Class information for:
Level 1: 007 MICROMETER TECHNOLOGIES//05 MICROMETER TECHNOLOGIES//5 LAYERS OF METAL

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
23664 339 13.0 35%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
6 3       PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON 155028
532 2             IEEE TRANSACTIONS ON ELECTRON DEVICES//MOSFET//FINFET 14860
23664 1                   007 MICROMETER TECHNOLOGIES//05 MICROMETER TECHNOLOGIES//5 LAYERS OF METAL 339

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 007 MICROMETER TECHNOLOGIES authKW 90074 0% 100% 1
2 05 MICROMETER TECHNOLOGIES authKW 90074 0% 100% 1
3 5 LAYERS OF METAL authKW 90074 0% 100% 1
4 5LM authKW 90074 0% 100% 1
5 AU PATTERNING authKW 90074 0% 100% 1
6 BIT LINE STRESS TIME authKW 90074 0% 100% 1
7 CCD CMOS TECHNOLOGIES authKW 90074 0% 100% 1
8 CHEMICAL MECHANICAL POLISHING TECHNOLOGY authKW 90074 0% 100% 1
9 CMP TECHNOLOGY authKW 90074 0% 100% 1
10 DS LOCOS authKW 90074 0% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Electrical & Electronic 2133 47% 0% 158
2 Materials Science, Coatings & Films 1920 17% 0% 59
3 Physics, Applied 1691 46% 0% 155
4 Electrochemistry 1057 15% 0% 52
5 Physics, Condensed Matter 143 13% 0% 43
6 Nanoscience & Nanotechnology 35 4% 0% 15
7 COMPUTER APPLICATIONS & CYBERNETICS 33 0% 0% 1
8 Telecommunications 26 3% 0% 10
9 Materials Science, Multidisciplinary 23 9% 0% 32
10 Computer Science, Hardware & Architecture 23 2% 0% 6

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 INFOTAINMENT MULTIMEDIA TELEMATICS PROD 90074 0% 100% 1
2 MACRO COMPONENTS ORG 90074 0% 100% 1
3 NANOFABRICATION IL 90074 0% 100% 1
4 AV HARDWARE BRANCH 45036 0% 50% 1
5 MAT SEMICOND DEVICES 45036 0% 50% 1
6 KITA ITAMI ADM 30023 0% 33% 1
7 UMR7606 9006 0% 10% 1
8 ELE S 6432 0% 7% 1
9 CHARACTERIZAT TECHNOL GRP 4739 0% 5% 1
10 SEMICOND ADV 2904 0% 3% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 EDN 27937 3% 3% 9
2 IEEE TRANSACTIONS ON ELECTRON DEVICES 12002 13% 0% 45
3 SOLID STATE TECHNOLOGY 8203 4% 1% 13
4 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 7195 14% 0% 49
5 IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII RADIOELEKTRONIKA 2572 1% 1% 5
6 ELECTRONIC DESIGN 2473 1% 1% 3
7 IEEE ELECTRON DEVICE LETTERS 1942 4% 0% 14
8 JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING 941 1% 0% 3
9 ELECTRONICS 920 1% 1% 2
10 IEEE INTERNATIONAL SOLID STATE CIRCUITS CONFERENCE 856 0% 1% 1

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 007 MICROMETER TECHNOLOGIES 90074 0% 100% 1 Search 007+MICROMETER+TECHNOLOGIES Search 007+MICROMETER+TECHNOLOGIES
2 05 MICROMETER TECHNOLOGIES 90074 0% 100% 1 Search 05+MICROMETER+TECHNOLOGIES Search 05+MICROMETER+TECHNOLOGIES
3 5 LAYERS OF METAL 90074 0% 100% 1 Search 5+LAYERS+OF+METAL Search 5+LAYERS+OF+METAL
4 5LM 90074 0% 100% 1 Search 5LM Search 5LM
5 AU PATTERNING 90074 0% 100% 1 Search AU+PATTERNING Search AU+PATTERNING
6 BIT LINE STRESS TIME 90074 0% 100% 1 Search BIT+LINE+STRESS+TIME Search BIT+LINE+STRESS+TIME
7 CCD CMOS TECHNOLOGIES 90074 0% 100% 1 Search CCD+CMOS+TECHNOLOGIES Search CCD+CMOS+TECHNOLOGIES
8 CHEMICAL MECHANICAL POLISHING TECHNOLOGY 90074 0% 100% 1 Search CHEMICAL+MECHANICAL+POLISHING+TECHNOLOGY Search CHEMICAL+MECHANICAL+POLISHING+TECHNOLOGY
9 CMP TECHNOLOGY 90074 0% 100% 1 Search CMP+TECHNOLOGY Search CMP+TECHNOLOGY
10 DS LOCOS 90074 0% 100% 1 Search DS+LOCOS Search DS+LOCOS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 BELLUTTI, P , BOSCARDIN, M , SONCINI, G , ZEN, M , ZORZI, N , (1995) DW-LOCOS - A CONVENIENT VLSI ISOLATION TECHNIQUE.SEMICONDUCTOR SCIENCE AND TECHNOLOGY. VOL. 10. ISSUE 12. P. 1700-1705 14 100% 4
2 ROTH, SS , RAY, WJ , MAZURE, C , COOPER, K , KIRSCH, HC , GUNDERSON, CD , KO, J , (1992) CHARACTERIZATION OF POLYSILICON-ENCAPSULATED LOCAL OXIDATION.IEEE TRANSACTIONS ON ELECTRON DEVICES. VOL. 39. ISSUE 5. P. 1085-1089 14 100% 11
3 JUANG, MH , (1999) TRADE-OFF AND PROCESS CONSIDERATION FOR SCALABLE POLY-SI BUFFERED LOCOS TECHNOLOGY.SOLID-STATE ELECTRONICS. VOL. 43. ISSUE 11. P. 2067-2073 8 100% 1
4 HASHIMOTO, M , KOREEDA, T , KOSHIDA, N , KOMURO, M , ATODA, N , (1998) APPLICATION OF DUAL-FUNCTIONAL MOO3/WO3 BILAYER RESISTS TO FOCUSED ION BEAM NANOLITHOGRAPHY.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 16. ISSUE 5. P. 2767 -2771 6 100% 8
5 KAL, S , (1994) ISOLATION TECHNOLOGY IN MONOLITHIC INTEGRATED-CIRCUITS - AN OVERVIEW.IETE TECHNICAL REVIEW. VOL. 11. ISSUE 2-3. P. 91 -103 13 54% 0
6 COOPER, KJ , ROTH, SS , RAY, W , KIRSCH, HC , KO, J , (1991) RECESSED POLYSILICON ENCAPSULATED LOCAL OXIDATION.IEEE ELECTRON DEVICE LETTERS. VOL. 12. ISSUE 10. P. 515-517 8 100% 0
7 MIS, JD , MADER, SR , BESHERS, DN , (1993) EFFECTS OF A STRESS-FIELD ON BORON ION-IMPLANTATION DAMAGE IN SILICON.JOURNAL OF APPLIED PHYSICS. VOL. 74. ISSUE 4. P. 2294-2299 7 100% 1
8 DELEONIBUS, S , (1997) IS THERE LOCOS AFTER LOCOS?.SOLID-STATE ELECTRONICS. VOL. 41. ISSUE 7. P. 1027 -1039 7 78% 3
9 ROTH, SS , COOPER, KJ , RAY, W , KIRSCH, HC , GROVE, C , (1994) OFFSET TRENCH ISOLATION.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 141. ISSUE 8. P. 2178-2181 7 88% 0
10 MATHEWS, VK , FAZAN, PC , MADDOX, RL , (1994) RESIDUES, POLYCRYSTALLINE SILICON VOIDS, AND ACTIVE AREA DAMAGE WITH THE POLYCRYSTALLINE SILICON BUFFERED LOCAL OXIDATION OF SILICON ISOLATION PROCESS.APPLIED PHYSICS LETTERS. VOL. 64. ISSUE 1. P. 94-96 6 100% 2

Classes with closest relation at Level 1


Rank Class id link
1 21308 BEAM CHANNEL TRANSISTOR//MEMORY DEVICE BUSINESS//IMPURITY ENHANCED OXIDATION
2 18266 CERAM PHYS//RIN//PIEZOSPECTROSCOPY
3 3635 SI OXIDATION//SILICON OXIDATION//SIO2 SI INTERFACE
4 26157 VERTICAL MOSFET//GROOVED GATE MOSFET//FILLET LOCAL OXIDATION FILOX
5 21911 POLYOXIDE//INTER POLY DIELECTRIC IPD//INTERPOLY OXIDE
6 21285 SOFT ERROR MAPPING//HIGH ENERGY ION IMPLANTATION//DYNAMIC RANDOM ACCESS MEMORY
7 32331 CL IMAGE CONTRAST//ELECTRO PHYSICAL MEASUREMENTS//FINE DISPERSED STRUCTURE
8 6002 BORON PENETRATION//NITRIDED OXIDE//OXYNITRIDATION
9 7303 BIPOLAR TRANSISTORS//IEEE TRANSACTIONS ON ELECTRON DEVICES//POLYSILICON EMITTER
10 28322 ULTRAMICROTOMY//LOW ANGLE ION MILLING//MAT SCI PROD TECHNOL

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