Class information for:
Level 1: SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
5594 1599 20.5 49%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
19 4 ASTRONOMY & ASTROPHYSICS//ASTROPHYSICAL JOURNAL//ASTRON 523489
158 3       NUCLEAR FUSION//PHYSICS, FLUIDS & PLASMAS//PLASMA PHYSICS AND CONTROLLED FUSION 61209
1077 2             PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 9920
5594 1                   SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING 1599

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SOLID STATE TECHNOLOGY journal 76174 5% 5% 86
2 AFTER CORROSION authKW 57284 0% 100% 3
3 AL SI CU ETCHING authKW 57284 0% 100% 3
4 T PJT MEMORY DEVICE SOLUT NETWORK address 57284 0% 100% 3
5 POST ETCHING TREATMENTS authKW 38190 0% 100% 2
6 POST METAL ETCH STRIP authKW 38190 0% 100% 2
7 ZERO ENERGY SIMS authKW 38190 0% 100% 2
8 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B journal 27829 10% 1% 156
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A journal 27112 9% 1% 142
10 JOURNAL OF THE ELECTROCHEMICAL SOCIETY journal 25871 13% 1% 202

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Materials Science, Coatings & Films 19733 25% 0% 407
2 Physics, Applied 16042 63% 0% 1013
3 Electrochemistry 3453 13% 0% 206
4 Engineering, Electrical & Electronic 2038 23% 0% 362
5 Nanoscience & Nanotechnology 1575 11% 0% 182
6 Physics, Condensed Matter 1450 17% 0% 279
7 Materials Science, Multidisciplinary 184 11% 0% 176
8 Chemistry, Physical 101 9% 0% 138
9 Instruments & Instrumentation 77 3% 0% 49
10 COMPUTER APPLICATIONS & CYBERNETICS 60 0% 0% 3

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 T PJT MEMORY DEVICE SOLUT NETWORK 57284 0% 100% 3
2 ASSOC EURATUM CEA 19095 0% 100% 1
3 CNRS UNITE 844 19095 0% 100% 1
4 ENVIRONMENTALLY BENIGN ETCHING TECHNOL 19095 0% 100% 1
5 FAB TEAM 2PROC TECHNOL GRP 2 19095 0% 100% 1
6 JUNGWON GU 19095 0% 100% 1
7 KILBY FABRICAT PROC ENGN 19095 0% 100% 1
8 LETIG SI 19095 0% 100% 1
9 LPD DFA 19095 0% 100% 1
10 MICROELECT RUMENTAT GRP 19095 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SOLID STATE TECHNOLOGY 76174 5% 5% 86
2 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 27829 10% 1% 156
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 27112 9% 1% 142
4 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 25871 13% 1% 202
5 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY 14493 2% 3% 30
6 VACUUM 6921 4% 1% 59
7 JOURNAL OF APPLIED PHYSICS 3207 9% 0% 137
8 SOVIET MICROELECTRONICS 3116 0% 2% 7
9 PLASMA CHEMISTRY AND PLASMA PROCESSING 2591 1% 1% 14
10 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 2158 1% 1% 10

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 AFTER CORROSION 57284 0% 100% 3 Search AFTER+CORROSION Search AFTER+CORROSION
2 AL SI CU ETCHING 57284 0% 100% 3 Search AL+SI+CU+ETCHING Search AL+SI+CU+ETCHING
3 POST ETCHING TREATMENTS 38190 0% 100% 2 Search POST+ETCHING+TREATMENTS Search POST+ETCHING+TREATMENTS
4 POST METAL ETCH STRIP 38190 0% 100% 2 Search POST+METAL+ETCH+STRIP Search POST+METAL+ETCH+STRIP
5 ZERO ENERGY SIMS 38190 0% 100% 2 Search ZERO+ENERGY+SIMS Search ZERO+ENERGY+SIMS
6 1356 MHZ GENERATOR 19095 0% 100% 1 Search 1356+MHZ+GENERATOR Search 1356+MHZ+GENERATOR
7 2 MHZ GENERATOR 19095 0% 100% 1 Search 2+MHZ+GENERATOR Search 2+MHZ+GENERATOR
8 2 STEP ETCHING 19095 0% 100% 1 Search 2+STEP+ETCHING Search 2+STEP+ETCHING
9 ADVANCED AQUEOUS CLEANER AAC TM 19095 0% 100% 1 Search ADVANCED+AQUEOUS+CLEANER+AAC+TM Search ADVANCED+AQUEOUS+CLEANER+AAC+TM
10 AL CU ETCHING 19095 0% 100% 1 Search AL+CU+ETCHING Search AL+CU+ETCHING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 WINTERS, HF , COBURN, JW , (1992) SURFACE SCIENCE ASPECTS OF ETCHING REACTIONS.SURFACE SCIENCE REPORTS. VOL. 14. ISSUE 4-6. P. 161-269 100 61% 336
2 FONASH, SJ , (1990) AN OVERVIEW OF DRY ETCHING DAMAGE AND CONTAMINATION EFFECTS.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 137. ISSUE 12. P. 3885-3892 36 88% 99
3 HEFTY, RC , HOLT, JR , TATE, MR , CEYER, ST , (2009) MECHANISM AND DYNAMICS OF THE REACTION OF XEF2 WITH FLUORINATED SI(100): POSSIBLE ROLE OF GAS PHASE DISSOCIATION OF A SURFACE REACTION PRODUCT IN PLASMALESS ETCHING.JOURNAL OF CHEMICAL PHYSICS. VOL. 130. ISSUE 16. P. - 28 64% 5
4 VUGTS, MJM , JOOSTEN, GJP , VANOOSTERUM, A , SENHORST, HAJ , BEIJERINCK, HCW , (1994) SPONTANEOUS ETCHING OF SI(100) BY XEF2 - TEST-CASE FOR A NEW BEAM SURFACE EXPERIMENT.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 12. ISSUE 6. P. 2999-3011 26 96% 18
5 BRAULT, P , RANSON, P , ESTRADESZWARCKOPF, H , ROUSSEAU, B , (1990) CHEMICAL PHYSICS OF FLUORINE PLASMA-ETCHED SILICON SURFACES - STUDY OF SURFACE CONTAMINATIONS.JOURNAL OF APPLIED PHYSICS. VOL. 68. ISSUE 4. P. 1702-1709 36 82% 23
6 FRANK, WE , (1997) APPROACHES FOR PATTERNING OF ALUMINUM.MICROELECTRONIC ENGINEERING. VOL. 33. ISSUE 1-4. P. 85-100 28 78% 13
7 PELLETIER, J , (1987) A MODEL FOR THE HALOGEN-BASED PLASMA-ETCHING OF SILICON.JOURNAL OF PHYSICS D-APPLIED PHYSICS. VOL. 20. ISSUE 7. P. 858-869 36 92% 31
8 WINTERS, HF , PLUMB, IC , (1991) ETCHING REACTIONS FOR SILICON WITH F-ATOMS - PRODUCT DISTRIBUTIONS AND ION ENHANCEMENT MECHANISMS.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 9. ISSUE 2. P. 197-207 27 90% 71
9 VUGTS, MJM , HERMANS, LJF , BEIJERINCK, HCW , (1996) ION-ASSISTED SI/XEF2-ETCHING: INFLUENCE OF ION/NEUTRAL FLUX RATIO AND ION ENERGY.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 14. ISSUE 4. P. 2138-2150 27 79% 13
10 COBURN, JW , (1994) ION-ASSISTED ETCHING OF SI WITH CL2 - THE EFFECT OF FLUX RATIO.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 12. ISSUE 3. P. 1384-1389 25 86% 31

Classes with closest relation at Level 1


Rank Class id link
1 24369 NITROGEN TRIFLUORIDE//DIFLUOROALKYLAMINES//CHEMICAL DRY ETCHING
2 1352 ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
3 24018 PHYSICOCHIM MOLEC ORSAY//SURFACE STRUCTURE AND ROUGHNESS//ADSORBATE SUBSTRATE INTERACTIONS
4 5846 FUJIMI KU//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B//DRY ETCHING
5 19470 PLANE PLASMA DISCHARGE//ENERGY INFLUX//DRY DEVELOPMENT
6 26085 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS
7 12287 ECR PLASMA//UNIFORM PLASMA//ELECTRON CYCLOTRON RESONANCE DISCHARGE
8 21652 ATOMIC LAYER ETCHING//NEUTRAL BEAM//NEUTRAL BEAM ETCHING
9 23066 SYNCHROTRON RADIATION STIMULATED ETCHING//ADV SCI TECHNOL IND//VACUUM UV PHOTOSCI
10 868 PLASMA SOURCES SCIENCE & TECHNOLOGY//CAPACITIVELY COUPLED PLASMA//PLASMA ATOM PHYS

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