3% 10% 39
5 SOLDERING & SURFACE MOUNT TECHNOLOGY 94556 3% 10% 38
6 IEEE TRANSACTIONS ON ADVANCED PACKAGING 78558 5% 6% 56
7 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 58769 2% 8% 30
8 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 55632 2% 8% 29
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 51151 4% 4% 52
10 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 15382 2% 2% 28

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 UNDERFILL 1446054 8% 59% 97 Search UNDERFILL Search UNDERFILL
2 FLIP CHIP 414378 9% 16% 103 Search FLIP+CHIP Search FLIP+CHIP
3 FLIP CHIP PACKAGE 298336 2% 59% 20 Search FLIP+CHIP+PACKAGE Search FLIP+CHIP+PACKAGE
4 NO FLOW UNDERFILL 292381 1% 82% 14 Search NO+FLOW+UNDERFILL Search NO+FLOW+UNDERFILL
5 UNDERFILL FLOW 236040 1% 85% 11 Search UNDERFILL+FLOW Search UNDERFILL+FLOW
6 WARPAGE 202920 4% 19% 43 Search WARPAGE Search WARPAGE
7 BUMP PITCH 177520 1% 100% 7 Search BUMP+PITCH Search BUMP+PITCH
8 LEADFRAME 153418 1% 55% 11 Search LEADFRAME Search LEADFRAME
9 EPOXY MOLDING COMPOUND 133917 1% 41% 13 Search EPOXY+MOLDING+COMPOUND Search EPOXY+MOLDING+COMPOUND
10 CASTRO MACOSKO MODEL 126800 0% 100% 5 Search CASTRO+MACOSKO+MODEL Search CASTRO+MACOSKO+MODEL

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 KHOR, CY , ABDULLAH, MZ , LAU, CS , AZID, IA , (2014) RECENT FLUID-STRUCTURE INTERACTION MODELING CHALLENGES IN IC ENCAPSULATION - A REVIEW.MICROELECTRONICS RELIABILITY. VOL. 54. ISSUE 8. P. 1511 -1526 46 79% 0
2 KHOR, CY , ABDULLAH, MZ , LAU, CS , LEONG, WC , AZIZ, MSA , (2014) INFLUENCE OF SOLDER BUMP ARRANGEMENTS ON MOLDED IC ENCAPSULATION.MICROELECTRONICS RELIABILITY. VOL. 54. ISSUE 4. P. 796 -807 26 90% 2
3 LAU, CS , KHOR, CY , SOARES, D , TEIXEIRA, JC , ABDULLAH, MZ , (2016) THERMO- MECHANICAL CHALLENGES OF REFLOWED LEAD-FREE SOLDER JOINTS IN SURFACE MOUNT COMPONENTS: A REVIEW.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 28. ISSUE 2. P. 41 -62 40 47% 2
4 AZIZ, MSA , ABDULLAH, MZ , KHOR, CY , (2014) INFLUENCE OF PTH OFFSET ANGLE IN WAVE SOLDERING WITH THERMAL-COUPLING METHOD.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 26. ISSUE 3. P. 97 -109 21 95% 8
5 YANG, SY , JEON, YD , LEE, SB , PAIK, KW , (2006) SOLDER REFLOW PROCESS INDUCED RESIDUAL WARPAGE MEASUREMENT AND ITS INFLUENCE ON RELIABILITY OF FLIP-CHIP ELECTRONIC PACKAGES.MICROELECTRONICS RELIABILITY. VOL. 46. ISSUE 2-4. P. 512-522 30 81% 21
6 KHOR, CY , ABDULLAH, MZ , ANI, FC , (2012) UNDERFILL PROCESS FOR TWO PARALLEL PLATES AND FLIP CHIP PACKAGING.INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER. VOL. 39. ISSUE 8. P. 1205-1212 21 100% 0
7 KHOR, CY , ABDULLAH, MZ , (2012) OPTIMIZATION OF IC ENCAPSULATION CONSIDERING FLUID/STRUCTURE INTERACTION USING RESPONSE SURFACE METHODOLOGY.SIMULATION MODELLING PRACTICE AND THEORY. VOL. 29. ISSUE . P. 109 -122 24 86% 2
8 KHOR, CY , MUJEEBU, MA , ABDULLAH, MZ , ANI, FC , (2010) FINITE VOLUME BASED CFD SIMULATION OF PRESSURIZED FLIP-CHIP UNDERFILL ENCAPSULATION PROCESS.MICROELECTRONICS RELIABILITY. VOL. 50. ISSUE 1. P. 98 -105 24 86% 6
9 KHOR, CY , ABDULLAH, MZ , (2013) ANALYSIS OF FLUID/STRUCTURE INTERACTION: INFLUENCE OF SILICON CHIP THICKNESS IN MOULDED PACKAGING.MICROELECTRONICS RELIABILITY. VOL. 53. ISSUE 2. P. 334-347 22 88% 1
10 KANG, S , UME, IC , (2013) TECHNIQUES FOR MEASURING WARPAGE OF CHIP PACKAGES, PWBS, AND PWB ASSEMBLIES.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 3. ISSUE 9. P. 1533 -1544 23 77% 0

Classes with closest relation at Level 1


Rank Class id link
1 16728 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT
2 33581 ACOUSTIC MICRO IMAGING//OPEN BUMPS//QUALITY SIGNATURE
3 23618 DISCRETE CRACK MODELS//OPT FILMS MAT//AEM GRP
4 10992 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES
5 17895 MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//GEOMETRIC PHASE ANALYSIS
6 13066 WIRE BONDING//THERMOSONIC WIRE BONDING//COPPER WIRE BONDING
7 24771 SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING
8 37119 2K X 2K//CHINA SCI TECHNOL INFRARED DETECTO//DEBYE CHARACTERISTIC TEMPERATURE
9 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
10 34607 ENDICOTT ELECT PACKAGING//PLATED THROUGH HOLE//CYCLE TO FAILURE

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