Class information for:
Level 1: PLANE PLASMA DISCHARGE//ENERGY INFLUX//DRY DEVELOPMENT

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
19470 504 17.6 50%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
19 4 ASTRONOMY & ASTROPHYSICS//ASTROPHYSICAL JOURNAL//ASTRON 523489
158 3       NUCLEAR FUSION//PHYSICS, FLUIDS & PLASMAS//PLASMA PHYSICS AND CONTROLLED FUSION 61209
1077 2             PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 9920
19470 1                   PLANE PLASMA DISCHARGE//ENERGY INFLUX//DRY DEVELOPMENT 504

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 PLANE PLASMA DISCHARGE authKW 181755 1% 100% 3
2 ENERGY INFLUX authKW 161557 1% 67% 4
3 DRY DEVELOPMENT authKW 128290 1% 35% 6
4 CH4 CF4 PLASMAS authKW 121170 0% 100% 2
5 IN SITU GRAZING INCIDENCE X RAY DIFFRACTOMETRY GIXRD authKW 121170 0% 100% 2
6 IN SITU GRAZING INCIDENCE X RAY REFLECTOMETRY GIXR authKW 121170 0% 100% 2
7 REAL TIME TEMPERATURE MEASUREMENTS authKW 121170 0% 100% 2
8 SHEATH HEAT FLUX authKW 121170 0% 100% 2
9 THERMAL PROBE authKW 109039 2% 20% 9
10 RESIST TRIMMING authKW 90874 1% 50% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Physics, Applied 4429 60% 0% 300
2 Materials Science, Coatings & Films 4049 21% 0% 104
3 Nanoscience & Nanotechnology 452 11% 0% 55
4 Physics, Fluids & Plasmas 420 8% 0% 38
5 Engineering, Electrical & Electronic 276 16% 0% 80
6 Electrochemistry 203 6% 0% 30
7 Instruments & Instrumentation 170 7% 0% 33
8 Physics, Condensed Matter 152 11% 0% 56
9 Materials Science, Multidisciplinary 132 14% 0% 73
10 Optics 49 6% 0% 28

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV INTEGRATED CIRCUIT PACKAGING GRP 60585 0% 100% 1
2 ANAL SPECT PLASMAS 60585 0% 100% 1
3 C4 GRP LOG TECHNOL DEV LTD 60585 0% 100% 1
4 ELECT COMPONENTS TECHNOL MAT ECTM DIMES 60585 0% 100% 1
5 ENGN ELECT ELECT COMMUN 60585 0% 100% 1
6 FAB TECH TEAM 1 60585 0% 100% 1
7 FABRICAT PROC INTEGRAT 60585 0% 100% 1
8 HL MI 60585 0% 100% 1
9 LEHRSTUHL OBERFLACHENWISSEN AFT 60585 0% 100% 1
10 PLASMA TECHNOL SUR ES PLATO 60585 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 HIGH ENERGY CHEMISTRY 28429 7% 1% 36
2 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 5515 7% 0% 36
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 5222 8% 0% 38
4 SOLID STATE TECHNOLOGY 3255 2% 1% 10
5 SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY 3060 1% 1% 4
6 CONTRIBUTIONS TO PLASMA PHYSICS 2444 2% 0% 10
7 PLASMA DEVICES AND OPERATIONS 1928 1% 1% 3
8 VACUUM 1610 3% 0% 16
9 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 1394 5% 0% 27
10 INSTRUMENTS AND EXPERIMENTAL TECHNIQUES 1214 2% 0% 9

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 PLANE PLASMA DISCHARGE 181755 1% 100% 3 Search PLANE+PLASMA+DISCHARGE Search PLANE+PLASMA+DISCHARGE
2 ENERGY INFLUX 161557 1% 67% 4 Search ENERGY+INFLUX Search ENERGY+INFLUX
3 DRY DEVELOPMENT 128290 1% 35% 6 Search DRY+DEVELOPMENT Search DRY+DEVELOPMENT
4 CH4 CF4 PLASMAS 121170 0% 100% 2 Search CH4+CF4+PLASMAS Search CH4+CF4+PLASMAS
5 IN SITU GRAZING INCIDENCE X RAY DIFFRACTOMETRY GIXRD 121170 0% 100% 2 Search IN+SITU+GRAZING+INCIDENCE+X+RAY+DIFFRACTOMETRY+GIXRD Search IN+SITU+GRAZING+INCIDENCE+X+RAY+DIFFRACTOMETRY+GIXRD
6 IN SITU GRAZING INCIDENCE X RAY REFLECTOMETRY GIXR 121170 0% 100% 2 Search IN+SITU+GRAZING+INCIDENCE+X+RAY+REFLECTOMETRY+GIXR Search IN+SITU+GRAZING+INCIDENCE+X+RAY+REFLECTOMETRY+GIXR
7 REAL TIME TEMPERATURE MEASUREMENTS 121170 0% 100% 2 Search REAL+TIME+TEMPERATURE+MEASUREMENTS Search REAL+TIME+TEMPERATURE+MEASUREMENTS
8 SHEATH HEAT FLUX 121170 0% 100% 2 Search SHEATH+HEAT+FLUX Search SHEATH+HEAT+FLUX
9 THERMAL PROBE 109039 2% 20% 9 Search THERMAL+PROBE Search THERMAL+PROBE
10 RESIST TRIMMING 90874 1% 50% 3 Search RESIST+TRIMMING Search RESIST+TRIMMING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 TSUTSUMI, T , ISHIKAWA, K , TAKEDA, K , KONDO, H , OHTA, T , ITO, M , SEKINE, M , HORI, M , (2016) REAL-TIME TEMPERATURE MONITORING OF SI SUBSTRATE DURING PLASMA PROCESSING AND ITS HEAT-FLUX ANALYSIS.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 55. ISSUE 1. P. - 20 63% 0
2 BORNHOLDT, S , KERSTEN, H , (2013) TRANSIENT CALORIMETRIC DIAGNOSTICS FOR PLASMA PROCESSING.EUROPEAN PHYSICAL JOURNAL D. VOL. 67. ISSUE 8. P. - 19 58% 2
3 KERSTEN, H , DEUTSCH, H , STEFFEN, H , KROESEN, GMW , HIPPLER, R , (2001) THE ENERGY BALANCE AT SUBSTRATE SURFACES DURING PLASMA PROCESSING.VACUUM. VOL. 63. ISSUE 3. P. 385 -431 29 37% 164
4 STAHL, M , TROTTENBERG, T , KERSTEN, H , (2010) A CALORIMETRIC PROBE FOR PLASMA DIAGNOSTICS.REVIEW OF SCIENTIFIC INSTRUMENTS. VOL. 81. ISSUE 2. P. - 13 68% 25
5 FROHLICH, M , BORNHOLDT, S , REGULA, C , IHDE, J , KERSTEN, H , (2014) DETERMINATION OF THE ENERGY FLUX OF A COMMERCIAL ATMOSPHERIC-PRESSURE PLASMA JET FOR DIFFERENT PROCESS GASES AND DISTANCES BETWEEN NOZZLE OUTLET AND SUBSTRATE SURFACE.CONTRIBUTIONS TO PLASMA PHYSICS. VOL. 54. ISSUE 2. P. 155-161 12 63% 2
6 KOSHIMIZU, C , OHTA, T , MATSUDO, T , TUCHITANI, S , ITO, M , (2010) LOW-COHERENCE INTERFEROMETRY-BASED NON-CONTACT TEMPERATURE MONITORING OF A SILICON WAFER AND CHAMBER PARTS DURING PLASMA ETCHING.APPLIED PHYSICS EXPRESS. VOL. 3. ISSUE 5. P. - 12 67% 2
7 KOSHIMIZU, C , OHTA, T , MATSUDO, T , TSUCHITANI, S , ITO, M , (2012) SIMULTANEOUS IN SITU MEASUREMENT OF SILICON SUBSTRATE TEMPERATURE AND SILICON DIOXIDE FILM THICKNESS DURING PLASMA ETCHING OF SILICON DIOXIDE USING LOW-COHERENCE INTERFEROMETRY.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 51. ISSUE 4. P. - 14 52% 0
8 TITOV, VA , RYBKIN, VV , SMIRNOV, SA , (2009) PHYSICOCHEMICAL PROCESSES IN THE NONEQUILIBRIUM PLASMA-POLYMER SYSTEM.HIGH ENERGY CHEMISTRY. VOL. 43. ISSUE 3. P. 172-180 13 59% 0
9 MUKAIGAWA, S , KANNO, S , TAKAKI, K , FUJIWARA, T , (2003) MEASUREMENTS OF HEAT FLUX DISTRIBUTION TOWARD SUBSTRATE BY MEANS OF THE LINBO3 INTERFEROMETER, AND ELECTRON DENSITY IN A CAPACITIVELY COUPLED RF DISCHARGE PLASMA.NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS. VOL. 206. ISSUE . P. 777-781 9 100% 1
10 OHTA, T , KOSHIMIZU, C , KAWASAKI, K , TAKEDA, K , ITO, M , (2009) SIMULTANEOUS MEASUREMENT OF SUBSTRATE TEMPERATURE AND THIN-FILM THICKNESS ON SIO2/SI WAFER USING OPTICAL-FIBER-TYPE LOW-COHERENCE INTERFEROMETRY.JOURNAL OF APPLIED PHYSICS. VOL. 105. ISSUE 1. P. - 10 71% 4

Classes with closest relation at Level 1


Rank Class id link
1 34813 ELECTROSTATIC CHUCK//PIN CHUCK//WAFER FLATNESS
2 8140 SOLID STATE TECHNOLOGY//DRY DEVELOPMENT//WT ADDITIVITY
3 5594 SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING
4 1352 ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
5 19085 PHOTORESIST REMOVAL//RESIST REMOVAL//ORGANIC CONTAMINATION
6 21961 RAPID THERMAL PROCESSING//RAPID THERMAL PROCESSING RTP//SILICON NANOELECT
7 14389 ABSORBING FILMS//ROTATING POLARIZER ANALYZER ELLIPSOMETER//ULTRATHIN DIELECTRIC LAYER
8 2130 HIPIMS//HPPMS//HIGH POWER IMPULSE MAGNETRON SPUTTERING
9 32698 AS EURATOM MHEST//CRACKING COEFFICIENTS//AMORPHOUS FILMS A C D
10 24686 LOW TEMPERATURE SILICON OXIDATION//DIRECTIONAL OXIDATION//HIGH RATE SILICON OXIDATION

Go to start page