Class information for:
Level 1: ATOMIC LAYER ETCHING//NEUTRAL BEAM//NEUTRAL BEAM ETCHING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
21652 411 18.9 64%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
19 4 ASTRONOMY & ASTROPHYSICS//ASTROPHYSICAL JOURNAL//ASTRON 523489
158 3       NUCLEAR FUSION//PHYSICS, FLUIDS & PLASMAS//PLASMA PHYSICS AND CONTROLLED FUSION 61209
1077 2             PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 9920
21652 1                   ATOMIC LAYER ETCHING//NEUTRAL BEAM//NEUTRAL BEAM ETCHING 411

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ATOMIC LAYER ETCHING authKW 429840 2% 64% 9
2 NEUTRAL BEAM authKW 307828 6% 17% 24
3 NEUTRAL BEAM ETCHING authKW 297170 2% 50% 8
4 EBEP authKW 167161 1% 75% 3
5 FLUID SCI address 160422 15% 4% 61
6 ELECTRON BEAM EXCITED PLASMA authKW 157322 1% 35% 6
7 AR NEUTRAL BEAM authKW 148589 0% 100% 2
8 CCD BUSINESS UNITDEV address 148589 0% 100% 2
9 CCD DEV address 148589 0% 100% 2
10 CHARGE BUILD UP DAMAGE authKW 148589 0% 100% 2

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Physics, Applied 7052 82% 0% 336
2 Materials Science, Coatings & Films 3562 21% 0% 88
3 Nanoscience & Nanotechnology 409 11% 0% 47
4 Materials Science, Multidisciplinary 220 19% 0% 78
5 Physics, Condensed Matter 156 12% 0% 50
6 Instruments & Instrumentation 128 6% 0% 26
7 Engineering, Electrical & Electronic 96 11% 0% 47
8 Physics, Fluids & Plasmas 39 3% 0% 12
9 Nuclear Science & Technology 22 3% 0% 12
10 Chemistry, Physical 6 6% 0% 25

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 FLUID SCI 160422 15% 4% 61
2 CCD BUSINESS UNITDEV 148589 0% 100% 2
3 CCD DEV 148589 0% 100% 2
4 ENGN SYNTH BUNKYO KU 148589 0% 100% 2
5 COMPONENT GRP 99058 0% 67% 2
6 INTELLIGENT NANO PROC 99058 0% 67% 2
7 ADV BACK END LINE TECHNOL 74294 0% 100% 1
8 ADV PHOTON MAT 74294 0% 100% 1
9 ARTMENT DISPLAY SEMICOND PHYS 74294 0% 100% 1
10 AUSTIN PLASMA 74294 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 9688 10% 0% 43
2 ACTA POLYTECHNICA SCANDINAVICA-CHEMICAL TECHNOLOGY SERIES 5823 0% 4% 2
3 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 4622 2% 1% 9
4 TECHNICAL PHYSICS 4289 4% 0% 18
5 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 2748 8% 0% 34
6 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 2543 6% 0% 24
7 JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS 1983 4% 0% 18
8 JAPANESE JOURNAL OF APPLIED PHYSICS 1034 4% 0% 15
9 THIN SOLID FILMS 963 5% 0% 22
10 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 756 1% 0% 3

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ATOMIC LAYER ETCHING 429840 2% 64% 9 Search ATOMIC+LAYER+ETCHING Search ATOMIC+LAYER+ETCHING
2 NEUTRAL BEAM 307828 6% 17% 24 Search NEUTRAL+BEAM Search NEUTRAL+BEAM
3 NEUTRAL BEAM ETCHING 297170 2% 50% 8 Search NEUTRAL+BEAM+ETCHING Search NEUTRAL+BEAM+ETCHING
4 EBEP 167161 1% 75% 3 Search EBEP Search EBEP
5 ELECTRON BEAM EXCITED PLASMA 157322 1% 35% 6 Search ELECTRON+BEAM+EXCITED+PLASMA Search ELECTRON+BEAM+EXCITED+PLASMA
6 AR NEUTRAL BEAM 148589 0% 100% 2 Search AR+NEUTRAL+BEAM Search AR+NEUTRAL+BEAM
7 CHARGE BUILD UP DAMAGE 148589 0% 100% 2 Search CHARGE+BUILD+UP+DAMAGE Search CHARGE+BUILD+UP+DAMAGE
8 CURRENT BALANCE EQUATION 148589 0% 100% 2 Search CURRENT+BALANCE+EQUATION Search CURRENT+BALANCE+EQUATION
9 HYPER THERMAL NEUTRAL BEAM 148589 0% 100% 2 Search HYPER+THERMAL+NEUTRAL+BEAM Search HYPER+THERMAL+NEUTRAL+BEAM
10 LOW ANGLE REFLECTION 148589 0% 100% 2 Search LOW+ANGLE+REFLECTION Search LOW+ANGLE+REFLECTION

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 KANARIK, KJ , LILL, T , HUDSON, EA , SRIRAMAN, S , TAN, S , MARKS, J , VAHEDI, V , GOTTSCHO, RA , (2015) OVERVIEW OF ATOMIC LAYER ETCHING IN THE SEMICONDUCTOR INDUSTRY.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 33. ISSUE 2. P. - 43 48% 27
2 OEHRLEIN, GS , METZLER, D , LI, C , (2015) ATOMIC LAYER ETCHING AT THE TIPPING POINT: AN OVERVIEW.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 6. P. N5041 -N5053 41 38% 15
3 HARA, Y , HAMAGAKI, M , MISE, T , IWATA, N , HARA, T , (2014) SI ETCHING WITH REACTIVE NEUTRAL BEAMS OF VERY LOW ENERGY.JOURNAL OF APPLIED PHYSICS. VOL. 116. ISSUE 22. P. - 20 95% 0
4 LEE, Y , GEORGE, SM , (2015) ATOMIC LAYER ETCHING OF AL2O3 USING SEQUENTIAL, SELF-LIMITING THERMAL REACTIONS WITH SN(ACAC)(2) AND HYDROGEN FLUORIDE.ACS NANO. VOL. 9. ISSUE 2. P. 2061 -2070 22 59% 6
5 HARA, Y , HAMAGAKI, M , MISE, T , HARA, T , (2011) DEVELOPMENT OF NEUTRAL BEAM SOURCE USING ELECTRON BEAM EXCITED PLASMA.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 50. ISSUE 10. P. - 19 83% 0
6 LEE, Y , DUMONT, JW , GEORGE, SM , (2015) ATOMIC LAYER ETCHING OF ALF3 USING SEQUENTIAL, SELF-LIMITING THERMAL REACTIONS WITH SN(ACAC)(2) AND HYDROGEN FLUORIDE.JOURNAL OF PHYSICAL CHEMISTRY C. VOL. 119. ISSUE 45. P. 25385 -25393 22 59% 0
7 KUBOTA, T , NUKAGA, O , UEKI, S , SUGIYAMA, M , INAMOTO, Y , OHTAKE, H , SAMUKAWA, S , (2010) 200-MM-DIAMETER NEUTRAL BEAM SOURCE BASED ON INDUCTIVELY COUPLED PLASMA ETCHER AND SILICON ETCHING.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 28. ISSUE 5. P. 1169-1174 19 70% 4
8 ICHIKI, K , HATAKEYAMA, M , (2008) CHARACTERIZATION OF NEUTRAL BEAM SOURCE USING DC COLD CATHODE DISCHARGE AND ITS APPLICATION PROCESSES.JOURNAL OF PHYSICS D-APPLIED PHYSICS. VOL. 41. ISSUE 2. P. - 21 66% 5
9 LEE, Y , DUMONT, JW , GEORGE, SM , (2015) MECHANISM OF THERMAL AL2O3 ATOMIC LAYER ETCHING USING SEQUENTIAL REACTIONS WITH SN(ACAC)(2) AND HF.CHEMISTRY OF MATERIALS. VOL. 27. ISSUE 10. P. 3648 -3657 21 50% 1
10 ECONOMOU, DJ , (2008) FAST (TENS TO HUNDREDS OF EV) NEUTRAL BEAMS FOR MATERIALS PROCESSING.JOURNAL OF PHYSICS D-APPLIED PHYSICS. VOL. 41. ISSUE 2. P. - 29 42% 13

Classes with closest relation at Level 1


Rank Class id link
1 1352 ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
2 24018 PHYSICOCHIM MOLEC ORSAY//SURFACE STRUCTURE AND ROUGHNESS//ADSORBATE SUBSTRATE INTERACTIONS
3 17198 GATE CHARGING//PLASMA CHARGING DAMAGE//CHARGING DAMAGE
4 5846 FUJIMI KU//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B//DRY ETCHING
5 24369 NITROGEN TRIFLUORIDE//DIFLUOROALKYLAMINES//CHEMICAL DRY ETCHING
6 20121 PLASMA ELECTRON SOURCE//CHEMICAL COMPOSITION OF THE SURFACE//ELECTRON BEAM EB EXCITED PLASMA
7 26085 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS
8 5594 SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING
9 7686 OXFORD UNIT//PLASMA SHEATHS//SHEATH
10 12287 ECR PLASMA//UNIFORM PLASMA//ELECTRON CYCLOTRON RESONANCE DISCHARGE

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