Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
17895 | 577 | 15.7 | 46% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
10 | 4 | OPTICS//PHYSICS, PARTICLES & FIELDS//PHYSICS, MULTIDISCIPLINARY | 1131262 |
217 | 3 | OPTICS//APPLIED OPTICS//OPTICAL ENGINEERING | 50829 |
1780 | 2 | DIGITAL IMAGE CORRELATION//OPTICS AND LASERS IN ENGINEERING//SPECKLE INTERFEROMETRY | 6371 |
17895 | 1 | MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//GEOMETRIC PHASE ANALYSIS | 577 |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | MOIRE INTERFEROMETRY | authKW | 606800 | 9% | 23% | 50 |
2 | ELECTRON BEAM MOIRE | authKW | 423358 | 1% | 100% | 8 |
3 | GEOMETRIC PHASE ANALYSIS | authKW | 356493 | 3% | 42% | 16 |
4 | NANO MOIRE | authKW | 264599 | 1% | 100% | 5 |
5 | FRINGE MULTIPLICATION | authKW | 220497 | 1% | 83% | 5 |
6 | ELECTRON MOIRE | authKW | 211679 | 1% | 100% | 4 |
7 | MICROSCOPIC MOIRE INTERFEROMETRY | authKW | 169341 | 1% | 80% | 4 |
8 | SEM MOIRE | authKW | 158759 | 1% | 100% | 3 |
9 | SPOT CENTROID | authKW | 158759 | 1% | 100% | 3 |
10 | EXPERIMENTAL MECHANICS | journal | 113313 | 13% | 3% | 76 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Materials Science, Characterization, Testing | 15587 | 21% | 0% | 119 |
2 | Optics | 3139 | 31% | 0% | 180 |
3 | Mechanics | 2518 | 23% | 0% | 135 |
4 | Materials Science, Multidisciplinary | 770 | 28% | 0% | 159 |
5 | Engineering, Mechanical | 702 | 12% | 0% | 69 |
6 | Instruments & Instrumentation | 438 | 9% | 0% | 54 |
7 | Engineering, General | 221 | 5% | 0% | 30 |
8 | Engineering, Manufacturing | 138 | 3% | 0% | 17 |
9 | Engineering, Electrical & Electronic | 119 | 11% | 0% | 63 |
10 | Nanoscience & Nanotechnology | 115 | 6% | 0% | 33 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | OPENING VACUUM PHYS | 105839 | 0% | 100% | 2 |
2 | MA INENWESEN | 105835 | 1% | 50% | 4 |
3 | AML | 83945 | 6% | 5% | 33 |
4 | ENG MECH | 59531 | 1% | 38% | 3 |
5 | 853 | 52920 | 0% | 100% | 1 |
6 | AILUN ASSOC IST | 52920 | 0% | 100% | 1 |
7 | BACHUS WORKS ADV METHODS GRP | 52920 | 0% | 100% | 1 |
8 | CHINESE MINIST EDUC FAILURE MECH | 52920 | 0% | 100% | 1 |
9 | COMPOS COATINGS | 52920 | 0% | 100% | 1 |
10 | CRYSTALLINE SILICON RD | 52920 | 0% | 100% | 1 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | EXPERIMENTAL MECHANICS | 113313 | 13% | 3% | 76 |
2 | OPTICS AND LASERS IN ENGINEERING | 61327 | 11% | 2% | 63 |
3 | EXPERIMENTAL TECHNIQUES | 12871 | 3% | 2% | 15 |
4 | JOURNAL OF ELECTRONIC PACKAGING | 10965 | 3% | 1% | 16 |
5 | OPTICAL ENGINEERING | 5779 | 7% | 0% | 39 |
6 | STRAIN | 4555 | 1% | 1% | 8 |
7 | JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN | 2232 | 1% | 1% | 8 |
8 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 2180 | 1% | 1% | 4 |
9 | MEASUREMENT SCIENCE AND TECHNOLOGY | 2077 | 3% | 0% | 19 |
10 | JSME INTERNATIONAL JOURNAL SERIES A-MECHANICS AND MATERIAL ENGINEERING | 1775 | 0% | 2% | 2 |
Author Key Words |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | MOIRE INTERFEROMETRY | 606800 | 9% | 23% | 50 | Search MOIRE+INTERFEROMETRY | Search MOIRE+INTERFEROMETRY |
2 | ELECTRON BEAM MOIRE | 423358 | 1% | 100% | 8 | Search ELECTRON+BEAM+MOIRE | Search ELECTRON+BEAM+MOIRE |
3 | GEOMETRIC PHASE ANALYSIS | 356493 | 3% | 42% | 16 | Search GEOMETRIC+PHASE+ANALYSIS | Search GEOMETRIC+PHASE+ANALYSIS |
4 | NANO MOIRE | 264599 | 1% | 100% | 5 | Search NANO+MOIRE | Search NANO+MOIRE |
5 | FRINGE MULTIPLICATION | 220497 | 1% | 83% | 5 | Search FRINGE+MULTIPLICATION | Search FRINGE+MULTIPLICATION |
6 | ELECTRON MOIRE | 211679 | 1% | 100% | 4 | Search ELECTRON+MOIRE | Search ELECTRON+MOIRE |
7 | MICROSCOPIC MOIRE INTERFEROMETRY | 169341 | 1% | 80% | 4 | Search MICROSCOPIC+MOIRE+INTERFEROMETRY | Search MICROSCOPIC+MOIRE+INTERFEROMETRY |
8 | SEM MOIRE | 158759 | 1% | 100% | 3 | Search SEM+MOIRE | Search SEM+MOIRE |
9 | SPOT CENTROID | 158759 | 1% | 100% | 3 | Search SPOT+CENTROID | Search SPOT+CENTROID |
10 | MOIRE | 112343 | 3% | 11% | 19 | Search MOIRE | Search MOIRE |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | IFJU, PG , HAN, B , (2010) RECENT APPLICATIONS OF MOIRE INTERFEROMETRY.EXPERIMENTAL MECHANICS. VOL. 50. ISSUE 8. P. 1129-1147 | 53 | 45% | 14 |
2 | LANG, FC , ZHAO, YR , XING, YM , LIU, F , HOU, XH , ZHU, J , LI, JJ , YANG, ST , (2016) A NOVEL RASTER-SCANNING METHOD TO FABRICATE ULTRA-FINE CROSS-GRATINGS FOR THE GENERATION OF ELECTRON BEAM MOIRE FRINGE PATTERNS.OPTICS AND LASERS IN ENGINEERING. VOL. 86. ISSUE . P. 281 -290 | 19 | 95% | 0 |
3 | ZHAO, YR , LEI, ZK , XING, YM , HOU, XH , BAI, PC , (2014) FABRICATING PARAMETERS OPTIMIZATION OF HIGH FREQUENCY GRATING BY MULTI-SCANNING ELECTRON BEAM METHOD.EXPERIMENTAL MECHANICS. VOL. 54. ISSUE 1. P. 45 -55 | 16 | 100% | 3 |
4 | HAN, B , POST, D , IFJU, P , (2001) MOIRE INTERFEROMETRY FOR ENGINEERING MECHANICS: CURRENT PRACTICES AND FUTURE DEVELOPMENTS.JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN. VOL. 36. ISSUE 1. P. 101 -117 | 29 | 63% | 45 |
5 | WANG, QH , KISHIMOTO, S , TSUDA, H , (2014) FORMATION OF THREE-WAY SCANNING ELECTRON MICROSCOPE MOIRE ON MICRO/NANOSTRUCTURES.SCIENTIFIC WORLD JOURNAL. VOL. . ISSUE . P. - | 15 | 88% | 0 |
6 | JOO, J , CHO, S , HAN, B , (2005) CHARACTERIZATION OF FLEXURAL AND THERMO-MECHANICAL BEHAVIOR OF PLASTIC BALL GRID PACKAGE ASSEMBLY USING MOIRE INTERFEROMETRY.MICROELECTRONICS RELIABILITY. VOL. 45. ISSUE 3-4. P. 637-646 | 16 | 100% | 7 |
7 | HAN, B , (2003) THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS.JOURNAL OF THERMAL STRESSES. VOL. 26. ISSUE 6. P. 583 -613 | 19 | 79% | 19 |
8 | WANG, QH , RI, S , TSUDA, H , (2016) DIGITAL SAMPLING MOIRE AS A SUBSTITUTE FOR MICROSCOPE SCANNING MOIRE FOR HIGH-SENSITIVITY AND FULL-FIELD DEFORMATION MEASUREMENT AT MICRON/NANO SCALES.APPLIED OPTICS. VOL. 55. ISSUE 25. P. 6858 -6865 | 14 | 78% | 0 |
9 | LI, YJ , XIE, HM , CHEN, PW , ZHANG, QM , (2011) THEORETICAL ANALYSIS OF MOIRE FRINGE MULTIPLICATION UNDER A SCANNING ELECTRON MICROSCOPE.MEASUREMENT SCIENCE AND TECHNOLOGY. VOL. 22. ISSUE 2. P. - | 13 | 93% | 3 |
10 | LI, CW , LIU, ZW , XIE, HM , WU, D , (2013) NOVEL 3D SEM MOIRE METHOD FOR MICRO HEIGHT MEASUREMENT.OPTICS EXPRESS. VOL. 21. ISSUE 13. P. 15734-15746 | 15 | 71% | 9 |
Classes with closest relation at Level 1 |