Class information for:
Level 1: TIN WHISKERS//SN WHISKER//WHISKER GROWTH

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
21469 417 23.8 49%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
21469 1                   TIN WHISKERS//SN WHISKER//WHISKER GROWTH 417

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 TIN WHISKERS authKW 5309532 21% 84% 86
2 SN WHISKER authKW 1664381 7% 78% 29
3 WHISKER GROWTH authKW 1076401 5% 70% 21
4 TIN PLATING authKW 551994 3% 54% 14
5 METAL WHISKERS authKW 448504 2% 88% 7
6 AUTOMOT ELECT ENGN ASSEMBLY INTERCONNECT TECHNOL address 219676 1% 100% 3
7 ELECTROPLATED TIN authKW 219676 1% 100% 3
8 SN PLATING authKW 219676 1% 100% 3
9 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING journal 201819 8% 8% 33
10 WHISKER authKW 195942 12% 5% 52

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Multidisciplinary 2892 58% 0% 240
2 Metallurgy & Metallurgical Engineering 2868 28% 0% 117
3 Engineering, Manufacturing 1864 12% 0% 49
4 Physics, Applied 1641 41% 0% 171
5 Engineering, Electrical & Electronic 1058 31% 0% 128
6 Nanoscience & Nanotechnology 421 12% 0% 48
7 Materials Science, Coatings & Films 370 7% 0% 30
8 Mining & Mineral Processing 131 2% 0% 8
9 Mineralogy 62 2% 0% 8
10 Physics, Condensed Matter 59 8% 0% 35

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 AUTOMOT ELECT ENGN ASSEMBLY INTERCONNECT TECHNOL 219676 1% 100% 3
2 IMPLEMENTAT PROD 195265 1% 67% 4
3 MAT SEMICOND STRUCT 167369 1% 57% 4
4 ISG GRP 146451 0% 100% 2
5 MARITIME MISSION 146451 0% 100% 2
6 METALL MAT PROC SECT 146451 0% 100% 2
7 ORBITER SUSTAINING ENGN OFF 146451 0% 100% 2
8 CORROS STUDIES 97633 0% 67% 2
9 PACKAGING FINISHING TECHNOL 97633 0% 67% 2
10 ADV ELECT JOINING MAT 73225 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 201819 8% 8% 33
2 JOURNAL OF ELECTRONIC MATERIALS 21990 13% 1% 54
3 MICROELECTRONICS RELIABILITY 9494 7% 0% 30
4 CIRCUIT WORLD 9189 1% 3% 5
5 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 5453 2% 1% 10
6 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 3854 2% 1% 8
7 GALVANOTECHNIK 2814 0% 4% 1
8 JOURNAL OF MATERIALS RESEARCH 2716 5% 0% 21
9 JOM 2175 2% 0% 8
10 JOURNAL OF THE JAPAN INSTITUTE OF METALS 1776 3% 0% 12

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 TIN WHISKERS 5309532 21% 84% 86 Search TIN+WHISKERS Search TIN+WHISKERS
2 SN WHISKER 1664381 7% 78% 29 Search SN+WHISKER Search SN+WHISKER
3 WHISKER GROWTH 1076401 5% 70% 21 Search WHISKER+GROWTH Search WHISKER+GROWTH
4 TIN PLATING 551994 3% 54% 14 Search TIN+PLATING Search TIN+PLATING
5 METAL WHISKERS 448504 2% 88% 7 Search METAL+WHISKERS Search METAL+WHISKERS
6 ELECTROPLATED TIN 219676 1% 100% 3 Search ELECTROPLATED+TIN Search ELECTROPLATED+TIN
7 SN PLATING 219676 1% 100% 3 Search SN+PLATING Search SN+PLATING
8 WHISKER 195942 12% 5% 52 Search WHISKER Search WHISKER
9 TIN ELECTROPLATING 195265 1% 67% 4 Search TIN+ELECTROPLATING Search TIN+ELECTROPLATING
10 LEADFRAME PACKAGE 164756 1% 75% 3 Search LEADFRAME+PACKAGE Search LEADFRAME+PACKAGE

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 CHASON, E , JADHAV, N , PEI, F , BUCHOVECKY, E , BOWER, A , (2013) GROWTH OF WHISKERS FROM SN SURFACES: DRIVING FORCES AND GROWTH MECHANISMS.PROGRESS IN SURFACE SCIENCE. VOL. 88. ISSUE 2. P. 103 -131 80 81% 21
2 ZHANG, PG , ZHANG, YM , SUN, ZM , (2015) SPONTANEOUS GROWTH OF METAL WHISKERS ON SURFACES OF SOLIDS: A REVIEW.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY. VOL. 31. ISSUE 7. P. 675 -698 76 70% 6
3 PEI, F , BOWER, AF , CHASON, E , (2016) QUANTIFYING THE RATES OF SN WHISKER GROWTH AND PLASTIC STRAIN RELAXATION USING THERMALLY-INDUCED STRESS.JOURNAL OF ELECTRONIC MATERIALS. VOL. 45. ISSUE 1. P. 21 -29 44 96% 0
4 CHASON, E , PEI, F , (2015) MEASURING THE STRESS DEPENDENCE OF NUCLEATION AND GROWTH PROCESSES IN SN WHISKER FORMATION.JOM. VOL. 67. ISSUE 10. P. 2416 -2424 27 96% 2
5 STEIN, J , WELZEL, U , LEINEWEBER, A , HUEGEL, W , MITTEMEIJER, EJ , (2015) THE CRYSTALLOGRAPHIC GROWTH DIRECTIONS OF SN WHISKERS.ACTA MATERIALIA. VOL. 86. ISSUE . P. 102 -109 26 100% 2
6 YANG, FQ , (2016) A NONLINEAR VISCOUS MODEL FOR SN-WHISKER GROWTH.METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE. VOL. 47A. ISSUE 12. P. 5882 -5889 29 85% 0
7 ASHWORTH, MA , WILCOX, GD , HIGGINSON, RL , HEATH, RJ , LIU, C , MORTIMER, RJ , (2015) THE EFFECT OF ELECTROPLATING PARAMETERS AND SUBSTRATE MATERIAL ON TIN WHISKER FORMATION.MICROELECTRONICS RELIABILITY. VOL. 55. ISSUE 1. P. 180 -191 23 92% 6
8 CHEN, H , LEE, HY , KU, CS , WU, AT , (2016) EVOLUTION OF RESIDUAL STRESS AND QUALITATIVE ANALYSIS OF SN WHISKERS WITH VARIOUS MICROSTRUCTURES.JOURNAL OF MATERIALS SCIENCE. VOL. 51. ISSUE 7. P. 3600 -3606 22 96% 0
9 IVEY, DG , HE, A , (2015) MICROSTRUCTURAL STUDY OF SN FILMS ELECTRODEPOSITED ON CU SUBSTRATES: SN WHISKERS AND CU6SN5 PRECIPITATES.JOURNAL OF MATERIALS SCIENCE. VOL. 50. ISSUE 7. P. 2944 -2959 25 78% 2
10 BUNYAN, D , ASHWORTH, MA , WILCOX, GD , HIGGINSON, RL , HEATH, RJ , LIU, C , (2013) TIN WHISKER GROWTH FROM ELECTROPLATED FINISHES - A REVIEW.TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING. VOL. 91. ISSUE 5. P. 249-259 20 95% 7

Classes with closest relation at Level 1


Rank Class id link
1 16855 THERMAL EQUILIBRIUM DIAGRAM//TIN ELECTRODEPOSITION//CONNECTING RELIABILITY
2 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
3 20299 ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT
4 24832 IMPRESSION CREEP//INDENTATION CREEP TESTING//FINITE ELEMENT CREEP STRESS ANALYSIS
5 32957 ALLOY SINGLE CRYSTALS//MED MAT IMPLANTS SH E MEMORY EFFECT//SEDIMENTATION OF COMPONENTS
6 27699 BRAKE LAMPS//DRIVING REACTION TIME//DRIVING REACTION
7 28154 TIN PEST//DANISH CONSERVAT//GOART
8 22140 TINPLATE//MAT PROC TERMOMECAN//KUDAMATSU PLANT
9 20590 DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE
10 2714 ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION

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