Class information for:
Level 1: PROBE CARD//COMPLIANT INTERCONNECTS//MEMS PROBE CARD

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
25993 266 15.4 52%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
279 3       SELF ASSEMBLED MONOLAYER//MOLECULAR ELECTRONICS//NANOSCIENCE & NANOTECHNOLOGY 42929
3017 2             DIAZONIUM SALTS//SU 8//ELECTROGRAFTING 2527
25993 1                   PROBE CARD//COMPLIANT INTERCONNECTS//MEMS PROBE CARD 266

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 PROBE CARD authKW 1141185 5% 76% 13
2 COMPLIANT INTERCONNECTS authKW 590369 2% 86% 6
3 MEMS PROBE CARD authKW 478308 2% 83% 5
4 HELICAL PATTERN authKW 409977 2% 71% 5
5 LASER SCAN LITHOGRAPHY authKW 367340 2% 80% 4
6 POROUS SILICON MICROMACHINING authKW 358729 2% 63% 5
7 CHIP TO SUBSTRATE INTERCONNECTS authKW 344383 1% 100% 3
8 FIRST LEVEL INTERCONNECTS authKW 344383 1% 100% 3
9 WAFER LEVEL PROBING TEST authKW 344383 1% 100% 3
10 WAFER PROBING TEST authKW 344383 1% 100% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Nanoscience & Nanotechnology 2770 35% 0% 92
2 Engineering, Electrical & Electronic 2369 55% 0% 146
3 Physics, Applied 1360 46% 0% 123
4 Engineering, Manufacturing 1248 12% 0% 32
5 Instruments & Instrumentation 946 19% 0% 51
6 Materials Science, Multidisciplinary 600 35% 0% 92
7 Engineering, Mechanical 328 12% 0% 32
8 Education, Scientific Disciplines 175 4% 0% 11
9 Mechanics 85 7% 0% 19
10 Optics 82 9% 0% 23

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 COMP AIDED SIMULAT PACKAGING RELIABIL CASPAR 141280 2% 31% 4
2 CASPAR 136652 2% 24% 5
3 ELECT RELIABIL METROL 405 114794 0% 100% 1
4 GRP DF 114794 0% 100% 1
5 HIGH TECH IND ENGINEERS 114794 0% 100% 1
6 IC MEMS INC 114794 0% 100% 1
7 MACRO BIO ELECT MECH AUTONOMOUS NANO SYST BEANS C 114794 0% 100% 1
8 PROL ING 114794 0% 100% 1
9 SPECIAL BUSINESS 114794 0% 100% 1
10 SYST BOARD 114794 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF MATERIALS EDUCATION 56236 3% 7% 7
2 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 14227 3% 2% 7
3 IEEE TRANSACTIONS ON ADVANCED PACKAGING 13717 4% 1% 11
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 12331 5% 1% 12
5 MACHINE DESIGN 11347 1% 3% 3
6 JOURNAL OF ELECTRONIC PACKAGING 7529 3% 1% 9
7 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 7246 5% 0% 13
8 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 6378 3% 1% 8
9 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 5984 6% 0% 17
10 NEW HORIZONS-THE SCIENCE AND PRACTICE OF ACUTE MEDICINE 4209 1% 2% 2

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 PROBE CARD 1141185 5% 76% 13 Search PROBE+CARD Search PROBE+CARD
2 COMPLIANT INTERCONNECTS 590369 2% 86% 6 Search COMPLIANT+INTERCONNECTS Search COMPLIANT+INTERCONNECTS
3 MEMS PROBE CARD 478308 2% 83% 5 Search MEMS+PROBE+CARD Search MEMS+PROBE+CARD
4 HELICAL PATTERN 409977 2% 71% 5 Search HELICAL+PATTERN Search HELICAL+PATTERN
5 LASER SCAN LITHOGRAPHY 367340 2% 80% 4 Search LASER+SCAN+LITHOGRAPHY Search LASER+SCAN+LITHOGRAPHY
6 POROUS SILICON MICROMACHINING 358729 2% 63% 5 Search POROUS+SILICON+MICROMACHINING Search POROUS+SILICON+MICROMACHINING
7 CHIP TO SUBSTRATE INTERCONNECTS 344383 1% 100% 3 Search CHIP+TO+SUBSTRATE+INTERCONNECTS Search CHIP+TO+SUBSTRATE+INTERCONNECTS
8 FIRST LEVEL INTERCONNECTS 344383 1% 100% 3 Search FIRST+LEVEL+INTERCONNECTS Search FIRST+LEVEL+INTERCONNECTS
9 WAFER LEVEL PROBING TEST 344383 1% 100% 3 Search WAFER+LEVEL+PROBING+TEST Search WAFER+LEVEL+PROBING+TEST
10 WAFER PROBING TEST 344383 1% 100% 3 Search WAFER+PROBING+TEST Search WAFER+PROBING+TEST

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 LEE, KY , HUANG, JT , CHAO, PS , LIN, JM , HSU, HJ , (2014) AN INTEGRATED ELECTROLESS NICKEL PLATING PROCESS FOR FABRICATION OF CMOS-MEMS PROBE CHIP.MICROELECTRONIC ENGINEERING. VOL. 113. ISSUE . P. 147 -151 18 86% 4
2 JING, XM , CHEN, D , CHEN, XA , MIAO, JM , LIU, JQ , ZHU, J , (2010) DESIGN AND FABRICATION OF A MICROMACHINED BILAYER CANTILEVER PROBE CARD.JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS. VOL. 9. ISSUE 4. P. - 19 90% 3
3 CHOI, WC , RYU, JY , (2012) FABRICATION OF A GUIDE BLOCK FOR MEASURING A DEVICE WITH FINE PITCH AREA-ARRAYED SOLDER BUMPS.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. VOL. 18. ISSUE 3. P. 333-339 15 94% 0
4 HORIUCHI, T , SASAKI, R , (2012) NEW LASER-SCAN EXPOSURE SYSTEM FOR DELINEATING PRECISE HELICAL PATTERNS ONTO SUB-50-MU M WIRES.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 51. ISSUE 6. P. - 14 74% 0
5 CHEN, W , SITARAMAN, SK , (2016) AREA-ARRAY OF 3-ARC-FAN COMPLIANT INTERCONNECTS AS EFFECTIVE DROP-IMPACT ISOLATOR FOR MICROSYSTEMS.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 25. ISSUE 2. P. 337 -346 8 100% 0
6 HORIUCHI, T , HAYASHI, N , (2009) SCAN PROJECTION OPTICAL LITHOGRAPHY THROUGH A SLIT ONTO SMALL DIAMETER SHAFTS.JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY. VOL. 22. ISSUE 3. P. 371-377 9 100% 0
7 HORIUCHI, T , ISHII, H , SHINOZAKI, Y , OGAWA, T , KOJIMA, K , (2011) NOVEL FABRICATION METHOD OF MICROCOIL SPRINGS USING LASER-SCAN HELICAL PATTERNING AND NICKEL ELECTROPLATING.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 50. ISSUE 6. P. - 10 83% 1
8 LIU, DS , CHANG, CM , TU, CY , LIU, AH , HUANG, CF , LEE, YC , (2011) OPTIMIZATION OF MULTILAYER PROBE CARD USING STRAIN ENERGY-BASED ANALYTICAL MODEL AND MULTIOBJECTIVE PROGRAMMING ALGORITHM.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 1. ISSUE 8. P. 1292 -1302 8 89% 0
9 SHIN, B , KWON, HJ , HAN, SW , IM, CM , (2015) FATIGUE LIFE ESTIMATION OF VERTICAL PROBE NEEDLE FOR WAFER PROBING.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING. VOL. 16. ISSUE 12. P. 2509 -2515 8 80% 0
10 KWON, HJ , LEE, J , SHIN, B , JEON, S , HAN, CS , IM, CM , (2014) GEOMETRY DESIGN OF VERTICAL PROBE NEEDLE USING MECHANICAL TESTING AND FINITE ELEMENT ANALYSIS.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING. VOL. 15. ISSUE 11. P. 2335 -2342 8 80% 0

Classes with closest relation at Level 1


Rank Class id link
1 11311 SU 8//MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS//JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2 36534 FUNCT TERMINAL CIRCUITS GRP//DATA NETWORK EXPLORATORY DEV//DIGITAL TRANSMISS D5 CHANNEL UNITS GRP
3 36136 TRANSIENT ELECTRONICS//BIODEGRADABLE ELECTRONICS//BIOCOMPATIBLE ELECTRONICS
4 27623 BENZOCYCLOBUTENE//INTERCONNECTION TECHNIQUE//WATER ABSORPTIONS
5 16728 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//DROP TEST//SOLDER JOINT
6 23066 SYNCHROTRON RADIATION STIMULATED ETCHING//ADV SCI TECHNOL IND//VACUUM UV PHOTOSCI
7 8314 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION
8 24555 SELF IMMOLATIVE//POLYMETHYL GLYOXYLATE//POLYOLEFIN SULFONES
9 21913 STENCIL LITHOGRAPHY//NANOSYST MFG//STRESS INDUCED DEFORMATION
10 6757 STRIP BENDING TEST//BULGE TEST//MEMS PROD

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