Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
15571 | 704 | 24.6 | 61% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
16 | 4 | ENGINEERING, CIVIL//CONSTRUCTION & BUILDING TECHNOLOGY//MECHANICS | 627508 |
323 | 3 | FREE VIBRATION//MECHANICS//BUCKLING | 38564 |
2189 | 2 | BLISTER TEST//LIQUID SUBSTRATE//SURFACE WRINKLING | 4903 |
15571 | 1 | INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN | 704 |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | INTERFACIAL SHEARS | authKW | 390355 | 1% | 100% | 9 |
2 | NON LOCAL STRESS CURVATURE RELATIONS | authKW | 303609 | 1% | 100% | 7 |
3 | NON UNIFORM MISFIT STRAIN | authKW | 303609 | 1% | 100% | 7 |
4 | STRESS CURVATURE RELATIONS | authKW | 173491 | 1% | 100% | 4 |
5 | STONEYS FORMULA | authKW | 135536 | 1% | 63% | 5 |
6 | AMERG | address | 130118 | 0% | 100% | 3 |
7 | NW NUCL TECHNOL | address | 130118 | 0% | 100% | 3 |
8 | INTRINSIC STRESS | authKW | 106050 | 2% | 16% | 15 |
9 | TFDC ELECTRON THEORY | authKW | 97587 | 0% | 75% | 3 |
10 | THOMAS FERMI DIRAC | authKW | 97587 | 0% | 75% | 3 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Materials Science, Coatings & Films | 7616 | 24% | 0% | 168 |
2 | Physics, Applied | 5425 | 56% | 0% | 394 |
3 | Materials Science, Multidisciplinary | 2368 | 41% | 0% | 291 |
4 | Physics, Condensed Matter | 1500 | 25% | 0% | 179 |
5 | Metallurgy & Metallurgical Engineering | 508 | 10% | 0% | 69 |
6 | Nanoscience & Nanotechnology | 184 | 6% | 0% | 45 |
7 | Instruments & Instrumentation | 160 | 6% | 0% | 39 |
8 | Mechanics | 153 | 6% | 0% | 43 |
9 | Physics, Multidisciplinary | 37 | 5% | 0% | 36 |
10 | Optics | 31 | 4% | 0% | 30 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | AMERG | 130118 | 0% | 100% | 3 |
2 | NW NUCL TECHNOL | 130118 | 0% | 100% | 3 |
3 | NANOTRON TECHNOL INC | 86746 | 0% | 100% | 2 |
4 | PHYS PROCEDES VIDE | 57829 | 0% | 67% | 2 |
5 | CHIM METUMR 6226 | 43373 | 0% | 100% | 1 |
6 | CIVIL ENGN MECH MECH DISASTER EN | 43373 | 0% | 100% | 1 |
7 | FR 73 TECH PHYS | 43373 | 0% | 100% | 1 |
8 | FULL FUNDAMENTAL TECHNOL | 43373 | 0% | 100% | 1 |
9 | HENAN ABORAT INNOVAT NONFERROUS GENER TEC | 43373 | 0% | 100% | 1 |
10 | INTEGRAT NANSCI | 43373 | 0% | 100% | 1 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | THIN SOLID FILMS | 8195 | 12% | 0% | 83 |
2 | JOURNAL OF APPLIED PHYSICS | 2600 | 12% | 0% | 81 |
3 | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 1879 | 4% | 0% | 25 |
4 | PROGRESS IN NATURAL SCIENCE | 1457 | 1% | 1% | 5 |
5 | SOLID STATE PHYSICS-ADVANCES IN RESEARCH AND APPLICATIONS | 1397 | 0% | 3% | 1 |
6 | SURFACE & COATINGS TECHNOLOGY | 1361 | 4% | 0% | 25 |
7 | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS | 1258 | 1% | 0% | 10 |
8 | VACUUM | 1144 | 2% | 0% | 16 |
9 | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1023 | 0% | 1% | 2 |
10 | ACTA MATERIALIA | 985 | 2% | 0% | 17 |
Author Key Words |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | INTERFACIAL SHEARS | 390355 | 1% | 100% | 9 | Search INTERFACIAL+SHEARS | Search INTERFACIAL+SHEARS |
2 | NON LOCAL STRESS CURVATURE RELATIONS | 303609 | 1% | 100% | 7 | Search NON+LOCAL+STRESS+CURVATURE+RELATIONS | Search NON+LOCAL+STRESS+CURVATURE+RELATIONS |
3 | NON UNIFORM MISFIT STRAIN | 303609 | 1% | 100% | 7 | Search NON+UNIFORM+MISFIT+STRAIN | Search NON+UNIFORM+MISFIT+STRAIN |
4 | STRESS CURVATURE RELATIONS | 173491 | 1% | 100% | 4 | Search STRESS+CURVATURE+RELATIONS | Search STRESS+CURVATURE+RELATIONS |
5 | STONEYS FORMULA | 135536 | 1% | 63% | 5 | Search STONEYS+FORMULA | Search STONEYS+FORMULA |
6 | INTRINSIC STRESS | 106050 | 2% | 16% | 15 | Search INTRINSIC+STRESS | Search INTRINSIC+STRESS |
7 | TFDC ELECTRON THEORY | 97587 | 0% | 75% | 3 | Search TFDC+ELECTRON+THEORY | Search TFDC+ELECTRON+THEORY |
8 | THOMAS FERMI DIRAC | 97587 | 0% | 75% | 3 | Search THOMAS+FERMI+DIRAC | Search THOMAS+FERMI+DIRAC |
9 | CURVATURE MEASUREMENT METHOD | 86746 | 0% | 100% | 2 | Search CURVATURE+MEASUREMENT+METHOD | Search CURVATURE+MEASUREMENT+METHOD |
10 | LIMIT SIZE | 86746 | 0% | 100% | 2 | Search LIMIT+SIZE | Search LIMIT+SIZE |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | CHASON, E , GUDURU, PR , (2016) TUTORIAL: UNDERSTANDING RESIDUAL STRESS IN POLYCRYSTALLINE THIN FILMS THROUGH REAL-TIME MEASUREMENTS AND PHYSICAL MODELS.JOURNAL OF APPLIED PHYSICS. VOL. 119. ISSUE 19. P. - | 71 | 71% | 1 |
2 | CHASON, E , (2012) A KINETIC ANALYSIS OF RESIDUAL STRESS EVOLUTION IN POLYCRYSTALLINE THIN FILMS.THIN SOLID FILMS. VOL. 526. ISSUE . P. 1-14 | 47 | 85% | 30 |
3 | CHASON, E , ENGWALL, AM , (2015) RELATING RESIDUAL STRESS TO THIN FILM GROWTH PROCESSES VIA A KINETIC MODEL AND REAL-TIME EXPERIMENTS.THIN SOLID FILMS. VOL. 596. ISSUE . P. 2 -7 | 32 | 94% | 0 |
4 | CHASON, E , SHIN, JW , HEARNE, SJ , FREUND, LB , (2012) KINETIC MODEL FOR DEPENDENCE OF THIN FILM STRESS ON GROWTH RATE, TEMPERATURE, AND MICROSTRUCTURE.JOURNAL OF APPLIED PHYSICS. VOL. 111. ISSUE 8. P. - | 28 | 100% | 27 |
5 | MAGNFALT, D , FILLON, A , BOYD, RD , HELMERSSON, U , SARAKINOS, K , ABADIAS, G , (2016) COMPRESSIVE INTRINSIC STRESS ORIGINATES IN THE GRAIN BOUNDARIES OF DENSE REFRACTORY POLYCRYSTALLINE THIN FILMS.JOURNAL OF APPLIED PHYSICS. VOL. 119. ISSUE 5. P. - | 32 | 71% | 2 |
6 | CHASON, E , KARLSON, M , COLIN, JJ , MAGNFALT, D , SARAKINOS, K , ABADIAS, G , (2016) A KINETIC MODEL FOR STRESS GENERATION IN THIN FILMS GROWN FROM ENERGETIC VAPOR FLUXES.JOURNAL OF APPLIED PHYSICS. VOL. 119. ISSUE 14. P. - | 32 | 73% | 1 |
7 | KOCH, R , (2010) STRESS IN EVAPORATED AND SPUTTERED THIN FILMS - A COMPARISON.SURFACE & COATINGS TECHNOLOGY. VOL. 204. ISSUE 12-13. P. 1973-1982 | 42 | 57% | 39 |
8 | DEL VECCHIO, AL , SPAEPEN, F , (2007) THE EFFECT OF DEPOSITION RATE ON THE INTRINSIC STRESS IN COPPER AND SILVER THIN FILMS.JOURNAL OF APPLIED PHYSICS. VOL. 101. ISSUE 6. P. - | 26 | 100% | 21 |
9 | LAFOURESSE, MC , BERTOCCI, U , STAFFORD, GR , (2015) DYNAMIC STRESS ANALYSIS APPLIED TO THE ELECTRODEPOSITION OF COPPER.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 162. ISSUE 1. P. D27 -D35 | 31 | 69% | 0 |
10 | CHASON, E , ENGWALL, AM , MILLER, CM , CHEN, CH , BHANDARI, A , SONI, SK , HEARNE, SJ , FREUND, LB , SHELDON, BW , (2015) STRESS EVOLUTION DURING GROWTH OF 1-D ISLAND ARRAYS: KINETICS AND LENGTH SCALING.SCRIPTA MATERIALIA. VOL. 97. ISSUE . P. 33 -36 | 20 | 100% | 2 |
Classes with closest relation at Level 1 |