Class information for:
Level 1: ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
2714 2166 21.5 52%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2485 2             ELECTROMIGRATION//ELECTROMIGRATION EM//SOLID STATE DEWETTING 3937
2714 1                   ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION 2166

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECTROMIGRATION authKW 1400522 15% 30% 332
2 ELECTROMIGRATION EM authKW 216663 1% 55% 28
3 STRESS INDUCED MIGRATION authKW 121823 1% 79% 11
4 PRC MER address 113700 1% 73% 11
5 STRESS VOIDING authKW 112766 0% 100% 8
6 CU INTERCONNECT authKW 111793 1% 27% 29
7 STRESS MIGRATION authKW 102312 1% 52% 14
8 STRESS INDUCED VOIDING authKW 95142 0% 75% 9
9 HILLOCKS authKW 93376 1% 25% 27
10 INTERCONNECT authKW 72035 4% 6% 86

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Physics, Applied 24171 67% 0% 1443
2 Engineering, Electrical & Electronic 5850 32% 0% 684
3 Nanoscience & Nanotechnology 5175 17% 0% 371
4 Materials Science, Coatings & Films 4474 11% 0% 232
5 Materials Science, Multidisciplinary 3243 29% 0% 627
6 Physics, Condensed Matter 1542 16% 0% 341
7 Metallurgy & Metallurgical Engineering 806 7% 0% 159
8 Computer Science, Hardware & Architecture 229 2% 0% 46
9 Materials Science, Characterization, Testing 115 1% 0% 23
10 Optics 69 4% 0% 84

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 PRC MER 113700 1% 73% 11
2 INTERCONNECT PACKAGING 60041 1% 30% 14
3 SUR E EVALUAT 56383 0% 100% 4
4 EE PHYS ELECT 45105 0% 80% 4
5 ADV PROC DEV PROJECT TEAM 42287 0% 100% 3
6 INTERCONNECT PACKAGING GRP 37586 0% 67% 4
7 MINIST EDUC BAND G SEMICOND MAT DEVICES 37586 0% 67% 4
8 CORP DEV ENGN 28192 0% 100% 2
9 PRCMER 28192 0% 100% 2
10 PROC MFG DEV 28192 0% 100% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROELECTRONICS RELIABILITY 62240 8% 3% 175
2 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 22108 2% 4% 41
3 JOURNAL OF APPLIED PHYSICS 13624 15% 0% 323
4 MICROELECTRONIC ENGINEERING 8346 4% 1% 78
5 THIN SOLID FILMS 6713 6% 0% 133
6 JOURNAL OF ELECTRONIC MATERIALS 5307 3% 1% 61
7 APPLIED PHYSICS LETTERS 4839 9% 0% 199
8 JOURNAL OF MATERIALS RESEARCH 3664 3% 0% 56
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 2661 3% 0% 57
10 IEEE TRANSACTIONS ON ELECTRON DEVICES 2520 2% 0% 53

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ELECTROMIGRATION 1400522 15% 30% 332 Search ELECTROMIGRATION Search ELECTROMIGRATION
2 ELECTROMIGRATION EM 216663 1% 55% 28 Search ELECTROMIGRATION+EM Search ELECTROMIGRATION+EM
3 STRESS INDUCED MIGRATION 121823 1% 79% 11 Search STRESS+INDUCED+MIGRATION Search STRESS+INDUCED+MIGRATION
4 STRESS VOIDING 112766 0% 100% 8 Search STRESS+VOIDING Search STRESS+VOIDING
5 CU INTERCONNECT 111793 1% 27% 29 Search CU+INTERCONNECT Search CU+INTERCONNECT
6 STRESS MIGRATION 102312 1% 52% 14 Search STRESS+MIGRATION Search STRESS+MIGRATION
7 STRESS INDUCED VOIDING 95142 0% 75% 9 Search STRESS+INDUCED+VOIDING Search STRESS+INDUCED+VOIDING
8 HILLOCKS 93376 1% 25% 27 Search HILLOCKS Search HILLOCKS
9 INTERCONNECT 72035 4% 6% 86 Search INTERCONNECT Search INTERCONNECT
10 COPPER INTERCONNECTS 65587 1% 29% 16 Search COPPER+INTERCONNECTS Search COPPER+INTERCONNECTS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 TAN, CM , ROY, A , (2007) ELECTROMIGRATION IN ULSI INTERCONNECTS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 58. ISSUE 1-2. P. 3-75 116 75% 23
2 OGAWA, ET , LEE, KD , BLASCHKE, VA , HO, PS , (2002) ELECTROMIGRATION RELIABILITY ISSUES IN DUAL-DAMASCENE CU INTERCONNECTIONS.IEEE TRANSACTIONS ON RELIABILITY. VOL. 51. ISSUE 4. P. 403 -419 77 77% 127
3 DE ORIO, RL , CERIC, H , SELBERHERR, S , (2010) PHYSICALLY BASED MODELS OF ELECTROMIGRATION: FROM BLACK'S EQUATION TO MODERN TCAD MODELS.MICROELECTRONICS RELIABILITY. VOL. 50. ISSUE 6. P. 775-789 56 81% 23
4 SELBERHERR, S , CERIC, H , (2011) ELECTROMIGRATION IN SUBMICRON INTERCONNECT FEATURES OF INTEGRATED CIRCUITS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 71. ISSUE 5-6. P. 53 -86 56 78% 15
5 MAROUDAS, D , (2011) SURFACE MORPHOLOGICAL RESPONSE OF CRYSTALLINE SOLIDS TO MECHANICAL STRESSES AND ELECTRIC FIELDS.SURFACE SCIENCE REPORTS. VOL. 66. ISSUE 8-9. P. 299 -346 75 53% 8
6 SHEN, YL , (2008) EXTERNALLY CONSTRAINED PLASTIC FLOW IN MINIATURIZED METALLIC STRUCTURES: A CONTINUUM-BASED APPROACH TO THIN FILMS, LINES, AND JOINTS.PROGRESS IN MATERIALS SCIENCE. VOL. 53. ISSUE 5. P. 838 -891 118 35% 25
7 CHOI, ZS , LEE, J , LIM, MK , GAN, CL , THOMPSON, CV , (2011) VOID DYNAMICS IN COPPER-BASED INTERCONNECTS.JOURNAL OF APPLIED PHYSICS. VOL. 110. ISSUE 3. P. - 32 100% 2
8 DASGUPTA, D , SFYRIS, GI , MAROUDAS, D , (2012) ELECTROMIGRATION-DRIVEN COMPLEX DYNAMICS OF VOID SURFACES IN STRESSED METALLIC THIN FILMS UNDER A GENERAL BIAXIAL MECHANICAL LOADING.JOURNAL OF APPLIED PHYSICS. VOL. 112. ISSUE 8. P. - 33 94% 1
9 WANG, H , LI, ZH , SUN, J , (2006) EFFECTS OF STRESS AND TEMPERATURE GRADIENTS ON THE EVOLUTION OF VOID IN METAL INTERCONNECTS DRIVEN BY ELECTRIC CURRENT AND MECHANICAL STRESS.MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING. VOL. 14. ISSUE 4. P. 607-615 38 86% 8
10 TOMAR, V , GUNGOR, MR , MAROUDAS, D , (2010) ELECTROMECHANICALLY DRIVEN CHAOTIC DYNAMICS OF VOIDS IN METALLIC THIN FILMS.PHYSICAL REVIEW B. VOL. 81. ISSUE 5. P. - 31 94% 0

Classes with closest relation at Level 1


Rank Class id link
1 24227 TRIODE ION PLATING//ENERGY RESOLVED MASS SPECTROSCOPY//AL PT
2 15571 INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN
3 26984 AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION
4 3427 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
5 21367 DIRECT FORCE//ATOMIC MIGRATIONS//METALS AND DILUTE ALLOYS
6 24432 DIMETHYLALUMINUM HYDRIDE//DIMETHYLALUMINUMHYDRIDE DMAH//SELECTIVE AL CVD
7 14055 SOLID STATE DEWETTING//MATH DESIGN MAT//SURFACE ENERGY ANISOTROPY
8 22649 W TI THIN FILMS//W 10TI ALLOY//W 10WTTI ALLOY
9 5989 COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING
10 19410 NANOGAP ELECTRODES//NANOGAP//SURFACE CONDUCTION ELECTRON EMITTER

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