Class information for:
Level 1: ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
20299 467 20.2 34%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
20299 1                   ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT 467

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECTROCHEMICAL MIGRATION authKW 1765383 8% 75% 36
2 ELECTROCHEMICAL MIGRATION ECM authKW 653852 2% 100% 10
3 CONDUCTIVE ANODIC FILAMENT authKW 392311 1% 100% 6
4 SURFACE INSULATION RESISTANCE authKW 266984 1% 58% 7
5 PLASTIC ENCAPSULATED MICROCIRCUIT authKW 246445 1% 54% 7
6 NO CLEAN FLUX authKW 209231 1% 80% 4
7 SOLDER FLUX authKW 209231 1% 80% 4
8 SURFACE INSULATION RESISTANCE SIR authKW 209231 1% 80% 4
9 DORMANT STORAGE authKW 196156 1% 100% 3
10 NEUROLOGICAL PROSTHESES authKW 196156 1% 100% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 3847 16% 0% 74
2 Engineering, Electrical & Electronic 3554 51% 0% 238
3 Materials Science, Multidisciplinary 1775 44% 0% 204
4 Physics, Applied 680 26% 0% 123
5 Nanoscience & Nanotechnology 457 11% 0% 53
6 Medical Informatics 426 4% 0% 18
7 Metallurgy & Metallurgical Engineering 263 9% 0% 41
8 Engineering, Biomedical 241 6% 0% 29
9 Electrochemistry 240 7% 0% 31
10 Materials Science, Coatings & Films 218 5% 0% 25

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 PROD ASSURANCE PONSE 147115 1% 75% 3
2 HYBRID MICROCIRCUITS GRP 87179 0% 67% 2
3 ADV DEV TEAM ACI 2 65385 0% 100% 1
4 BUSINESS UNIT MANAGEMENT 65385 0% 100% 1
5 CBNERRVA 65385 0% 100% 1
6 ELECT CORROS CELCORR 65385 0% 100% 1
7 ELECT FIBER OPT 65385 0% 100% 1
8 ELECT INTERCONNECT TEAM 65385 0% 100% 1
9 FIELD ELECT INTERCONNECT 65385 0% 100% 1
10 INS GEN AVIAT 65385 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 112049 10% 4% 47
2 ELECTROCOMPONENT SCIENCE AND TECHNOLOGY 12908 1% 5% 4
3 MICROELECTRONICS RELIABILITY 10257 7% 0% 33
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 8244 1% 2% 7
5 CIRCUIT WORLD 8204 1% 3% 5
6 JOURNAL OF THE IEST 7469 0% 6% 2
7 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 7386 2% 1% 11
8 JOHNS HOPKINS APL TECHNICAL DIGEST 6896 2% 1% 9
9 SOLDERING & SURFACE MOUNT TECHNOLOGY 6071 1% 2% 6
10 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 5671 2% 1% 10

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ELECTROCHEMICAL MIGRATION 1765383 8% 75% 36 Search ELECTROCHEMICAL+MIGRATION Search ELECTROCHEMICAL+MIGRATION
2 ELECTROCHEMICAL MIGRATION ECM 653852 2% 100% 10 Search ELECTROCHEMICAL+MIGRATION+ECM Search ELECTROCHEMICAL+MIGRATION+ECM
3 CONDUCTIVE ANODIC FILAMENT 392311 1% 100% 6 Search CONDUCTIVE+ANODIC+FILAMENT Search CONDUCTIVE+ANODIC+FILAMENT
4 SURFACE INSULATION RESISTANCE 266984 1% 58% 7 Search SURFACE+INSULATION+RESISTANCE Search SURFACE+INSULATION+RESISTANCE
5 PLASTIC ENCAPSULATED MICROCIRCUIT 246445 1% 54% 7 Search PLASTIC+ENCAPSULATED+MICROCIRCUIT Search PLASTIC+ENCAPSULATED+MICROCIRCUIT
6 NO CLEAN FLUX 209231 1% 80% 4 Search NO+CLEAN+FLUX Search NO+CLEAN+FLUX
7 SOLDER FLUX 209231 1% 80% 4 Search SOLDER+FLUX Search SOLDER+FLUX
8 SURFACE INSULATION RESISTANCE SIR 209231 1% 80% 4 Search SURFACE+INSULATION+RESISTANCE+SIR Search SURFACE+INSULATION+RESISTANCE+SIR
9 DORMANT STORAGE 196156 1% 100% 3 Search DORMANT+STORAGE Search DORMANT+STORAGE
10 NEUROLOGICAL PROSTHESES 196156 1% 100% 3 Search NEUROLOGICAL+PROSTHESES Search NEUROLOGICAL+PROSTHESES

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 ZHONG, XK , YU, SY , CHEN, LJ , HU, JY , ZHANG, Z , (2017) TEST METHODS FOR ELECTROCHEMICAL MIGRATION: A REVIEW.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 28. ISSUE 2. P. 2279 -2289 50 66% 0
2 MEDGYES, B , ILLES, B , HARSANYI, G , (2013) EFFECT OF WATER CONDENSATION ON ELECTROCHEMICAL MIGRATION IN CASE OF FR4 AND POLYIMIDE SUBSTRATES.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 24. ISSUE 7. P. 2315 -2321 20 95% 2
3 MEDGYES, B , ILLES, B , BERENYI, R , HARSANYI, G , (2011) IN SITU OPTICAL INSPECTION OF ELECTROCHEMICAL MIGRATION DURING THB TESTS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 22. ISSUE 6. P. 694 -700 20 95% 10
4 ZHENG, YN , MEI, YH , LONG, F , LI, X , YAN, CY , LU, GQ , (2016) ELECTROCHEMICAL MIGRATION OF SINTERED NANOSILVER UNDER CHLORIDE-CONTAINING THIN ELECTROLYTE LAYER FOR POWER ELECTRONIC PACKAGING.CORROSION. VOL. 72. ISSUE 4. P. 547 -559 25 66% 0
5 VERDINGOVAS, V , JELLESEN, MS , AMBAT, R , (2015) EFFECT OF PULSED VOLTAGE ON ELECTROCHEMICAL MIGRATION OF TIN IN ELECTRONICS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 26. ISSUE 10. P. 7997 -8007 18 82% 2
6 ZHONG, XK , GUO, XP , QIU, YB , CHEN, ZY , ZHANG, GA , (2013) IN SITU STUDY THE ELECTROCHEMICAL MIGRATION OF TIN UNDER UNIPOLAR SQUARE WAVE ELECTRIC FIELD.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 160. ISSUE 11. P. D495 -D500 20 77% 4
7 ZHONG, XK , ZHANG, GA , QIU, YB , CHEN, ZY , GUO, XP , (2013) ELECTROCHEMICAL MIGRATION OF TIN IN THIN ELECTROLYTE LAYER CONTAINING CHLORIDE IONS.CORROSION SCIENCE. VOL. 74. ISSUE . P. 71-82 18 72% 7
8 CONSEIL, H , VERDINGOVAS, V , JELLESEN, MS , AMBAT, R , (2016) DECOMPOSITION OF NO-CLEAN SOLDER FLUX SYSTEMS AND THEIR EFFECTS ON THE CORROSION RELIABILITY OF ELECTRONICS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. VOL. 27. ISSUE 1. P. 23 -32 13 87% 0
9 VANHOESTENBERGHE, A , DONALDSON, N , (2013) CORROSION OF SILICON INTEGRATED CIRCUITS AND LIFETIME PREDICTIONS IN IMPLANTABLE ELECTRONIC DEVICES.JOURNAL OF NEURAL ENGINEERING. VOL. 10. ISSUE 3. P. - 19 58% 13
10 LIAO, BK , CHEN, ZY , QIU, YB , ZHANG, GA , GUO, XP , (2016) EFFECT OF CITRATE IONS ON THE ELECTROCHEMICAL MIGRATION OF TIN IN THIN ELECTROLYTE LAYER CONTAINING CHLORIDE IONS.CORROSION SCIENCE. VOL. 112. ISSUE . P. 393 -401 19 58% 0

Classes with closest relation at Level 1


Rank Class id link
1 37496 NONHERMETIC//OPTICAL TRANSCEIVER MODULES//PLASTIC OPTICAL TRANSCEIVER MODULES
2 25446 MECHANICAL RELIABILITY PREDICTION//NO FAULT FOUND//NO FAULT FOUND NFF
3 20590 DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE
4 21469 TIN WHISKERS//SN WHISKER//WHISKER GROWTH
5 33587 BALLISTIC CARRIER TRANSPORT//ELE ON TELECOMMUN RENNESUMR 6164//ELE ONS SEMICOND PLICAT ELSA
6 10120 ATMOSPHERIC CORROSION//CORROS SCI//BRONZE
7 37661 POLLUTION LOAD RUNOFF//SOFT INTERVENTION//SATELLITE INFORMAT EARTH ENVIRONM
8 37548 NEAR COMMON PATH WAVEFRONT DIVISION PHASE SHIFT INTERFEROMETER//ONE SHOT FOURIER SPECTROSCOPY//RELATIVE INCLINATION PHASE SHIFTER
9 28154 TIN PEST//DANISH CONSERVAT//GOART
10 27318 NI PASTE//MULTILAYER CERAMIC DEVICES//END TERMINATION

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