Class information for:
Level 1: DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
20590 453 24.9 61%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
816 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 11969
20590 1                   DIE ATTACH//NANOSILVER PASTE//NANOSCALE SILVER PASTE 453

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 DIE ATTACH authKW 1069567 6% 55% 29
2 NANOSILVER PASTE authKW 873572 4% 72% 18
3 NANOSCALE SILVER PASTE authKW 337030 1% 100% 5
4 POWER ELECTRONICS PACKAGING authKW 321161 2% 53% 9
5 DIE ATTACHMENT authKW 320970 2% 48% 10
6 SILVER SINTERING authKW 280857 1% 83% 5
7 LED ENGN address 269624 1% 100% 4
8 MAT MFG TECHNOL PROGRAM address 269624 1% 100% 4
9 TIANJIN ADV JOINING TECHNOL address 245648 6% 14% 27
10 CHIP ATTACHMENT authKW 202218 1% 100% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Electrical & Electronic 3711 53% 0% 239
2 Materials Science, Multidisciplinary 3307 59% 0% 267
3 Engineering, Manufacturing 2500 13% 0% 59
4 Nanoscience & Nanotechnology 1414 19% 0% 88
5 Physics, Applied 1373 36% 0% 165
6 Metallurgy & Metallurgical Engineering 1178 18% 0% 80
7 Materials Science, Ceramics 30 2% 0% 9
8 Physics, Condensed Matter 15 5% 0% 24
9 Engineering, Mechanical 13 3% 0% 12
10 Chemistry, Physical 5 6% 0% 26

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 LED ENGN 269624 1% 100% 4
2 MAT MFG TECHNOL PROGRAM 269624 1% 100% 4
3 TIANJIN ADV JOINING TECHNOL 245648 6% 14% 27
4 ADV CARBON TECHNOL 150122 2% 32% 7
5 ADV JOINING TECHNOL 134812 0% 100% 2
6 INAL POWER SYST 134812 0% 100% 2
7 INTELLIGENT STRUCT MAT SYST 134812 0% 100% 2
8 POWER ELECT SYST 105009 6% 6% 28
9 ADV MAT JOINING 67855 3% 8% 12
10 ADHENS MECH 67406 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 80527 9% 3% 40
2 MICROELECTRONICS RELIABILITY 25315 11% 1% 51
3 JOURNAL OF ELECTRONIC MATERIALS 16651 11% 1% 49
4 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 16126 4% 1% 16
5 SOLDERING & SURFACE MOUNT TECHNOLOGY 8521 2% 2% 7
6 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 8424 3% 1% 12
7 JOURNAL OF ELECTRONIC PACKAGING 6598 2% 1% 11
8 IEEE TRANSACTIONS ON ADVANCED PACKAGING 5383 2% 1% 9
9 ELECTRONIC DESIGN 5144 1% 2% 5
10 MATERIALS TRANSACTIONS 3381 4% 0% 19

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 DIE ATTACH 1069567 6% 55% 29 Search DIE+ATTACH Search DIE+ATTACH
2 NANOSILVER PASTE 873572 4% 72% 18 Search NANOSILVER+PASTE Search NANOSILVER+PASTE
3 NANOSCALE SILVER PASTE 337030 1% 100% 5 Search NANOSCALE+SILVER+PASTE Search NANOSCALE+SILVER+PASTE
4 POWER ELECTRONICS PACKAGING 321161 2% 53% 9 Search POWER+ELECTRONICS+PACKAGING Search POWER+ELECTRONICS+PACKAGING
5 DIE ATTACHMENT 320970 2% 48% 10 Search DIE+ATTACHMENT Search DIE+ATTACHMENT
6 SILVER SINTERING 280857 1% 83% 5 Search SILVER+SINTERING Search SILVER+SINTERING
7 CHIP ATTACHMENT 202218 1% 100% 3 Search CHIP+ATTACHMENT Search CHIP+ATTACHMENT
8 COPPER JOINT 202218 1% 100% 3 Search COPPER+JOINT Search COPPER+JOINT
9 IPEM 202218 1% 100% 3 Search IPEM Search IPEM
10 PRESSURELESS BONDING 202218 1% 100% 3 Search PRESSURELESS+BONDING Search PRESSURELESS+BONDING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 SIOW, KS , (2014) ARE SINTERED SILVER JOINTS READY FOR USE AS INTERCONNECT MATERIAL IN MICROELECTRONIC PACKAGING?.JOURNAL OF ELECTRONIC MATERIALS. VOL. 43. ISSUE 4. P. 947 -961 40 78% 38
2 CHEN, CT , NAGAO, S , ZHANG, H , JIU, JT , SUGAHARA, T , SUGANUMA, K , IWASHIGE, T , SUGIURA, K , TSURUTA, K , (2017) MECHANICAL DEFORMATION OF SINTERED POROUS AG DIE ATTACH AT HIGH TEMPERATURE AND ITS SIZE EFFECT FOR WIDE-BANDGAP POWER DEVICE DESIGN.JOURNAL OF ELECTRONIC MATERIALS. VOL. 46. ISSUE 3. P. 1576 -1586 28 85% 0
3 SATOH, T , ISHIZAKI, T , AKEDO, K , (2017) SILVER ADHESIVE LAYER FOR ENHANCED PRESSURE-FREE BONDING USING COPPER NANOPARTICLES.JOURNAL OF ELECTRONIC MATERIALS. VOL. 46. ISSUE 2. P. 1279 -1286 27 79% 0
4 PENG, P , HU, AM , GERLICH, AP , ZOU, GS , LIU, L , ZHOU, YN , (2015) JOINING OF SILVER NANOMATERIALS AT LOW TEMPERATURES: PROCESSES, PROPERTIES, AND APPLICATIONS.ACS APPLIED MATERIALS & INTERFACES. VOL. 7. ISSUE 23. P. 12597 -12618 54 29% 20
5 SIOW, KS , LIN, YT , (2016) IDENTIFYING THE DEVELOPMENT STATE OF SINTERED SILVER (AG) AS A BONDING MATERIAL IN THE MICROELECTRONIC PACKAGING VIA A PATENT LANDSCAPE STUDY.JOURNAL OF ELECTRONIC PACKAGING. VOL. 138. ISSUE 2. P. - 23 70% 2
6 KHAZAKA, R , THOLLIN, B , MENDIZABAL, L , HENRY, D , KHAZAKA, R , HANNA, R , (2015) CHARACTERIZATION OF NANOSILVER DRY FILMS FOR HIGH-TEMPERATURE APPLICATIONS.IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. VOL. 15. ISSUE 2. P. 149 -155 19 86% 6
7 SUGANUMA, K , SAKAMOTO, S , KAGAMI, N , WAKUDA, D , KIM, KS , NOGI, M , (2012) LOW-TEMPERATURE LOW-PRESSURE DIE ATTACH WITH HYBRID SILVER PARTICLE PASTE.MICROELECTRONICS RELIABILITY. VOL. 52. ISSUE 2. P. 375-380 16 84% 50
8 MEI, YH , CHEN, G , CAO, YJ , LI, X , HAN, D , CHEN, X , (2013) SIMPLIFICATION OF LOW-TEMPERATURE SINTERING NANOSILVER FOR POWER ELECTRONICS PACKAGING.JOURNAL OF ELECTRONIC MATERIALS. VOL. 42. ISSUE 6. P. 1209-1218 19 79% 8
9 USUI, M , KIMURA, H , SATOH, T , ASADA, T , YAMAGUCHI, S , KATO, M , (2016) DEGRADATION OF A SINTERED CU NANOPARTICLE LAYER STUDIED BY SYNCHROTRON RADIATION COMPUTED LAMINOGRAPHY.MICROELECTRONICS RELIABILITY. VOL. 63. ISSUE . P. 152 -158 22 67% 0
10 OGURA, T , YAGISHITA, T , TAKATA, S , FUJIMOTO, T , HIROSE, A , (2014) BONDABILITY OF COPPER JOINTS FORMED USING A MIXED PASTE OF AG2O AND CUO FOR LOW-TEMPERATURE SINTER BONDING.JOURNAL OF THE JAPAN INSTITUTE OF METALS. VOL. 78. ISSUE 7. P. 280 -285 16 94% 0

Classes with closest relation at Level 1


Rank Class id link
1 16594 FLUXLESS BONDING//AU SN//AU SN SOLDER
2 35151 ELECTRICAL NANOWELDING//NANOJOINING//NANOWELDING
3 5040 IGBT//INSULATED GATE BIPOLAR TRANSISTOR IGBT//INSULATED GATE BIPOLAR TRANSISTORS
4 5356 INKJET PRINTING//PRINTED ELECTRONICS//CONDUCTIVE INK
5 31314 WELD BRAZING//B610CF STEEL//BORON GRAPHENE HYBRIDS
6 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
7 20299 ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT
8 10992 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ELECTRICALLY CONDUCTIVE ADHESIVES
9 15107 COPPER NANOPARTICLES//CU NANOPARTICLES//ABT AC
10 32365 HIGH PERFORMANCE SIMULATION//AMORPHOUS TITANIA GROWTH//ATOMIC INTERACTION FORCE

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