Class information for:
Level 1: RAPID THERMAL PROCESSING//RAPID THERMAL PROCESSING RTP//SILICON NANOELECT

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
21961 399 18.5 43%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
6 3       PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON 155028
3506 2             RAPID THERMAL PROCESSING//RAPID THERMAL PROCESSING RTP//WAFER TEMPERATURE UNIFORMITY 1431
21961 1                   RAPID THERMAL PROCESSING//RAPID THERMAL PROCESSING RTP//SILICON NANOELECT 399

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 RAPID THERMAL PROCESSING authKW 656288 10% 21% 41
2 RAPID THERMAL PROCESSING RTP authKW 600202 5% 39% 20
3 SILICON NANOELECT address 272094 2% 44% 8
4 THERMAL BUDGET CONTROL authKW 229587 1% 100% 3
5 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING journal 176264 15% 4% 60
6 SIMS DEPTH PROFILE authKW 173924 1% 45% 5
7 RAPID ISOTHERMAL PROCESSING RIP authKW 172189 1% 75% 3
8 RAPID PHOTOTHERMAL PROCESSING authKW 172189 1% 75% 3
9 WAFER TEMPERATURE UNIFORMITY authKW 172189 1% 75% 3
10 RTP authKW 165021 4% 13% 17

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 3927 17% 0% 69
2 Physics, Applied 3125 56% 0% 225
3 Engineering, Electrical & Electronic 1556 37% 0% 149
4 Physics, Condensed Matter 976 27% 0% 108
5 Materials Science, Coatings & Films 755 10% 0% 41
6 Thermodynamics 254 7% 0% 28
7 Materials Science, Multidisciplinary 246 20% 0% 80
8 Electrochemistry 149 6% 0% 23
9 Automation & Control Systems 123 4% 0% 16
10 Mechanics 84 6% 0% 24

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SILICON NANOELECT 272094 2% 44% 8
2 OBERFLACHEN ICHTENANALYT 153058 1% 100% 2
3 RTP PROD BUSINESS UNIT 102037 1% 67% 2
4 CAVEVDISH MICROELECT 76529 0% 100% 1
5 CEGELY LYON 76529 0% 100% 1
6 CHEM SYST ENGN ADV MAT 76529 0% 100% 1
7 DAINIPPON SCREEN MFG CO LTD 76529 0% 100% 1
8 NEXREAL INC 76529 0% 100% 1
9 OLL MECH AEROSP ENGN 76529 0% 100% 1
10 SOLAIRE FELIX TROMBE 76529 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 176264 15% 4% 60
2 SOLID STATE TECHNOLOGY 8080 4% 1% 14
3 JOURNAL OF ELECTRONIC MATERIALS 2255 4% 0% 17
4 INTERNATIONAL JOURNAL OF THERMOPHYSICS 1795 3% 0% 10
5 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 1769 1% 1% 3
6 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 1319 6% 0% 23
7 IEEE TRANSACTIONS ON ELECTRON DEVICES 592 3% 0% 11
8 MICRO 433 0% 1% 1
9 MICROSCALE THERMOPHYSICAL ENGINEERING 379 0% 0% 1
10 OPTO-ELECTRONICS REVIEW 373 1% 0% 2

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 RAPID THERMAL PROCESSING 656288 10% 21% 41 Search RAPID+THERMAL+PROCESSING Search RAPID+THERMAL+PROCESSING
2 RAPID THERMAL PROCESSING RTP 600202 5% 39% 20 Search RAPID+THERMAL+PROCESSING+RTP Search RAPID+THERMAL+PROCESSING+RTP
3 THERMAL BUDGET CONTROL 229587 1% 100% 3 Search THERMAL+BUDGET+CONTROL Search THERMAL+BUDGET+CONTROL
4 SIMS DEPTH PROFILE 173924 1% 45% 5 Search SIMS+DEPTH+PROFILE Search SIMS+DEPTH+PROFILE
5 RAPID ISOTHERMAL PROCESSING RIP 172189 1% 75% 3 Search RAPID+ISOTHERMAL+PROCESSING+RIP Search RAPID+ISOTHERMAL+PROCESSING+RIP
6 RAPID PHOTOTHERMAL PROCESSING 172189 1% 75% 3 Search RAPID+PHOTOTHERMAL+PROCESSING Search RAPID+PHOTOTHERMAL+PROCESSING
7 WAFER TEMPERATURE UNIFORMITY 172189 1% 75% 3 Search WAFER+TEMPERATURE+UNIFORMITY Search WAFER+TEMPERATURE+UNIFORMITY
8 RTP 165021 4% 13% 17 Search RTP Search RTP
9 12 IN SILICON WAFER 153058 1% 100% 2 Search 12+IN+SILICON+WAFER Search 12+IN+SILICON+WAFER
10 EMISSIVITY SETTING 153058 1% 100% 2 Search EMISSIVITY+SETTING Search EMISSIVITY+SETTING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 LOGERAIS, PO , RIOU, O , DELALEUX, F , DURASTANTI, JF , BOUTEVILLE, A , (2015) IMPROVEMENT OF TEMPERATURE HOMOGENEITY OF A SILICON WAFER HEATED IN A RAPID THERMAL SYSTEM (RTP: RAPID THERMAL PROCESS) BY A FILTERING WINDOW.APPLIED THERMAL ENGINEERING. VOL. 77. ISSUE . P. 76 -89 21 68% 1
2 HUNG, SY , CHAO, CK , (2005) THERMAL STRESS ANALYSIS FOR RAPID THERMAL PROCESS WITH CONVECTIVE COOLING.JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME. VOL. 127. ISSUE 3. P. 564-571 19 95% 1
3 LIN, S , CHU, HS , (2002) APPLICATION OF INVERSE PROBLEM ALGORITHM FOR TEMPERATURE UNIFORMITY IN RAPID THERMAL PROCESSING.THIN SOLID FILMS. VOL. 402. ISSUE 1-2. P. 280 -289 20 83% 2
4 HABUKA, H , WADA, T , SAKURAI, T , TAKEUCHI, T , AIHARA, M , (2005) HEAT BALANCE EVALUATION FOR RAPID THERMAL PROCESSING SYSTEM DESIGN.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 152. ISSUE 12. P. G924-G928 17 77% 4
5 TOYODA, Y , SEO, T , IUCHI, T , (2014) NON-CONTACT TEMPERATURE MEASUREMENT OF SILICON WAFERS BASED ON THE COMBINED USE OF TRANSMITTANCE AND RADIANCE.MEASUREMENT. VOL. 51. ISSUE . P. 393 -399 10 100% 0
6 LIN, S , CHU, HS , (2000) USING INVERSE MODELING TO ESTIMATE THE INCIDENT HEAT FLUX REQUIRED TO ACHIEVE TEMPERATURE UNIFORMITY ACROSS A CIRCULAR DISK.MICROSCALE THERMOPHYSICAL ENGINEERING. VOL. 4. ISSUE 4. P. 245-260 17 85% 1
7 LU, XJ , LI, HX , YUAN, X , (2010) PSO-BASED INTELLIGENT INTEGRATION OF DESIGN AND CONTROL FOR ONE KIND OF CURING PROCESS.JOURNAL OF PROCESS CONTROL. VOL. 20. ISSUE 10. P. 1116 -1125 16 62% 9
8 LEE, BH , KIM, J , JI, S , LEE, S , LEE, KS , (2016) DESIGN OF A DECENTRALIZED CONTROLLER FOR A GLASS RTP SYSTEM.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 29. ISSUE 1. P. 1 -8 10 83% 0
9 JENG, JC , CHEN, WC , (2013) CONTROL STRATEGIES FOR THERMAL BUDGET AND TEMPERATURE UNIFORMITY IN SPIKE RAPID THERMAL PROCESSING SYSTEMS.COMPUTERS & CHEMICAL ENGINEERING. VOL. 57. ISSUE . P. 141 -150 13 65% 4
10 HUANG, CJ , YU, CC , SHEN, SH , (2000) IDENTIFICATION AND NONLINEAR CONTROL FOR RAPID THERMAL PROCESSOR.JOURNAL OF THE CHINESE INSTITUTE OF CHEMICAL ENGINEERS. VOL. 31. ISSUE 6. P. 585-594 16 76% 2

Classes with closest relation at Level 1


Rank Class id link
1 10828 EPITAXIAL REACTOR//MOCVD REACTOR//PLANETARY REACTOR
2 12204 RUN TO RUN CONTROL//VIRTUAL METROLOGY//IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
3 19470 PLANE PLASMA DISCHARGE//ENERGY INFLUX//DRY DEVELOPMENT
4 34813 ELECTROSTATIC CHUCK//PIN CHUCK//WAFER FLATNESS
5 30685 ULTRASHALLOW JUNCTIONS//A REDUCTION METHOD//BORON CHEMICAL VAPOR DEPOSITION
6 14259 SPECTRAL EMISSIVITY//EMISSIVITY//TRUE TEMPERATURE
7 35503 ACCLIMATIZATION CHAMBER//ADAPTIVE FRONTLIGHT SYSTEM//AIR VEHICLES DIRECTORATE AFRL VA
8 36089 CHARACTERISTIC TESTING METHOD//DIFFUS TEAM//GATE TURN OFF GTO THYRISTORS
9 771 TRANSIENT ENHANCED DIFFUSION//SHALLOW JUNCTION//SWAMP
10 29166 TRANSPARENT INSULATION MATERIALS//TRANSPARENT INSULATION//ADVANCED GLAZINGS

Go to start page