Class information for:
Level 1: SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
24771 302 18.9 36%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
24771 1                   SOLDER PASTE//ELECT MFG ENGN GRP//STENCIL PRINTING 302

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SOLDER PASTE authKW 1899075 12% 52% 36
2 ELECT MFG ENGN GRP address 1140632 6% 59% 19
3 STENCIL PRINTING authKW 1123427 7% 56% 20
4 SURFACE MOUNT TECHNOLOGY authKW 559957 8% 23% 24
5 PCBA REWORK authKW 505550 2% 100% 5
6 AERONAUT MECH MFG ENGN address 497766 3% 62% 8
7 SOLDERING & SURFACE MOUNT TECHNOLOGY journal 460799 14% 11% 42
8 AUTOMATED PCBA REWORK authKW 404440 1% 100% 4
9 CARBON GRAPHITE PASTE authKW 303330 1% 100% 3
10 SURFACE MOUNT REWORK authKW 303330 1% 100% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 14174 37% 0% 113
2 Engineering, Electrical & Electronic 1793 45% 0% 137
3 Materials Science, Multidisciplinary 879 39% 0% 117
4 Engineering, Industrial 656 8% 0% 25
5 Metallurgy & Metallurgical Engineering 495 14% 0% 43
6 Operations Research & Management Science 306 8% 0% 23
7 Computer Science, Interdisciplinary Applications 151 7% 0% 20
8 Engineering, Mechanical 134 8% 0% 23
9 Nanoscience & Nanotechnology 97 7% 0% 21
10 Physics, Applied 69 13% 0% 38

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECT MFG ENGN GRP 1140632 6% 59% 19
2 AERONAUT MECH MFG ENGN 497766 3% 62% 8
3 BOARD ASSEMBLY 134812 1% 67% 2
4 WINFUL 134812 1% 67% 2
5 ADV SEMICOND PACKAGING ASPAC 101110 0% 100% 1
6 ADV SEMICOND PACKAGING ASPAC GRP 101110 0% 100% 1
7 ALPHA SERV PROD DEV GRP 101110 0% 100% 1
8 ALPHA SERVER PROD DEV GRP 101110 0% 100% 1
9 CERAM MFG 101110 0% 100% 1
10 DOMAINE LORGERIE 101110 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SOLDERING & SURFACE MOUNT TECHNOLOGY 460799 14% 11% 42
2 JOURNAL OF ELECTRONICS MANUFACTURING 66942 3% 7% 10
3 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 65499 5% 4% 16
4 CIRCUIT WORLD 12693 2% 3% 5
5 EE-EVALUATION ENGINEERING 10105 1% 3% 3
6 JOURNAL OF ELECTRONIC PACKAGING 5237 3% 1% 8
7 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 5008 3% 1% 8
8 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 4820 3% 1% 8
9 SIEMENS REVIEW 4813 0% 5% 1
10 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 4216 1% 1% 4

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 SOLDER PASTE 1899075 12% 52% 36 Search SOLDER+PASTE Search SOLDER+PASTE
2 STENCIL PRINTING 1123427 7% 56% 20 Search STENCIL+PRINTING Search STENCIL+PRINTING
3 SURFACE MOUNT TECHNOLOGY 559957 8% 23% 24 Search SURFACE+MOUNT+TECHNOLOGY Search SURFACE+MOUNT+TECHNOLOGY
4 PCBA REWORK 505550 2% 100% 5 Search PCBA+REWORK Search PCBA+REWORK
5 AUTOMATED PCBA REWORK 404440 1% 100% 4 Search AUTOMATED+PCBA+REWORK Search AUTOMATED+PCBA+REWORK
6 CARBON GRAPHITE PASTE 303330 1% 100% 3 Search CARBON+GRAPHITE+PASTE Search CARBON+GRAPHITE+PASTE
7 SURFACE MOUNT REWORK 303330 1% 100% 3 Search SURFACE+MOUNT+REWORK Search SURFACE+MOUNT+REWORK
8 CHIPSCALE PACKAGING 227496 1% 75% 3 Search CHIPSCALE+PACKAGING Search CHIPSCALE+PACKAGING
9 AUTOMATED REWORK 202220 1% 100% 2 Search AUTOMATED+REWORK Search AUTOMATED+REWORK
10 ROBOTIC REWORK 202220 1% 100% 2 Search ROBOTIC+REWORK Search ROBOTIC+REWORK

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 HUANG, CY , LIN, YH , YING, KC , KU, CL , (2011) THE SOLDER PASTE PRINTING PROCESS: CRITICAL PARAMETERS, DEFECT SCENARIOS, SPECIFICATIONS, AND COST REDUCTION.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 23. ISSUE 4. P. 211 -223 11 92% 0
2 HUANG, JCY , (2010) REDUCING SOLDER PASTE INSPECTION IN SURFACE-MOUNT ASSEMBLY THROUGH MAHALANOBIS-TAGUCHI ANALYSIS.IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING. VOL. 33. ISSUE 4. P. 265 -274 13 72% 4
3 KAY, R , DESMULLIEZ, M , (2012) A REVIEW OF STENCIL PRINTING FOR MICROELECTRONIC PACKAGING.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 24. ISSUE 1. P. 38 -50 12 71% 9
4 RODRIGUEZ, G , BALDWIN, DF , (1999) ANALYSIS OF SOLDER PASTE RELEASE IN FINE PITCH STENCIL PRINTING PROCESSES.JOURNAL OF ELECTRONIC PACKAGING. VOL. 121. ISSUE 3. P. 169 -178 12 100% 4
5 SEO, WS , KIM, JB , (2013) FILLING ANALYSES OF SOLDER PASTE IN THE STENCIL PRINTING PROCESS AND ITS APPLICATION TO PROCESS DESIGN.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 25. ISSUE 3. P. 145-154 10 77% 2
6 KAY, RW , CUMMINS, G , KREBS, T , LATHROP, R , ABRAHAM, E , DESMULLIEZ, M , (2014) STATISTICAL ANALYSIS OF STENCIL TECHNOLOGY FOR WAFER-LEVEL BUMPING.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 26. ISSUE 2. P. 71-78 8 89% 0
7 KUMAR, S , MALLIK, S , EKERE, N , JUNG, J , (2013) STENCIL PRINTING BEHAVIOR OF LEAD-FREE SN-3AG-0.5CU SOLDER PASTE FOR WAFER LEVEL BUMPING FOR SUB-100 MU M SIZE SOLDER BUMPS.METALS AND MATERIALS INTERNATIONAL. VOL. 19. ISSUE 5. P. 1083 -1090 8 80% 10
8 AMALU, EH , EKERE, NN , MALLIK, S , (2011) EVALUATION OF RHEOLOGICAL PROPERTIES OF LEAD-FREE SOLDER PASTES AND THEIR RELATIONSHIP WITH TRANSFER EFFICIENCY DURING STENCIL PRINTING PROCESS.MATERIALS & DESIGN. VOL. 32. ISSUE 6. P. 3189-3197 8 80% 5
9 MARANI, D , GADEA, C , HJELM, J , HJALMARSSON, P , WANDEL, M , KIEBACH, R , (2015) INFLUENCE OF HYDROXYL CONTENT OF BINDERS ON RHEOLOGICAL PROPERTIES OF CERIUM-GADOLINIUM OXIDE (CGO) SCREEN PRINTING INKS.JOURNAL OF THE EUROPEAN CERAMIC SOCIETY. VOL. 35. ISSUE 5. P. 1495 -1504 10 53% 3
10 DURAIRAJ, R , RAMESH, S , MALLIK, S , SEMAN, A , EKERE, N , (2009) RHEOLOGICAL CHARACTERISATION AND PRINTING PERFORMANCE OF SN/AG/CU SOLDER PASTES.MATERIALS & DESIGN. VOL. 30. ISSUE 9. P. 3812-3818 6 100% 20

Classes with closest relation at Level 1


Rank Class id link
1 35164 JETTING DISPENSER//TIME PRESSURE DISPENSING//PIEZOSTACK ACTUATOR
2 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
3 16728 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT
4 36472 FUZZY FEEDBACK SYSTEMS//N 15 SEPARATION PLANT//SOLUTIONS OF ACRYLIC ACID
5 10992 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES
6 33581 ACOUSTIC MICRO IMAGING//OPEN BUMPS//QUALITY SIGNATURE
7 23937 PCB ASSEMBLY//PRINTED CIRCUIT BOARD ASSEMBLY//FEEDER ARRANGEMENT
8 20976 SILVER PASTE//SILVER PASTES//LEAD FREE GLASS
9 30107 KERAM KOMPONENTEN MA INENBAU//DELL SERV FED GOVT INC//MLCC SPECIALTY RD
10 33635 OBISESAN//AFRICAN AND CARIBBEAN TRAVEL WRITING//ALFRED MANGENA

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