Class information for:
Level 1: FLUXLESS BONDING//AU SN//AU SN SOLDER

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
16594 646 21.0 45%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
16594 1                   FLUXLESS BONDING//AU SN//AU SN SOLDER 646

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 FLUXLESS BONDING authKW 347299 2% 57% 13
2 AU SN authKW 340313 2% 60% 12
3 AU SN SOLDER authKW 257340 1% 78% 7
4 DIFFUSION SOLDERING authKW 197204 2% 38% 11
5 REACTIVE DIFFUSION authKW 182815 3% 18% 21
6 FLUXLESS authKW 174018 1% 41% 9
7 FLUXLESS SOLDERING authKW 168200 2% 32% 11
8 BULK DIFFUSION authKW 167775 4% 15% 23
9 AU IN SB SYSTEM authKW 141801 0% 100% 3
10 INTERDIFFUSION IN NANOSCALE SOLIDS authKW 141801 0% 100% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Metallurgy & Metallurgical Engineering 5851 32% 0% 207
2 Materials Science, Multidisciplinary 5848 65% 0% 421
3 Physics, Applied 977 27% 0% 173
4 Engineering, Electrical & Electronic 859 23% 0% 149
5 Materials Science, Coatings & Films 822 9% 0% 55
6 Engineering, Manufacturing 726 6% 0% 39
7 Chemistry, Physical 703 24% 0% 155
8 Thermodynamics 489 8% 0% 49
9 Nanoscience & Nanotechnology 318 8% 0% 54
10 Physics, Condensed Matter 298 13% 0% 85

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IMR SPEME 94534 0% 100% 2
2 VJ 12 63021 0% 67% 2
3 DESIGN SYST DEV 47267 0% 100% 1
4 ELE PLATING CHEM SERV BUSINESS UNIT 47267 0% 100% 1
5 ESTABLISSEMENT MARCOUSSIS 47267 0% 100% 1
6 HOCHSTFREQUENZTECHN 47267 0% 100% 1
7 HORLOGERIE CREAT 47267 0% 100% 1
8 M MCM GRP 47267 0% 100% 1
9 METEOROL PLA 47267 0% 100% 1
10 MICROSCOPY MICROSYST TECHNOL 47267 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 17719 3% 2% 22
2 JOURNAL OF ELECTRONIC MATERIALS 16910 9% 1% 59
3 IEEE TRANSACTIONS ON ADVANCED PACKAGING 4655 2% 1% 10
4 CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY 4170 2% 1% 12
5 MATERIALS TRANSACTIONS 3778 4% 0% 24
6 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 3314 1% 1% 9
7 JOURNAL OF ALLOYS AND COMPOUNDS 3109 8% 0% 52
8 THERMOCHIMICA ACTA 2074 4% 0% 27
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 1967 1% 1% 4
10 PLATING AND SURFACE FINISHING 1645 1% 1% 7

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 FLUXLESS BONDING 347299 2% 57% 13 Search FLUXLESS+BONDING Search FLUXLESS+BONDING
2 AU SN 340313 2% 60% 12 Search AU+SN Search AU+SN
3 AU SN SOLDER 257340 1% 78% 7 Search AU+SN+SOLDER Search AU+SN+SOLDER
4 DIFFUSION SOLDERING 197204 2% 38% 11 Search DIFFUSION+SOLDERING Search DIFFUSION+SOLDERING
5 REACTIVE DIFFUSION 182815 3% 18% 21 Search REACTIVE+DIFFUSION Search REACTIVE+DIFFUSION
6 FLUXLESS 174018 1% 41% 9 Search FLUXLESS Search FLUXLESS
7 FLUXLESS SOLDERING 168200 2% 32% 11 Search FLUXLESS+SOLDERING Search FLUXLESS+SOLDERING
8 BULK DIFFUSION 167775 4% 15% 23 Search BULK+DIFFUSION Search BULK+DIFFUSION
9 AU IN SB SYSTEM 141801 0% 100% 3 Search AU+IN+SB+SYSTEM Search AU+IN+SB+SYSTEM
10 INTERDIFFUSION IN NANOSCALE SOLIDS 141801 0% 100% 3 Search INTERDIFFUSION+IN+NANOSCALE+SOLIDS Search INTERDIFFUSION+IN+NANOSCALE+SOLIDS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 WANG, J , LIU, YJ , TANG, CV , LIU, LB , ZHOU, HY , JIN, ZP , (2011) THERMODYNAMIC DESCRIPTION OF THE AU-AG-GE TERNARY SYSTEM.THERMOCHIMICA ACTA. VOL. 512. ISSUE 1-2. P. 240 -246 27 79% 11
2 MEGURO, K , O, M , KAJIHARA, M , (2012) GROWTH BEHAVIOR OF COMPOUNDS DUE TO SOLID-STATE REACTIVE DIFFUSION BETWEEN CU AND AL.JOURNAL OF MATERIALS SCIENCE. VOL. 47. ISSUE 12. P. 4955 -4964 26 81% 5
3 NAKANE, A , SUZUKI, T , MINHO, O , KAJIHARA, M , (2016) OBSERVATION ON ISOTHERMAL REACTIVE DIFFUSION BETWEEN SOLID NI AND LIQUID SN.MATERIALS TRANSACTIONS. VOL. 57. ISSUE 6. P. 838 -845 26 70% 0
4 VUORINEN, V , RAUTIAINEN, A , HEIKKINEN, H , PAULASTO-KROCKEL, M , (2016) OPTIMIZATION OF CONTACT METALLIZATIONS FOR RELIABLE WAFER LEVEL AU-SN BONDS.MICROELECTRONICS RELIABILITY. VOL. 64. ISSUE . P. 676 -680 18 100% 0
5 WANG, J , MENG, FG , RONG, MH , LIU, LB , JIN, ZP , (2010) THERMODYNAMIC DESCRIPTION OF THE AU-AG-PB TERNARY SYSTEM.THERMOCHIMICA ACTA. VOL. 505. ISSUE 1-2. P. 79 -85 24 83% 0
6 YOON, JW , CHUN, HS , NOH, BI , KOO, JM , KIM, JW , LEE, HJ , JUNG, SB , (2008) MECHANICAL RELIABILITY OF SN-RICH AU-SN/NI FLIP CHIP SOLDER JOINTS FABRICATED BY SEQUENTIAL ELECTROPLATING METHOD.MICROELECTRONICS RELIABILITY. VOL. 48. ISSUE 11-12. P. 1857-1863 22 88% 14
7 TANAKA, Y , KAJIHARA, M , WATANABE, Y , (2007) GROWTH BEHAVIOR OF COMPOUND LAYERS DURING REACTIVE DIFFUSION BETWEEN SOLID CU AND LIQUID AL.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING. VOL. 445. ISSUE . P. 355 -363 23 82% 35
8 TANAKA, Y , KAJIHARA, M , (2009) MORPHOLOGY OF COMPOUNDS FORMED BY ISOTHERMAL REACTIVE DIFFUSION BETWEEN SOLID FE AND LIQUID AL.MATERIALS TRANSACTIONS. VOL. 50. ISSUE 9. P. 2212 -2220 32 58% 10
9 KAJIHARA, M , (2009) NUMERICAL ANALYSIS FOR MIGRATION OF AUSTENITE/FERRITE INTERFACE DURING CARBURIZATION OF FE.JOURNAL OF MATERIALS SCIENCE. VOL. 44. ISSUE 8. P. 2109 -2118 30 61% 12
10 TANAKA, Y , KAJIHARA, M , (2007) NUMERICAL ANALYSIS FOR MIGRATION OF INTERFACE BETWEEN LIQUID AND SOLID PHASES DURING REACTIVE DIFFUSION IN THE BINARY CU-AL SYSTEM.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING. VOL. 459. ISSUE 1-2. P. 101 -110 22 88% 9

Classes with closest relation at Level 1


Rank Class id link
1 20590 DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE
2 10756 CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY//GENERAL SOLUTION MODEL//ALLOY THERMODYNAMICS
3 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
4 37119 2K X 2K//CHINA SCI TECHNOL INFRARED DETECTO//DEBYE CHARACTERISTIC TEMPERATURE
5 32024 AUAL2//PTAL2//PTGA2
6 22642 LEAD FREE SOLDERING ALLOYS//EDSHAMMAR POLYHEDRON//FERRIMAGNETIC CURIE TEMPERATURE
7 24402 PHYS CHIM ANAL MAT//SE SN TE SYSTEM//CA SB
8 5504 WAFER BONDING//ANODIC BONDING//DIRECT BONDING
9 33029 LASER SOLDERING//INNER LEAD BONDING ILB//THERMAL PERFORMANCE DESIGN
10 37369 BOUNDARY CONDITIONS FOR DIFFUSION//RATE OF FREE ENERGY CHANGE//MO NB ALLOY SINGLE CRYSTAL

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