Class information for:
Level 1: DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
3427 1986 21.9 70%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
378 3       SURFACE & COATINGS TECHNOLOGY//HIGH ENTROPY ALLOY//MATERIALS SCIENCE, COATINGS & FILMS 32127
527 2             SURFACE & COATINGS TECHNOLOGY//MATERIALS SCIENCE, COATINGS & FILMS//TITANIUM NITRIDE 14964
3427 1                   DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE 1986

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 DIFFUSION BARRIER authKW 1337447 13% 33% 265
2 CU METALLIZATION authKW 683240 3% 66% 67
3 TANTALUM NITRIDE authKW 577442 4% 52% 72
4 TA SI N authKW 316249 1% 86% 24
5 TUNGSTEN NITRIDE authKW 216927 2% 38% 37
6 COPPER METALLIZATION authKW 205159 2% 43% 31
7 CU DIFFUSION BARRIER authKW 192164 1% 83% 15
8 SELF FORMING BARRIER authKW 153735 1% 100% 10
9 TAN authKW 135727 2% 24% 37
10 CU INTERCONNECTION authKW 129897 1% 65% 13

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Materials Science, Coatings & Films 31642 29% 0% 573
2 Physics, Applied 20869 65% 0% 1286
3 Materials Science, Multidisciplinary 4614 35% 0% 696
4 Physics, Condensed Matter 2954 22% 0% 430
5 Nanoscience & Nanotechnology 2703 13% 0% 262
6 Engineering, Electrical & Electronic 1261 17% 0% 335
7 Electrochemistry 1223 7% 0% 143
8 Metallurgy & Metallurgical Engineering 523 6% 0% 126
9 Optics 158 5% 0% 103
10 Chemistry, Physical 114 8% 0% 167

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV PROC C ACITOR 102484 1% 67% 10
2 NEW YORK STATE ADV THIN FILM TECHNOL 53800 0% 50% 7
3 ACT MATRIX LIQUID CRYSTAL DISPLAY 48039 0% 63% 5
4 SEMICOND MICROSYST TECHN IHM 46121 0% 100% 3
5 INTEGRATED ELECT ELECT MFG ELECT MEDIA 34934 0% 45% 5
6 SEMICOND MICROSYST TECHNOL 34914 1% 15% 15
7 MET DEPOSIT PROD GRP 34589 0% 75% 3
8 FUDAN NOVELLUS INTERCONNECT 30747 0% 100% 2
9 NW SERV OFF 30747 0% 100% 2
10 SUBSTRATE ENGN 30747 0% 100% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 THIN SOLID FILMS 16135 10% 1% 196
2 MICROELECTRONIC ENGINEERING 15345 5% 1% 101
3 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 9043 7% 0% 134
4 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 6097 4% 0% 82
5 ELECTROCHEMICAL AND SOLID STATE LETTERS 5409 2% 1% 39
6 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 5071 3% 0% 69
7 SURFACE & COATINGS TECHNOLOGY 4469 4% 0% 76
8 JOURNAL OF ELECTRONIC MATERIALS 3571 2% 0% 48
9 APPLIED SURFACE SCIENCE 3043 4% 0% 85
10 JOURNAL OF APPLIED PHYSICS 2851 7% 0% 145

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 DIFFUSION BARRIER 1337447 13% 33% 265 Search DIFFUSION+BARRIER Search DIFFUSION+BARRIER
2 CU METALLIZATION 683240 3% 66% 67 Search CU+METALLIZATION Search CU+METALLIZATION
3 TANTALUM NITRIDE 577442 4% 52% 72 Search TANTALUM+NITRIDE Search TANTALUM+NITRIDE
4 TA SI N 316249 1% 86% 24 Search TA+SI+N Search TA+SI+N
5 TUNGSTEN NITRIDE 216927 2% 38% 37 Search TUNGSTEN+NITRIDE Search TUNGSTEN+NITRIDE
6 COPPER METALLIZATION 205159 2% 43% 31 Search COPPER+METALLIZATION Search COPPER+METALLIZATION
7 CU DIFFUSION BARRIER 192164 1% 83% 15 Search CU+DIFFUSION+BARRIER Search CU+DIFFUSION+BARRIER
8 SELF FORMING BARRIER 153735 1% 100% 10 Search SELF+FORMING+BARRIER Search SELF+FORMING+BARRIER
9 TAN 135727 2% 24% 37 Search TAN Search TAN
10 CU INTERCONNECTION 129897 1% 65% 13 Search CU+INTERCONNECTION Search CU+INTERCONNECTION

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 MCCLAIN, KR , O'DONOHUE, C , KOLEY, A , BONSU, RO , ABBOUD, KA , REVELLI, JC , ANDERSON, TJ , MCELWEE-WHITE, L , (2014) TUNGSTEN NITRIDO COMPLEXES AS PRECURSORS FOR LOW TEMPERATURE CHEMICAL VAPOR DEPOSITION OF WNXCY FILMS AS DIFFUSION BARRIERS FOR CU METALLIZATION.JOURNAL OF THE AMERICAN CHEMICAL SOCIETY. VOL. 136. ISSUE 4. P. 1650 -1662 49 62% 7
2 ARSHI, N , LU, JQ , JOO, YK , YOON, JH , KOO, BH , (2015) EFFECTS OF NITROGEN COMPOSITION ON THE RESISTIVITY OF REACTIVELY SPUTTERED TAN THIN FILMS.SURFACE AND INTERFACE ANALYSIS. VOL. 47. ISSUE 1. P. 154 -160 36 72% 3
3 HAN, JH , KIM, HY , LEE, SC , KIM, DH , PARK, BK , PARK, JS , JEON, DJ , CHUNG, TM , KIM, CG , (2016) GROWTH OF TANTALUM NITRIDE FILM AS A CU DIFFUSION BARRIER BY PLASMA-ENHANCED ATOMIC LAYER DEPOSITION FROM BIS((2-(DIMETHYLAMINO)ETHYL)(METHYL)AMIDO)METHYL(TERT-BUTYLIMIDO) TANTALUM COMPLEX.APPLIED SURFACE SCIENCE. VOL. 362. ISSUE . P. 176 -181 24 92% 1
4 TAKOUDIS, C , MAJUMDER, P , (2008) REACTIVELY SPUTTERED MO-V NITRIDE THIN FILMS AS TERNARY DIFFUSION BARRIERS FOR COPPER METALLIZATION.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 155. ISSUE 10. P. H703 -H706 30 94% 5
5 MCCLAIN, KR , O'DONOHUE, C , SHI, ZW , WALKER, AV , ABBOUD, KA , ANDERSON, T , MCELWEE-WHITE, L , (2012) SYNTHESIS OF WN(NME2)3 AS A PRECURSOR FOR THE DEPOSITION OF WNX NANOSPHERES.EUROPEAN JOURNAL OF INORGANIC CHEMISTRY. VOL. . ISSUE 29. P. 4579 -4584 38 66% 3
6 ISTRATOV, AA , FLINK, C , WEBER, ER , (2000) IMPACT OF THE UNIQUE PHYSICAL PROPERTIES OF COPPER IN SILICON ON CHARACTERIZATION OF COPPER DIFFUSION BARRIERS.PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS. VOL. 222. ISSUE 1. P. 261 -277 52 66% 13
7 LIN, CH , (2014) A NEW CU(GENX) ALLOY FILM FOR INDUSTRIAL APPLICATIONS.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 53. ISSUE 11. P. - 27 87% 0
8 KALOYEROS, AE , EISENBRAUN, E , (2000) ULTRATHIN DIFFUSION BARRIERS/LINERS FOR GIGASCALE COPPER METALLIZATION.ANNUAL REVIEW OF MATERIALS SCIENCE. VOL. 30. ISSUE . P. 363 -385 35 67% 262
9 DALILI, N , LIU, Q , IVEY, DG , (2013) THERMAL AND ELECTRICAL STABILITY OF TANX DIFFUSION BARRIERS FOR CU METALLIZATION.JOURNAL OF MATERIALS SCIENCE. VOL. 48. ISSUE 1. P. 489-501 28 78% 4
10 SU, YH , WU, SA , WU, CY , WANG, YL , LEE, WH , (2015) INVESTIGATION OF BARRIER PROPERTY OF COPPER MANGANESE ALLOY ON RUTHENIUM.IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. VOL. 15. ISSUE 1. P. 47 -53 24 89% 0

Classes with closest relation at Level 1


Rank Class id link
1 22649 W TI THIN FILMS//W 10TI ALLOY//W 10WTTI ALLOY
2 13873 TDEAT//TITANIUM NITRIDE//CVD TIN
3 11277 PERFLUORINATED CARBOXYLATES//ZENTRUM MIKROTECHNOL//COPPER FILMS
4 26984 AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION
5 23302 MOLYBDENUM NITRIDE//DELTA MON//MOLYBDENUM NITRIDE COATINGS
6 14564 RU//RUO2//RUTHENIUM DIOXIDE
7 16292 CVD W//TUNGSTEN THIN FILMS//CVD IRON
8 20135 EMBEDDED RESISTOR//RESISTIVE FILMS//THIN FILM RESISTOR
9 29312 CROSS KELVIN RESISTOR CKR//CROSS BRIDGE KELVIN RESISTOR CBKR//POLYMETAL
10 2714 ELECTROMIGRATION//ELECTROMIGRATION EM//STRESS INDUCED MIGRATION

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