Class information for:
Level 1: INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
26085 263 18.4 66%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
19 4 ASTRONOMY & ASTROPHYSICS//ASTROPHYSICAL JOURNAL//ASTRON 523489
158 3       NUCLEAR FUSION//PHYSICS, FLUIDS & PLASMAS//PLASMA PHYSICS AND CONTROLLED FUSION 61209
1077 2             PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 9920
26085 1                   INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS 263

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING authKW 1004732 6% 58% 15
2 TI HARD MASK authKW 464415 2% 100% 4
3 MAGNETIC TUNNEL JUNCTION MATERIALS authKW 348311 1% 100% 3
4 CL 2 BASED PLASMA authKW 261232 1% 75% 3
5 ETCH PRODUCT authKW 261232 1% 75% 3
6 CH3OH AR authKW 232208 1% 100% 2
7 CH4 O 2 AR GAS authKW 232208 1% 100% 2
8 MAGNETIC TUNNEL JUNCTION STACK authKW 232208 1% 100% 2
9 THIN FILM MICROELECT address 168873 2% 36% 4
10 CH3OH AR GAS authKW 154804 1% 67% 2

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 3660 27% 0% 71
2 Physics, Applied 3254 70% 0% 184
3 Nanoscience & Nanotechnology 657 17% 0% 46
4 Physics, Condensed Matter 440 23% 0% 60
5 Materials Science, Multidisciplinary 346 27% 0% 72
6 Engineering, Electrical & Electronic 328 22% 0% 59
7 Electrochemistry 163 7% 0% 19
8 Optics 39 6% 0% 17
9 Chemistry, Physical 15 8% 0% 22
10 Engineering, Chemical 8 4% 0% 10

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 THIN FILM MICROELECT 168873 2% 36% 4
2 DESIGN PLICAT MOL CATALYSIS 116104 0% 100% 1
3 FILM NANO MICROELECT 116104 0% 100% 1
4 INNOVAT TECHNOL PLANNING 116104 0% 100% 1
5 MOSAIC COPPER RD GRP 116104 0% 100% 1
6 MOSAIC EPUU CMP INTEGRAT PROGRAM 116104 0% 100% 1
7 MRAM SPINTRON RD 116104 0% 100% 1
8 NANOMACHINING NANOTRIBOL 116104 0% 100% 1
9 SGS THOMSON 116104 0% 100% 1
10 TECHNOL DEV MFG 116104 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 3954 8% 0% 22
2 MICROELECTRONIC ENGINEERING 3292 6% 0% 17
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 3059 8% 0% 21
4 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 1424 2% 0% 4
5 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 1376 7% 0% 19
6 THIN SOLID FILMS 1017 7% 0% 18
7 VACUUM 978 3% 0% 9
8 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY 879 1% 0% 3
9 ANNUAL REVIEW OF CHEMICAL AND BIOMOLECULAR ENGINEERING 804 0% 1% 1
10 MICRO 658 0% 1% 1

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING 1004732 6% 58% 15 Search INDUCTIVELY+COUPLED+PLASMA+REACTIVE+ION+ETCHING Search INDUCTIVELY+COUPLED+PLASMA+REACTIVE+ION+ETCHING
2 TI HARD MASK 464415 2% 100% 4 Search TI+HARD+MASK Search TI+HARD+MASK
3 MAGNETIC TUNNEL JUNCTION MATERIALS 348311 1% 100% 3 Search MAGNETIC+TUNNEL+JUNCTION+MATERIALS Search MAGNETIC+TUNNEL+JUNCTION+MATERIALS
4 CL 2 BASED PLASMA 261232 1% 75% 3 Search CL+2+BASED+PLASMA Search CL+2+BASED+PLASMA
5 ETCH PRODUCT 261232 1% 75% 3 Search ETCH+PRODUCT Search ETCH+PRODUCT
6 CH3OH AR 232208 1% 100% 2 Search CH3OH+AR Search CH3OH+AR
7 CH4 O 2 AR GAS 232208 1% 100% 2 Search CH4+O+2+AR+GAS Search CH4+O+2+AR+GAS
8 MAGNETIC TUNNEL JUNCTION STACK 232208 1% 100% 2 Search MAGNETIC+TUNNEL+JUNCTION+STACK Search MAGNETIC+TUNNEL+JUNCTION+STACK
9 CH3OH AR GAS 154804 1% 67% 2 Search CH3OH+AR+GAS Search CH3OH+AR+GAS
10 DRY ETCHING OF COPPER 154804 1% 67% 2 Search DRY+ETCHING+OF+COPPER Search DRY+ETCHING+OF+COPPER

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 KIM, T , CHEN, JKC , CHANG, JP , (2014) THERMODYNAMIC ASSESSMENT AND EXPERIMENTAL VERIFICATION OF REACTIVE ION ETCHING OF MAGNETIC METAL ELEMENTS.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 32. ISSUE 4. P. - 27 69% 1
2 WU, FY , LEVITIN, G , HESS, DW , (2010) PATTERNING OF CU FILMS BY A TWO-STEP PLASMA ETCHING PROCESS AT LOW TEMPERATURE.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 157. ISSUE 4. P. H474 -H478 27 75% 5
3 JEON, MH , KIM, HJ , YANG, KC , KANG, SK , KIM, KN , YEOM, GY , (2013) SELECTIVE ETCHING OF MAGNETIC TUNNEL JUNCTION MATERIALS USING CO/NH3 GAS MIXTURE IN RADIO FREQUENCY PULSE-BIASED INDUCTIVELY COUPLED PLASMAS.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 52. ISSUE 5. P. - 20 74% 6
4 PARK, JY , KANG, SK , JEON, MH , JHON, MS , YEOM, GY , (2011) ETCHING OF COFEB USING COONH3 IN AN INDUCTIVELY COUPLED PLASMA ETCHING SYSTEM.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 158. ISSUE 1. P. H1 -H4 12 92% 19
5 GARAY, AA , CHOI, JH , HWANG, SM , CHUNG, CW , (2015) INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING OF MAGNETIC TUNNEL JUNCTION STACKS IN A CH3COOH/AR GAS.ECS SOLID STATE LETTERS. VOL. 4. ISSUE 10. P. P77 -P79 10 100% 1
6 KIM, EH , LEE, TY , MIN, BC , CHUNG, CW , (2012) HIGH DENSITY PLASMA REACTIVE ION ETCHING OF COFEB MAGNETIC THIN FILMS USING A CH4/AR PLASMA.THIN SOLID FILMS. VOL. 521. ISSUE . P. 216-221 12 86% 3
7 LEE, TY , LEE, IH , CHUNG, CW , (2013) INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING OF MAGNETIC TUNNEL JUNCTION STACKS USING H2O/CH4 MIXTURE.THIN SOLID FILMS. VOL. 547. ISSUE . P. 146-150 13 76% 2
8 HAHN, YB , PEARTON, SJ , CHO, H , LEE, KP , (2001) DRY ETCHING MECHANISM OF COPPER AND MAGNETIC MATERIALS WITH UV ILLUMINATION.MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY. VOL. 79. ISSUE 1. P. 20-26 16 84% 11
9 GARAY, AA , HWANG, SM , CHUNG, CW , (2015) DRY ETCHING OF CO2MNSI MAGNETIC THIN FILMS USING A CH3OH/AR BASED INDUCTIVELY COUPLED PLASMA.VACUUM. VOL. 111. ISSUE . P. 19 -24 12 75% 0
10 WU, FY , LEVITIN, G , HESS, DW , (2011) MECHANISTIC CONSIDERATIONS OF LOW TEMPERATURE HYDROGEN-BASED PLASMA ETCHING OF CU.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 29. ISSUE 1. P. - 19 50% 5

Classes with closest relation at Level 1


Rank Class id link
1 21995 INT JOINT IMTAS//ADSORBATE BONDING//ADSORBATE CHARGES
2 26984 AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION
3 24018 PHYSICOCHIM MOLEC ORSAY//SURFACE STRUCTURE AND ROUGHNESS//ADSORBATE SUBSTRATE INTERACTIONS
4 1352 ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
5 11277 PERFLUORINATED CARBOXYLATES//ZENTRUM MIKROTECHNOL//COPPER FILMS
6 5594 SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING
7 11582 PERPENDICULAR MAGNETIC ANISOTROPY//SPINTRON INTEGRATED SYST//PERPENDICULAR MAGNETIC ANISOTROPY PMA
8 1947 MAGNETIC TUNNEL JUNCTION//TUNNEL MAGNETORESISTANCE//TUNNELING MAGNETORESISTANCE
9 5846 FUJIMI KU//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B//DRY ETCHING
10 33577 DAGUERREOTYPES//HIGH FREQUENCY COLD PLASMA//HF PLASMA

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