Class information for:
Level 2: THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
2642 3496 19.9 57%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2642 2             THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA 3496
5504 1                   WAFER BONDING//ANODIC BONDING//DIRECT BONDING 1615
8314 1                   THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION 1268
25598 1                   EPITAXIAL LIFT OFF//FILM BONDING//SURFACE ACOUSTIC WAVE SEMICONDUCTOR COUPLED DEVICE 277
27344 1                   WET ETCHING OF GLASS//DEEP GLASS ETCHING//NI HARD MASK 232
34938 1                   BRANCHED WAVEGUIDE//PHOTONIC DOT//CMOS MICROPROCESSOR 104

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 THROUGH SILICON VIA TSV authKW 1101510 5% 73% 174
2 WAFER BONDING authKW 595832 5% 37% 184
3 THROUGH SILICON VIA authKW 551141 3% 60% 106
4 ANODIC BONDING authKW 452644 2% 60% 87
5 3 D INTEGRATION authKW 446897 3% 42% 121
6 3D IC authKW 397706 3% 52% 88
7 THROUGH SILICON VIAS TSVS authKW 316368 1% 72% 50
8 TSV authKW 254370 2% 41% 71
9 DIRECT BONDING authKW 154401 1% 45% 39
10 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY journal 144631 4% 11% 149

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Engineering, Electrical & Electronic 27806 52% 0% 1819
2 Physics, Applied 19272 48% 0% 1674
3 Nanoscience & Nanotechnology 12135 20% 0% 714
4 Instruments & Instrumentation 6008 14% 0% 476
5 Materials Science, Multidisciplinary 5996 31% 0% 1073
6 Engineering, Manufacturing 4043 6% 0% 214
7 Computer Science, Hardware & Architecture 3837 6% 0% 215
8 Materials Science, Coatings & Films 2187 6% 0% 214
9 Mechanics 730 6% 0% 210
10 Optics 620 7% 0% 243

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV DESIGN TEAM 37251 0% 53% 8
2 SILICON TEST SOLUT 36384 0% 83% 5
3 WAFER BONDING 34926 0% 67% 6
4 ELECT SYST INTEGRAT TECHNOL 27285 0% 63% 5
5 MICROELECT 21152 6% 1% 205
6 ASSEMBLY RELIABIL TECHNOL 19841 0% 45% 5
7 NEW DISPLAYS SYST PLICAT 19841 0% 45% 5
8 HIGH DENS INTERCONNECT GRP 19647 0% 75% 3
9 ULTRA PRECIS MECH SYST 19647 0% 75% 3
10 ADV MICROSYST INTEGRAT PACKAGING 17465 0% 100% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 144631 4% 11% 149
2 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 49283 5% 3% 177
3 IEEE TRANSACTIONS ON ADVANCED PACKAGING 37502 2% 7% 66
4 SENSORS AND ACTUATORS A-PHYSICAL 22035 5% 2% 159
5 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 21494 3% 3% 91
6 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 15902 2% 3% 70
7 MICROELECTRONIC ENGINEERING 12023 3% 1% 119
8 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 10994 1% 6% 22
9 MICROELECTRONICS RELIABILITY 8767 2% 1% 84
10 IEEE DESIGN & TEST 7887 0% 8% 12

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 THROUGH SILICON VIA TSV 1101510 5% 73% 174 Search THROUGH+SILICON+VIA+TSV Search THROUGH+SILICON+VIA+TSV
2 WAFER BONDING 595832 5% 37% 184 Search WAFER+BONDING Search WAFER+BONDING
3 THROUGH SILICON VIA 551141 3% 60% 106 Search THROUGH+SILICON+VIA Search THROUGH+SILICON+VIA
4 ANODIC BONDING 452644 2% 60% 87 Search ANODIC+BONDING Search ANODIC+BONDING
5 3 D INTEGRATION 446897 3% 42% 121 Search 3+D+INTEGRATION Search 3+D+INTEGRATION
6 3D IC 397706 3% 52% 88 Search 3D+IC Search 3D+IC
7 THROUGH SILICON VIAS TSVS 316368 1% 72% 50 Search THROUGH+SILICON+VIAS+TSVS Search THROUGH+SILICON+VIAS+TSVS
8 TSV 254370 2% 41% 71 Search TSV Search TSV
9 DIRECT BONDING 154401 1% 45% 39 Search DIRECT+BONDING Search DIRECT+BONDING
10 SILICON WAFER BONDING 132822 0% 89% 17 Search SILICON+WAFER+BONDING Search SILICON+WAFER+BONDING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 VALLIN, O , JONSSON, K , LINDBERG, U , (2005) ADHESION QUANTIFICATION METHODS FOR WAFER BONDING.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 50. ISSUE 4-5. P. 109 -165 148 80% 53
2 MASTEIKA, V , KOWAL, J , BRAITHWAITE, NS , ROGERS, T , (2014) A REVIEW OF HYDROPHILIC SILICON WAFER BONDING.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 3. ISSUE 4. P. Q42 -Q54 81 94% 17
3 PLOSSL, A , KRAUTER, G , (1999) WAFER DIRECT BONDING: TAILORING ADHESION BETWEEN BRITTLE MATERIALS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 25. ISSUE 1-2. P. 1 -88 161 64% 142
4 WANG, ZY , (2015) 3-D INTEGRATION AND THROUGH-SILICON VIAS IN MEMS AND MICROSENSORS.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 24. ISSUE 5. P. 1211 -1244 96 60% 3
5 MA, Q , WU, K , WANG, ZY , (2016) THERMAL STRESSES OF TSVS WITH SILICON POST CONDUCTORS AND POLYMER INSULATORS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 12. P. 1847 -1854 38 95% 0
6 HUANG, C , WU, D , WANG, ZY , (2016) THERMAL RELIABILITY TESTS OF AIR-GAP TSVS WITH COMBINED AIR-SIO2 LINERS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 5. P. 703 -711 38 93% 0
7 MIKI, N , (2005) WAFER BONDING TECHNIQUES FOR MEMS.SENSOR LETTERS. VOL. 3. ISSUE 4. P. 263-273 76 50% 13
8 KNOWLES, KM , VAN HELVOORT, ATJ , (2006) ANODIC BONDING.INTERNATIONAL MATERIALS REVIEWS. VOL. 51. ISSUE 5. P. 273 -311 66 50% 59
9 HOWLADER, MMR , DEEN, MJ , SUGA, T , (2015) NANOBONDING: A KEY TECHNOLOGY FOR EMERGING APPLICATIONS IN HEALTH AND ENVIRONMENTAL SCIENCES.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 54. ISSUE 3. P. - 47 61% 1
10 PASQUARIELLO, D , HJORT, K , (2002) PLASMA-ASSISTED INP-TO-SI LOW TEMPERATURE WAFER BONDING.IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. VOL. 8. ISSUE 1. P. 118 -131 48 72% 117

Classes with closest relation at Level 2


Rank Class id link
1 816 LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY
2 4119 ANAL STRUCT MAT//UNITE RECH PHYS SOLIDE//PHYS MATIERE CONDENSEE NANOSCI LR ES 40 11
3 3149 CLEANROOM//PHOTORESIST REMOVAL//MINIENVIRONMENT
4 3252 JUNCTION TEMPERATURE//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT
5 308 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS//JOURNAL OF MICROMECHANICS AND MICROENGINEERING
6 3017 DIAZONIUM SALTS//SU 8//ELECTROGRAFTING
7 3695 BENZOCYCLOBUTENE//O QUINODIMETHANE//ORTHO QUINODIMETHANES
8 2088 ERICSSON REVIEW//OPTICAL INTERCONNECTIONS//OPTICAL INTERCONNECTS
9 2712 IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS//PHYSICAL DESIGN//FLOORPLANNING
10 2485 ELECTROMIGRATION//ELECTROMIGRATION EM//SOLID STATE DEWETTING

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