Class information for:
Level 1: TRIODE ION PLATING//ENERGY RESOLVED MASS SPECTROSCOPY//AL PT

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
24227 319 15.4 41%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
378 3       SURFACE & COATINGS TECHNOLOGY//HIGH ENTROPY ALLOY//MATERIALS SCIENCE, COATINGS & FILMS 32127
527 2             SURFACE & COATINGS TECHNOLOGY//MATERIALS SCIENCE, COATINGS & FILMS//TITANIUM NITRIDE 14964
24227 1                   TRIODE ION PLATING//ENERGY RESOLVED MASS SPECTROSCOPY//AL PT 319

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 TRIODE ION PLATING authKW 382886 1% 100% 4
2 ENERGY RESOLVED MASS SPECTROSCOPY authKW 341860 2% 71% 5
3 AL PT authKW 255255 1% 67% 4
4 SELF ION ASSISTED DEPOSITION authKW 215372 1% 75% 3
5 AMORPHOUS AL2PT authKW 191443 1% 100% 2
6 SELF ION BOMBARDMENT authKW 127627 1% 67% 2
7 ALUMINIUM CARBON COMPOSITE FILMS authKW 95722 0% 100% 1
8 AMORPHOUS PHASE GROWTH authKW 95722 0% 100% 1
9 AR C2H2 N 2 PLASMA authKW 95722 0% 100% 1
10 BIAS SPUTTERING RELIABILITY authKW 95722 0% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 10567 41% 0% 132
2 Physics, Applied 4091 71% 0% 227
3 Materials Science, Multidisciplinary 671 34% 0% 107
4 Physics, Condensed Matter 537 23% 0% 73
5 Engineering, Electrical & Electronic 169 16% 0% 50
6 Metallurgy & Metallurgical Engineering 114 7% 0% 23
7 Nanoscience & Nanotechnology 111 7% 0% 23
8 Electrochemistry 11 2% 0% 7
9 Instruments & Instrumentation 8 3% 0% 8
10 Microscopy 7 1% 0% 2

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 COMMON PHYS 95722 0% 100% 1
2 ELECT FONDAMENTALE URA CNRS D022 95722 0% 100% 1
3 MAT ENG RD 47860 0% 50% 1
4 PROD ENG RD 31906 0% 33% 1
5 MAT SCI IW 19143 0% 20% 1
6 ELETROTECH 15952 0% 17% 1
7 MASS FORMING 15952 0% 17% 1
8 MET FORMING MET FORMING MACHINES IFUM 15952 0% 17% 1
9 MARCUS IND MFG ENGN 15312 1% 8% 2
10 MET FORMING METAL FORMING MACHINES 11963 0% 13% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SOLID STATE TECHNOLOGY 11612 5% 1% 15
2 VACUUM 8466 9% 0% 29
3 SURFACE & COATINGS TECHNOLOGY 7888 13% 0% 40
4 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 7350 10% 0% 33
5 THIN SOLID FILMS 4205 13% 0% 40
6 MICRO 2172 1% 1% 2
7 ACTA PHYSICA ACADEMIAE SCIENTIARUM HUNGARICAE 2055 1% 1% 2
8 ELECTROCOMPONENT SCIENCE AND TECHNOLOGY 1180 0% 1% 1
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 1108 4% 0% 14
10 SURFACE ENGINEERING 893 1% 0% 4

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 TRIODE ION PLATING 382886 1% 100% 4 Search TRIODE+ION+PLATING Search TRIODE+ION+PLATING
2 ENERGY RESOLVED MASS SPECTROSCOPY 341860 2% 71% 5 Search ENERGY+RESOLVED+MASS+SPECTROSCOPY Search ENERGY+RESOLVED+MASS+SPECTROSCOPY
3 AL PT 255255 1% 67% 4 Search AL+PT Search AL+PT
4 SELF ION ASSISTED DEPOSITION 215372 1% 75% 3 Search SELF+ION+ASSISTED+DEPOSITION Search SELF+ION+ASSISTED+DEPOSITION
5 AMORPHOUS AL2PT 191443 1% 100% 2 Search AMORPHOUS+AL2PT Search AMORPHOUS+AL2PT
6 SELF ION BOMBARDMENT 127627 1% 67% 2 Search SELF+ION+BOMBARDMENT Search SELF+ION+BOMBARDMENT
7 ALUMINIUM CARBON COMPOSITE FILMS 95722 0% 100% 1 Search ALUMINIUM+CARBON+COMPOSITE+FILMS Search ALUMINIUM+CARBON+COMPOSITE+FILMS
8 AMORPHOUS PHASE GROWTH 95722 0% 100% 1 Search AMORPHOUS+PHASE+GROWTH Search AMORPHOUS+PHASE+GROWTH
9 AR C2H2 N 2 PLASMA 95722 0% 100% 1 Search AR+C2H2+N+2+PLASMA Search AR+C2H2+N+2+PLASMA
10 BIAS SPUTTERING RELIABILITY 95722 0% 100% 1 Search BIAS+SPUTTERING+RELIABILITY Search BIAS+SPUTTERING+RELIABILITY

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 MACEK, M , CEKADA, M , (2008) ENERGY AND MASS SPECTROSCOPY OF IONS AND NEUTRALS IN COLD PLASMA.INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS. VOL. 38. ISSUE 4. P. 277-282 11 92% 0
2 MACEK, M , CEKADA, M , (2004) ENERGY AND MASS SPECTROSCOPY STUDIES DURING ION PLATING OF HARD COATINGS.SURFACE & COATINGS TECHNOLOGY. VOL. 180. ISSUE . P. 2 -8 9 90% 2
3 DAVISON, A , AVELAR-BATISTA, JC , WILSON, AD , LEYLAND, A , MATTHEWS, A , FANCEY, KS , (2002) DIAGNOSTIC STUDIES OF DISCHARGES USED FOR PLASMA ASSISTED PHYSICAL VAPOUR DEPOSITION.SURFACE ENGINEERING. VOL. 18. ISSUE 5. P. 385-390 9 90% 0
4 WILSON, RJ , WEISS, BL , (1991) THE SPECULAR REFLECTIVITY OF DC MAGNETRON SPUTTERED AL-1-PERCENT-SI FILMS.VACUUM. VOL. 42. ISSUE 15. P. 987-994 14 78% 1
5 YU, C , SANDHU, GS , DOAN, TT , (1992) THE COMBINATION OF HIGH-TEMPERATURE SPUTTERING WITH EXCIMER LASER PLANARIZATION FOR SUBMICROMETER CONTACT VIA FILLING.JOURNAL OF APPLIED PHYSICS. VOL. 72. ISSUE 4. P. 1599-1608 10 100% 1
6 DAVISON, A , WILSON, AD , AVELAR-BATISTA, JC , LEYLAND, A , MATTHEWS, A , FANCEY, KS , (2002) ION PLATING DISCHARGES: EVIDENCE OF CLUSTER FORMATION DURING METAL EVAPORATION.THIN SOLID FILMS. VOL. 414. ISSUE 1. P. 7-12 6 100% 2
7 FANCEY, KS , YOUNG, SJ , JAMES, AS , MATTHEWS, A , (1993) THE MICROSTRUCTURAL AND THICKNESS UNIFORMITY OF ZIRCONIA COATINGS PRODUCED BY RF ION PLATING.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING. VOL. 163. ISSUE 2. P. 171-175 8 89% 5
8 MACEK, M , NAVINSEK, B , PANJAN, P , KADLEC, S , (2001) A STUDY OF PLASMA PARAMETERS IN A BAI 730 M TRIODE ION PLATING SYSTEM BY MEANS OF A LANGMUIR PROBE AND PLASMA MASS AND ENERGY SPECTROSCOPY.SURFACE & COATINGS TECHNOLOGY. VOL. 135. ISSUE 2-3. P. 208-220 5 100% 5
9 WILSON, RJ , WEISS, BL , (1991) THE SHEET RESISTANCE OF 3-MU-M THICK AL-1-PERCENT-SI FILMS DEPOSITED BY BATCH MODE DC MAGNETRON SPUTTERING.THIN SOLID FILMS. VOL. 199. ISSUE 2. P. 291-297 10 71% 0
10 KAMOSHIDA, K , (2000) PREPARATION OF LOW-REFLECTIVITY ALUMINUM FILM USING DIRECT CURRENT MAGNETRON SPUTTERING IN AR/O-2 AND AR/N-2 ATMOSPHERES.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 18. ISSUE 5. P. 2565-2568 7 70% 2

Classes with closest relation at Level 1


Rank Class id link
1 2130 HIPIMS//HPPMS//HIGH POWER IMPULSE MAGNETRON SPUTTERING
2 2714 ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION
3 2390 TITANIUM NITRIDE//ZIRCONIUM NITRIDE//ZRN
4 24432 DIMETHYLALUMINUM HYDRIDE//DIMETHYLALUMINUMHYDRIDE DMAH//SELECTIVE AL CVD
5 29417 MAGNETOPLASMA ACCELERATOR//SCI GENIE SUR ES CNRS URA 1402//TUNGSTEN CARBON
6 34788 CERIUM MAGNETOPLUMBITE//EDS SPECTRA//ENAMEL INSERT RESTORATION
7 36758 LIFE PREDICT TEAM//ALUMINUM BERYLLIUM//BE AL COMPOSITES
8 34647 LOW TEMPERATURE PRESSURE BONDING//MOUNTING FORCE//PURE AL SHEET
9 19434 END HALL ION GUN//MWIR REGION//NON CHOPPED
10 8140 SOLID STATE TECHNOLOGY//DRY DEVELOPMENT//WT ADDITIVITY

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