Class information for:
Level 1: AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
26984 240 18.6 57%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2485 2             ELECTROMIGRATION//ELECTROMIGRATION EM//SOLID STATE DEWETTING 3937
26984 1                   AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION 240

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 AGGLOMERATION SUPPRESSION authKW 654327 3% 86% 6
2 NSF LOW POWER ELECT address 508918 3% 67% 6
3 SILVER METALLIZATION authKW 479555 3% 54% 7
4 LOW POWER ELECT address 471212 4% 37% 10
5 SILICON100 WAFER authKW 381692 1% 100% 3
6 AG ISLANDS ON OXIDIZED SI SURFACES authKW 286267 1% 75% 3
7 AG ALLOY FILMS authKW 254461 1% 100% 2
8 AGAL FILMS authKW 254461 1% 100% 2
9 BACK ETCH METHOD authKW 254461 1% 100% 2
10 PRECIPITATION OF GOLD NANOPARTICLES authKW 254461 1% 100% 2

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 1887 20% 0% 49
2 Physics, Applied 1725 54% 0% 130
3 Materials Science, Multidisciplinary 682 38% 0% 92
4 Physics, Condensed Matter 530 26% 0% 62
5 Nanoscience & Nanotechnology 212 11% 0% 26
6 Metallurgy & Metallurgical Engineering 198 10% 0% 25
7 Optics 95 10% 0% 23
8 Crystallography 90 6% 0% 14
9 Microscopy 50 2% 0% 4
10 Electrochemistry 42 4% 0% 10

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 NSF LOW POWER ELECT 508918 3% 67% 6
2 LOW POWER ELECT 471212 4% 37% 10
3 PROTECT INFORMAT 254461 1% 100% 2
4 CENT PHOTOG PROC J MALINOWSKI 127231 0% 100% 1
5 INFORMAT QUANTUM SYST S 127231 0% 100% 1
6 INTEGRATED NANODEVICES SYST 127231 0% 100% 1
7 JORDAN MALINOWSKI CENT PHOTOG PROC 127231 0% 100% 1
8 JORDAN MALINOWSKI CENT PHOTOGR H PROC 127231 0% 100% 1
9 LPMCCNRSUPS 127231 0% 100% 1
10 MANUF TECH 127231 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROELECTRONIC ENGINEERING 3611 7% 0% 17
2 THIN SOLID FILMS 1837 10% 0% 23
3 ART IN AMERICA 701 0% 1% 1
4 APPLIED SURFACE SCIENCE 693 6% 0% 14
5 SCRIPTA METALLURGICA 641 2% 0% 4
6 ZEITSCHRIFT FUR KRISTALLOGRAPHIE 628 2% 0% 5
7 VACUUM 473 3% 0% 6
8 JOURNAL OF APPLIED PHYSICS 454 8% 0% 20
9 MATERIALS SCIENCE & ENGINEERING R-REPORTS 402 0% 0% 1
10 JOURNAL OF APPLIED CRYSTALLOGRAPHY 354 2% 0% 4

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 AGGLOMERATION SUPPRESSION 654327 3% 86% 6 Search AGGLOMERATION+SUPPRESSION Search AGGLOMERATION+SUPPRESSION
2 SILVER METALLIZATION 479555 3% 54% 7 Search SILVER+METALLIZATION Search SILVER+METALLIZATION
3 SILICON100 WAFER 381692 1% 100% 3 Search SILICON100+WAFER Search SILICON100+WAFER
4 AG ISLANDS ON OXIDIZED SI SURFACES 286267 1% 75% 3 Search AG+ISLANDS+ON+OXIDIZED+SI+SURFACES Search AG+ISLANDS+ON+OXIDIZED+SI+SURFACES
5 AG ALLOY FILMS 254461 1% 100% 2 Search AG+ALLOY+FILMS Search AG+ALLOY+FILMS
6 AGAL FILMS 254461 1% 100% 2 Search AGAL+FILMS Search AGAL+FILMS
7 BACK ETCH METHOD 254461 1% 100% 2 Search BACK+ETCH+METHOD Search BACK+ETCH+METHOD
8 PRECIPITATION OF GOLD NANOPARTICLES 254461 1% 100% 2 Search PRECIPITATION+OF+GOLD+NANOPARTICLES Search PRECIPITATION+OF+GOLD+NANOPARTICLES
9 SIO2 SI SURFACES 254461 1% 100% 2 Search SIO2+SI+SURFACES Search SIO2+SI+SURFACES
10 THIN AG FILMS 254461 1% 100% 2 Search THIN+AG+FILMS Search THIN+AG+FILMS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 ZHANG, ZY , KAWAMURA, M , ABE, Y , KIM, KH , (2012) EFFECTS OF NB SURFACE AND TI INTERFACE LAYERS ON THERMAL STABILITY AND ELECTRICAL RESISTIVITY OF AG THIN FILMS.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 51. ISSUE 8. P. - 14 82% 0
2 DADVAND, N , DADVAND, M , (2014) PULSE ELECTRODEPOSITION OF NANOSTRUCTURED SILVER-TUNGSTEN-COBALT OXIDE COMPOSITE FROM A NON-CYANIDE PLATING BATH.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 161. ISSUE 14. P. D730 -D735 14 67% 0
3 INBERG, A , BOGUSH, V , CROITORU, N , SHACHAM-DIAMANDA, Y , (2007) ELECTROCHEMICAL STUDY OF THE MECHANISM OF AG(W) ELECTROLESS DEPOSITION.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 154. ISSUE 1. P. D1-D4 10 83% 7
4 INBERG, A , BOGUSH, V , GINSBURG, E , RABINOVICH, E , CROITORU, N , SHACHAM-DIAMAND, Y , (2006) THE EFFECT OF SURFACE ACTIVATION ON ELECTROLESS AG(W) DEPOSITION.JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS. VOL. 8. ISSUE 6. P. 2035-2038 10 77% 2
5 DE MAEYER, B , VAN WONTERGHEM, F , PROOST, J , (2014) IN SITU MONITORING OF THERMALLY INDUCED RESISTIVITY CHANGES IN SILVER THIN FILMS.JOURNAL OF ELECTRONIC MATERIALS. VOL. 43. ISSUE 2. P. 548-554 10 59% 0
6 KAWAMURA, M , FUKUDA, D , INAMI, Y , ABE, Y , SASAKI, K , (2009) THERMALLY STABLE VERY THIN AG FILMS FOR ELECTRODES.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 27. ISSUE 4. P. 975 -978 7 88% 6
7 TOMOV, I , VASSILEV, S , TZVETKOV, P , (2008) ACCOUNTING FOR SECONDARY EXTINCTION IN A NOVEL X-RAY ABSORPTION METHOD USED FOR THICKNESS MEASUREMENTS OF THIN FOILS.ARCHIVES OF METALLURGY AND MATERIALS. VOL. 53. ISSUE 1. P. 265-270 7 88% 0
8 KAWAMURA, M , ZHANG, Z , KIYONO, R , ABE, Y , (2013) THERMAL STABILITY AND ELECTRICAL PROPERTIES OF AG-TI FILMS AND TI/AG/TI FILMS PREPARED BY SPUTTERING.VACUUM. VOL. 87. ISSUE . P. 222-226 5 100% 10
9 LV, J , (2014) EXPLORATION OF THERMAL STABILITY OF AG(AL) FILMS IN AIR BY EVOLUTIONS OF SURFACE MORPHOLOGY AND OPTIC-ELECTRIC PROPERTIES.APPLIED SURFACE SCIENCE. VOL. 322. ISSUE . P. 143 -146 6 86% 1
10 KAWAMURA, M , YAMAGUCHI, M , ABE, Y , SASAKI, K , (2005) ELECTRICAL AND MORPHOLOGICAL CHANGE OF AG-NI FILMS BY ANNEALING IN VACUUM.MICROELECTRONIC ENGINEERING. VOL. 82. ISSUE 3-4. P. 277-282 7 88% 9

Classes with closest relation at Level 1


Rank Class id link
1 15027 ITO AG ITO//LOW EMISSIVITY COATING//AZO AG AZO
2 26085 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS
3 14055 SOLID STATE DEWETTING//MATH DESIGN MAT//SURFACE ENERGY ANISOTROPY
4 3427 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
5 11277 PERFLUORINATED CARBOXYLATES//ZENTRUM MIKROTECHNOL//COPPER FILMS
6 2714 ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION
7 28324 ANALYSIS LAYER THICKNESS//AQUEOUS AND MIXED SOLVENT BATH//BENT STRIP METHOD
8 12450 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS COPPER
9 8713 OHMIC CONTACT//P GAN//P TYPE GAN
10 12522 LONGITUDINAL MICROSTRUCTURE//VERY NARROW COPPER WIRE//ELECTRON SURFACE SCATTERING

Go to start page