Class information for:
Level 1: COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
5989 1547 24.2 61%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
330 3       ELECTROCHEMISTRY//ELECTRODEPOSITION//ELECTROCOAGULATION 38062
544 2             PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 14700
5989 1                   COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING 1547

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 COPPER ELECTRODEPOSITION authKW 404968 3% 42% 49
2 BOTTOM UP FILLING authKW 335525 1% 100% 17
3 SELF ANNEALING authKW 280757 1% 68% 21
4 COPPER ELECTROPLATING authKW 212257 1% 49% 22
5 SUPERFILLING authKW 151816 1% 77% 10
6 VIA FILLING authKW 125683 1% 58% 11
7 GLOBAL BUSINESS UNIT ELECT MAT address 120886 0% 88% 7
8 LEVELER authKW 114828 1% 73% 8
9 JOURNAL OF THE ELECTROCHEMICAL SOCIETY journal 111060 27% 1% 410
10 ELECTROPLATING authKW 100323 5% 6% 79

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Electrochemistry 50620 48% 0% 745
2 Materials Science, Coatings & Films 45250 39% 0% 602
3 Metallurgy & Metallurgical Engineering 2334 14% 0% 212
4 Materials Science, Multidisciplinary 1190 22% 0% 339
5 Physics, Applied 909 18% 0% 279
6 Nanoscience & Nanotechnology 580 7% 0% 115
7 Engineering, Electrical & Electronic 194 9% 0% 142
8 METALLURGY & MINING 67 0% 0% 4
9 Physics, Condensed Matter 65 6% 0% 88
10 Mining & Mineral Processing 25 1% 0% 8

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 GLOBAL BUSINESS UNIT ELECT MAT 120886 0% 88% 7
2 ADV ELECT ASSEMBLY 59210 0% 100% 3
3 DEEP SUBMICRON INTEGRATED CIRCUIT TECHNOL 39473 0% 100% 2
4 ELE OPLATING MET FINISHING TECHNOL 30211 0% 22% 7
5 ADV PACKAGING INTERCONNECT 19737 0% 100% 1
6 ARC SPECIAL PARTICLES INTER ES 19737 0% 100% 1
7 AREA Q ANALIT 19737 0% 100% 1
8 ATOM ENERGY SAFE DEV PROBLEMS 19737 0% 100% 1
9 CHEM INFORMAT ENGN 19737 0% 100% 1
10 CNRS 6013 19737 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 111060 27% 1% 410
2 PLATING AND SURFACE FINISHING 69144 5% 5% 70
3 ELECTROCHEMICAL AND SOLID STATE LETTERS 35689 6% 2% 88
4 JOURNAL OF APPLIED ELECTROCHEMISTRY 20080 5% 1% 77
5 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 19897 2% 3% 35
6 CIRCUIT WORLD 9899 1% 5% 10
7 ECS ELECTROCHEMISTRY LETTERS 8753 1% 3% 13
8 ELECTROCHIMICA ACTA 8381 7% 0% 108
9 MICROELECTRONIC ENGINEERING 3051 3% 0% 40
10 GALVANOTECHNIK 3033 0% 8% 2

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 COPPER ELECTRODEPOSITION 404968 3% 42% 49 Search COPPER+ELECTRODEPOSITION Search COPPER+ELECTRODEPOSITION
2 BOTTOM UP FILLING 335525 1% 100% 17 Search BOTTOM+UP+FILLING Search BOTTOM+UP+FILLING
3 SELF ANNEALING 280757 1% 68% 21 Search SELF+ANNEALING Search SELF+ANNEALING
4 COPPER ELECTROPLATING 212257 1% 49% 22 Search COPPER+ELECTROPLATING Search COPPER+ELECTROPLATING
5 SUPERFILLING 151816 1% 77% 10 Search SUPERFILLING Search SUPERFILLING
6 VIA FILLING 125683 1% 58% 11 Search VIA+FILLING Search VIA+FILLING
7 LEVELER 114828 1% 73% 8 Search LEVELER Search LEVELER
8 ELECTROPLATING 100323 5% 6% 79 Search ELECTROPLATING Search ELECTROPLATING
9 MICROVIA FILLING 98684 0% 100% 5 Search MICROVIA+FILLING Search MICROVIA+FILLING
10 COPPER NUCLEATION 88812 0% 75% 6 Search COPPER+NUCLEATION Search COPPER+NUCLEATION

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 JOSELL, D , MOFFAT, TP , (2014) SUPERCONFORMAL COPPER ELECTRODEPOSITION IN COMPLEXED ALKALINE ELECTROLYTE.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 161. ISSUE 5. P. D287-D292 54 98% 4
2 CHIU, YD , DOW, WP , (2013) ACCELERATOR SCREENING BY CYCLIC VOLTAMMETRY FOR MICROVIA FILLING BY COPPER ELECTROPLATING.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 160. ISSUE 12. P. D3021-D3027 52 88% 12
3 DOW, WP , LI, CC , SU, YC , SHEN, SP , HUANG, CC , LEE, C , HSU, B , HSU, S , (2009) MICROVIA FILLING BY COPPER ELECTROPLATING USING DIAZINE BLACK AS A LEVELER.ELECTROCHIMICA ACTA. VOL. 54. ISSUE 24. P. 5894-5901 50 100% 29
4 JOSELL, D , MOFFAT, TP , (2014) SUPERCONFORMAL CU ELECTRODEPOSITION FROM CU(II)-EDTA COMPLEXED ALKALINE ELECTROLYTE.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 161. ISSUE 10. P. D558 -D563 47 98% 3
5 KIM, MJ , CHOE, S , KIM, HC , CHO, SK , KIM, SK , KIM, JJ , (2015) ELECTROCHEMICAL BEHAVIOR OF CITRIC ACID AND ITS INFLUENCE ON CU ELECTRODEPOSITION FOR DAMASCENE METALLIZATION.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 162. ISSUE 8. P. D354 -D359 45 94% 3
6 DOW, WP , CHIU, YD , YEN, MY , (2009) MICROVIA FILLING BY CU ELECTROPLATING OVER A AU SEED LAYER MODIFIED BY A DISULFIDE.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 156. ISSUE 4. P. D155 -D167 68 65% 9
7 CHEN, BA , WANG, AY , WU, SY , WANG, LM , (2016) POLYQUATERNIUM-2: A NEW LEVELLING AGENT FOR COPPER ELECTROPLATING FROM ACIDIC SULPHATE BATH.ELECTROCHEMISTRY. VOL. 84. ISSUE 6. P. 414 -419 39 98% 0
8 LUO, W , CHEN, ZP , ZHANG, JH , ZHU, Y , GAO, LM , LI, M , (2016) COPPER ELECTRODEPOSITION IN THROUGH-SILICON VIA UNDER GALVANOSTATIC CONDITION.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 163. ISSUE 13. P. D694 -D706 41 91% 0
9 CHOE, S , KIM, MJ , KIM, HC , LIM, T , PARK, KJ , KIM, KH , AHN, SH , LEE, A , KIM, SK , KIM, JJ , (2014) DEGRADATION OF POLY(ETHYLENE GLYCOL-PROPYLENE GLYCOL) COPOLYMER AND ITS INFLUENCES ON COPPER ELECTRODEPOSITION.JOURNAL OF ELECTROANALYTICAL CHEMISTRY. VOL. 714. ISSUE . P. 85-91 42 91% 1
10 CHAN, PF , CHIU, YD , DOW, WP , KRUG, K , LEE, YL , YAU, SL , (2013) USE OF 3,3-THIOBIS(1-PROPANESULFONATE) TO ACCELERATE MICROVIA FILLING BY COPPER ELECTROPLATING.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 160. ISSUE 12. P. D3271-D3277 48 80% 1

Classes with closest relation at Level 1


Rank Class id link
1 27484 SHAPED WAVEFORM//PULSE CURRENT ELECTROFORMING//ACETATE AND HULL CELL
2 14278 ELECTROCRYSTALLIZATION//ELECTROCHEMICAL NUCLEATION//CURRENT TRANSIENTS
3 12450 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS COPPER
4 26356 DIFFERENTIAL BOND POLARIZABILITY//RAMAN INTENSITY//TEMPORAL BOND POLARIZABILITY
5 28150 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING//ELECTROFORMING//ULTRASONIC ASSISTED JET ELECTRODEPOSITION
6 27888 ETCHING FACTOR//SPRAY ETCHING//42 ALLOY
7 16855 THERMAL EQUILIBRIUM DIAGRAM//TIN ELECTRODEPOSITION//CONNECTING RELIABILITY
8 23007 COPPER POWDER FLOWABILITY//ELECTROLYTIC COPPER POWDER//ICTM ELE OCHEM
9 8314 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION
10 19413 SILVER BISMUTH ALLOYS//DIPARTIMENTO INGN INNOVAZ//SILVER INDIUM ALLOY

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