Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 34607 | 109 | 22.8 | 19% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | ECONOMICS//EDUCATION & EDUCATIONAL RESEARCH//PSYCHOL | 3876184 |
| 559 | 3 | LITERATURE//JAMES JOYCE QUARTERLY//PAIDEUMA-A JOURNAL DEVOTED TO EZRA POUND SCHOLARSHIP | 17339 |
| 3011 | 2 | REPEAT SPACE THEORY RST//ASYMPTOTIC LINEARITY THEOREM ALT//ADDITIVITY PROBLEMS | 2532 |
| 34607 | 1 | ENDICOTT ELECT PACKAGING//PLATED THROUGH HOLE//CYCLE TO FAILURE | 109 |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | ENDICOTT ELECT PACKAGING | address | 560286 | 2% | 100% | 2 |
| 2 | PLATED THROUGH HOLE | authKW | 448224 | 4% | 40% | 4 |
| 3 | CYCLE TO FAILURE | authKW | 280143 | 1% | 100% | 1 |
| 4 | FAILURE ANAL PHYS | address | 280143 | 1% | 100% | 1 |
| 5 | FIELD LIFE | authKW | 280143 | 1% | 100% | 1 |
| 6 | INTERCONNECT STRESS TEST | authKW | 280143 | 1% | 100% | 1 |
| 7 | MODES AND EFFECTS ANALYSIS | authKW | 280143 | 1% | 100% | 1 |
| 8 | MULTILEVEL PROCESSING | authKW | 280143 | 1% | 100% | 1 |
| 9 | PLANE FATIGUE THEORY | authKW | 280143 | 1% | 100% | 1 |
| 10 | PLATED THROUGH HOLES PTH | authKW | 280143 | 1% | 100% | 1 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Religion | 1752 | 16% | 0% | 17 |
| 2 | Classics | 389 | 5% | 0% | 5 |
| 3 | Literature | 386 | 8% | 0% | 9 |
| 4 | Humanities, Multidisciplinary | 324 | 6% | 0% | 7 |
| 5 | Medieval & Renaissance Studies | 204 | 3% | 0% | 3 |
| 6 | Film, Radio, Television | 148 | 2% | 0% | 2 |
| 7 | Engineering, Electrical & Electronic | 143 | 23% | 0% | 25 |
| 8 | Engineering, Manufacturing | 139 | 6% | 0% | 7 |
| 9 | Literary Theory & Criticism | 132 | 2% | 0% | 2 |
| 10 | Materials Science, Multidisciplinary | 113 | 25% | 0% | 27 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | ENDICOTT ELECT PACKAGING | 560286 | 2% | 100% | 2 |
| 2 | FAILURE ANAL PHYS | 280143 | 1% | 100% | 1 |
| 3 | RENEWABLE POWER BUSINESS UNIT | 280143 | 1% | 100% | 1 |
| 4 | SEMICOND PROD SECTORS | 140071 | 1% | 50% | 1 |
| 5 | PROGRAM HELLEN STUDIES | 70034 | 1% | 25% | 1 |
| 6 | ADV INTERCONNECT SYST S | 56027 | 1% | 20% | 1 |
| 7 | EARLY CHRISTIAN STUDIES | 40017 | 2% | 7% | 2 |
| 8 | THERMAL ANAL MAT PROC | 28013 | 1% | 10% | 1 |
| 9 | ADV LIFE CYCLE ENGN | 9413 | 2% | 2% | 2 |
| 10 | DIGITAL DNA S | 3146 | 1% | 1% | 1 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | VIGILIAE CHRISTIANAE | 7720 | 4% | 1% | 4 |
| 2 | JOURNAL OF ADHESION | 6815 | 6% | 0% | 7 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 6577 | 3% | 1% | 3 |
| 4 | GREEK ROMAN AND BYZANTINE STUDIES | 6200 | 4% | 1% | 4 |
| 5 | CHRISTIANITY & LITERATURE | 5959 | 1% | 2% | 1 |
| 6 | JOURNAL OF ELECTRONIC PACKAGING | 5675 | 5% | 0% | 5 |
| 7 | CIRCUIT WORLD | 5627 | 2% | 1% | 2 |
| 8 | BYZANTINISCHE ZEITSCHRIFT | 3956 | 2% | 1% | 2 |
| 9 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 3893 | 4% | 0% | 4 |
| 10 | TEXTE-REVUE DE CRITIQUE ET DE THEORIE LITTERAIRE | 3784 | 1% | 1% | 1 |
Author Key Words |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | PLATED THROUGH HOLE | 448224 | 4% | 40% | 4 | Search PLATED+THROUGH+HOLE | Search PLATED+THROUGH+HOLE |
| 2 | CYCLE TO FAILURE | 280143 | 1% | 100% | 1 | Search CYCLE+TO+FAILURE | Search CYCLE+TO+FAILURE |
| 3 | FIELD LIFE | 280143 | 1% | 100% | 1 | Search FIELD+LIFE | Search FIELD+LIFE |
| 4 | INTERCONNECT STRESS TEST | 280143 | 1% | 100% | 1 | Search INTERCONNECT+STRESS+TEST | Search INTERCONNECT+STRESS+TEST |
| 5 | MODES AND EFFECTS ANALYSIS | 280143 | 1% | 100% | 1 | Search MODES+AND+EFFECTS+ANALYSIS | Search MODES+AND+EFFECTS+ANALYSIS |
| 6 | MULTILEVEL PROCESSING | 280143 | 1% | 100% | 1 | Search MULTILEVEL+PROCESSING | Search MULTILEVEL+PROCESSING |
| 7 | PLANE FATIGUE THEORY | 280143 | 1% | 100% | 1 | Search PLANE+FATIGUE+THEORY | Search PLANE+FATIGUE+THEORY |
| 8 | PLATED THROUGH HOLES PTH | 280143 | 1% | 100% | 1 | Search PLATED+THROUGH+HOLES+PTH | Search PLATED+THROUGH+HOLES+PTH |
| 9 | PLATED THROUGH VIA | 280143 | 1% | 100% | 1 | Search PLATED+THROUGH+VIA | Search PLATED+THROUGH+VIA |
| 10 | PLATED THROUGH VIA PTV | 280143 | 1% | 100% | 1 | Search PLATED+THROUGH+VIA+PTV | Search PLATED+THROUGH+VIA+PTV |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | HUANG, SQ , YUNG, KC , SUN, B , (2012) A FINITE ELEMENT MODEL AND EXPERIMENTAL ANALYSIS OF PTH RELIABILITY IN RIGID-FLEX PRINTED CIRCUITS USING THE TAGUCHI METHOD.INTERNATIONAL JOURNAL OF FATIGUE. VOL. 40. ISSUE . P. 84 -96 | 6 | 100% | 4 |
| 2 | DUNN, GD , (2005) RHETORIC AND TERTULLIAN'S DE 'VIRGINIBUS VELANDIS'.VIGILIAE CHRISTIANAE. VOL. 59. ISSUE 1. P. 1-30 | 8 | 89% | 0 |
| 3 | BAKHSHI, R , AZARIAN, MH , PECHT, MG , (2014) EFFECTS OF VOIDING ON THE DEGRADATION OF MICROVIAS IN HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS UNDER THERMOMECHANICAL STRESSES.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 4. ISSUE 8. P. 1374 -1379 | 5 | 100% | 0 |
| 4 | VENKATRAMAN, R , RAMAKRISHNA, K , KNADLE, K , CHEN, WT , HADDON, GC , (2001) EVALUATION OF SMEAR AND ITS EFFECT ON THE MECHANICAL INTEGRITY OF PLATED THROUGH HOLE-INNER PLANE INTERFACE IN THICK PRINTED WIRING BOARDS.JOURNAL OF ELECTRONIC PACKAGING. VOL. 123. ISSUE 1. P. 6 -15 | 6 | 86% | 5 |
| 5 | NING, Y , AZARIAN, MH , PECHT, M , (2015) EFFECTS OF VOIDING ON THERMOMECHANICAL RELIABILITY OF COPPER-FILLED MICROVIAS: MODELING AND SIMULATION.IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. VOL. 15. ISSUE 4. P. 500 -510 | 5 | 56% | 0 |
| 6 | YUNG, WKC , LIEM, HM , CHOY, HHS , MAN, YW , (2011) CORRELATING INTERCONNECT STRESS TEST AND ACCELERATED THERMAL CYCLING FOR ACCESSING THE RELIABILITIES OF HIGH PERFORMANCE PRINTED CIRCUIT BOARDS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 1. ISSUE 12. P. 2005 -2017 | 3 | 100% | 2 |
| 7 | WORTLEY, J , (2010) VITA SANCTI MARCIANI OECONOMI.BYZANTINISCHE ZEITSCHRIFT. VOL. 103. ISSUE 2. P. 715-772 | 3 | 100% | 0 |
| 8 | DUNN, GD , (2002) RHETORICAL STRUCTURE IN TERTULLIAN'S 'AD SCAPULAM'.VIGILIAE CHRISTIANAE. VOL. 56. ISSUE 1. P. 47-55 | 3 | 100% | 1 |
| 9 | MIRMAN, BR , (2000) TOOLS FOR STRESS ANALYSIS OF MICROELECTRONIC STRUCTURES.JOURNAL OF ELECTRONIC PACKAGING. VOL. 122. ISSUE 3. P. 280-282 | 3 | 100% | 2 |
| 10 | ROCHE, D , (2015) IRONY IN THE SWEET HEREAFTER BY RUSSELL BANKS (1991) AND ATOM EGOYAN (1997).ADAPTATION-THE JOURNAL OF LITERATURE ON SCREEN STUDIES. VOL. 8. ISSUE 2. P. 237 -253 | 2 | 100% | 0 |
Classes with closest relation at Level 1 |