Class information for:
Level 1: ELECTROSTATIC CHUCK//PIN CHUCK//WAFER FLATNESS

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
34813 106 9.8 46%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
19 4 ASTRONOMY & ASTROPHYSICS//ASTROPHYSICAL JOURNAL//ASTRON 523489
158 3       NUCLEAR FUSION//PHYSICS, FLUIDS & PLASMAS//PLASMA PHYSICS AND CONTROLLED FUSION 61209
1077 2             PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 9920
34813 1                   ELECTROSTATIC CHUCK//PIN CHUCK//WAFER FLATNESS 106

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECTROSTATIC CHUCK authKW 2318282 12% 62% 13
2 PIN CHUCK authKW 2304575 8% 100% 8
3 WAFER FLATNESS authKW 1800441 9% 63% 10
4 VACUUM PIN CHUCK authKW 1440359 5% 100% 5
5 WAFER GEOMETRY authKW 1200298 5% 83% 5
6 CHUCKING ACCURACY authKW 864215 3% 100% 3
7 FLATTENING ABILITY authKW 864215 3% 100% 3
8 PIN PITCH authKW 864215 3% 100% 3
9 SURFSCAN ADE address 768189 4% 67% 4
10 MASK CHUCK authKW 576144 2% 100% 2

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Nanoscience & Nanotechnology 2445 51% 0% 54
2 Physics, Applied 1232 68% 0% 72
3 Engineering, Electrical & Electronic 1193 61% 0% 65
4 Optics 772 36% 0% 38
5 Engineering, Manufacturing 243 8% 0% 9
6 Materials Science, Coatings & Films 104 8% 0% 8
7 Materials Science, Ceramics 52 5% 0% 5
8 Spectroscopy 51 7% 0% 7
9 Materials Science, Multidisciplinary 43 17% 0% 18
10 Physics, Condensed Matter 41 12% 0% 13

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SURFSCAN ADE 768189 4% 67% 4
2 LITHOG TECHNOL GRP 288072 1% 100% 1
3 PARAMET SOLUT 288072 1% 100% 1
4 WAFER BUSINESS UNIT 288072 1% 100% 1
5 KASADO 288070 2% 50% 2
6 CIVIL ENGN STRUCT ENGN MECH MAT 144035 1% 50% 1
7 EQUIPMENT INNOVAT TEAM 144035 1% 50% 1
8 MICRO SYST INTEGRAT S 144035 1% 50% 1
9 UTSUNOMIYA OPT PROD OPERAT 144035 1% 50% 1
10 IOF 103701 3% 12% 3

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS 30922 9% 1% 10
2 MICROELECTRONIC ENGINEERING 12550 20% 0% 21
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 6937 19% 0% 20
4 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 4601 5% 0% 5
5 SOLID STATE TECHNOLOGY 3883 5% 0% 5
6 PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS 2619 7% 0% 7
7 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS 1703 1% 1% 1
8 NIPPON SERAMIKKUSU KYOKAI GAKUJUTSU RONBUNSHI-JOURNAL OF THE CERAMIC SOCIETY OF JAPAN 834 2% 0% 2
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 320 4% 0% 4
10 KEY ENGINEERING MATERIALS 258 3% 0% 3

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ELECTROSTATIC CHUCK 2318282 12% 62% 13 Search ELECTROSTATIC+CHUCK Search ELECTROSTATIC+CHUCK
2 PIN CHUCK 2304575 8% 100% 8 Search PIN+CHUCK Search PIN+CHUCK
3 WAFER FLATNESS 1800441 9% 63% 10 Search WAFER+FLATNESS Search WAFER+FLATNESS
4 VACUUM PIN CHUCK 1440359 5% 100% 5 Search VACUUM+PIN+CHUCK Search VACUUM+PIN+CHUCK
5 WAFER GEOMETRY 1200298 5% 83% 5 Search WAFER+GEOMETRY Search WAFER+GEOMETRY
6 CHUCKING ACCURACY 864215 3% 100% 3 Search CHUCKING+ACCURACY Search CHUCKING+ACCURACY
7 FLATTENING ABILITY 864215 3% 100% 3 Search FLATTENING+ABILITY Search FLATTENING+ABILITY
8 PIN PITCH 864215 3% 100% 3 Search PIN+PITCH Search PIN+PITCH
9 MASK CHUCK 576144 2% 100% 2 Search MASK+CHUCK Search MASK+CHUCK
10 POLISHING SIMULATION 576144 2% 100% 2 Search POLISHING+SIMULATION Search POLISHING+SIMULATION

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 LEE, CY , LAI, CS , YANG, CM , WANG, DHL , LIN, B , LEE, S , HUANG, CH , WEI, CC , (2012) RESIDUAL CLAMPING FORCE AND DYNAMIC RANDOM ACCESS MEMORY DATA RETENTION IMPROVED BY GATE TUNGSTEN ETCH DECHUCKING CONDITION IN A BIPOLAR ELECTROSTATIC CHUCK.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 51. ISSUE 8. P. - 9 90% 1
2 KANNO, S , KATO, K , YOSHIOKA, K , NISHIO, R , TSUBONE, T , (2006) PREDICTION OF CLAMPING PRESSURE IN A JOHNSEN-RAHBEK-TYPE ELECTROSTATIC CHUCK BASED ON CIRCUIT SIMULATION.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 24. ISSUE 1. P. 216 -223 8 100% 2
3 BRANDSTETTER, G , GOVINDJEE, S , (2012) ANALYTICAL TREATMENT OF THE DEFORMATION BEHAVIOR OF EXTREME-ULTRAVIOLET-LITHOGRAPHY MASKS DURING ELECTROSTATIC CHUCKING.JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS. VOL. 11. ISSUE 4. P. - 6 100% 0
4 HORNG, SC , (2014) COMPENSATING MODELING OVERLAY ERRORS USING THE WEIGHTED LEAST-SQUARES ESTIMATION.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 27. ISSUE 1. P. 60 -70 9 60% 3
5 KANNO, S , USUI, T , (2003) GENERATION MECHANISM OF RESIDUAL CLAMPING FORCE IN A BIPOLAR ELECTROSTATIC CHUCK.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 21. ISSUE 6. P. 2371-2377 7 100% 11
6 KALKOWSKI, G , ZEUSKE, JR , RISSE, S , MULLER, S , PESCHEL, T , ROHDE, M , (2011) ELECTROSTATIC CLAMPING WITH AN EUVL MASK CHUCK: PARTICLE ISSUES.MICROELECTRONIC ENGINEERING. VOL. 88. ISSUE 8. P. 1986 -1991 5 100% 1
7 LEE, S , KANG, SG , (2015) A STUDY OF IMPROVING OVERLAY ACCURACY BY APPLYING A NEW OUTLIER HANDLING METHOD IN FPD MANUFACTURING.INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH. VOL. 53. ISSUE 14. P. 4249 -4265 6 67% 0
8 TURNER, KT , VUKKADALA, P , SINHA, JK , (2016) MODELS TO RELATE WAFER GEOMETRY MEASUREMENTS TO IN-PLANE DISTORTION OF WAFERS.JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS. VOL. 15. ISSUE 2. P. - 3 100% 0
9 HE, FY , ZHANG, ZS , (2015) AN EMPIRICAL STUDY-BASED STATE SPACE MODEL FOR MULTILAYER OVERLAY ERRORS IN THE STEP-SCAN LITHOGRAPHY PROCESS.RSC ADVANCES. VOL. 5. ISSUE 126. P. 103901 -103906 7 44% 0
10 WRIGHT, DR , CHEN, L , FEDERLIN, P , FORBES, K , (1995) MANUFACTURING ISSUES OF ELECTROSTATIC CHUCKS.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 13. ISSUE 4. P. 1910-1916 5 100% 24

Classes with closest relation at Level 1


Rank Class id link
1 19470 PLANE PLASMA DISCHARGE//ENERGY INFLUX//DRY DEVELOPMENT
2 6838 GECKO//CLIMBING ROBOT//DRY ADHESION
3 31750 SODIUM SULFUR BATTERY//ALKALI SULPHIDE//BASIC ALCL3 NACL MELT
4 21961 RAPID THERMAL PROCESSING//RAPID THERMAL PROCESSING RTP//SILICON NANOELECT
5 13373 WAFER FABRICATION//IND ENGN SYST MANAGEMENT//SEMICONDUCTOR MANUFACTURING
6 12204 RUN TO RUN CONTROL//VIRTUAL METROLOGY//IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
7 22144 EUV LITHOG//EXTREME ULTRAVIOLET LITHOGRAPHY//EUVL
8 10360 OPTICAL LITHOGRAPHY//PHASE SHIFTING MASK//OPTICAL PROXIMITY CORRECTION
9 35834 SODERBERG ANODE//ANODE MASS//COKE PITCH COMPOSITION
10 30199 TRANSMISSION GRATING//FREESTANDING TRANSMISSION GRATING//HIGH TEMP HIGH DENS PLASMA PHYS

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