Class information for:
Level 1: CVD W//TUNGSTEN THIN FILMS//CVD IRON

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
16292 662 20.4 50%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
715 3       BETA DIKETONATE//DIMETHYLALUMINUM HYDRIDE//CHEMICAL VAPOR DEPOSITION 5470
2014 2             BETA DIKETONATE//DIMETHYLALUMINUM HYDRIDE//CHEMICAL VAPOR DEPOSITION 5470
16292 1                   CVD W//TUNGSTEN THIN FILMS//CVD IRON 662

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 CVD W authKW 205459 1% 64% 7
2 TUNGSTEN THIN FILMS authKW 138374 0% 100% 3
3 CVD IRON authKW 92249 0% 100% 2
4 BLANKET TUNGSTEN authKW 61498 0% 67% 2
5 SINGLE WAFER REACTOR authKW 61498 0% 67% 2
6 A15 BETA W THIN FILMS authKW 46125 0% 100% 1
7 A15 CRYSTAL STRUCTURE authKW 46125 0% 100% 1
8 ABT MA INENBAU HBEREICH INGN WISSEN address 46125 0% 100% 1
9 ALD W authKW 46125 0% 100% 1
10 ALLGEMEINE ELEKTROTECH QUANTENELEKT address 46125 0% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 23090 42% 0% 281
2 Physics, Applied 6462 63% 0% 414
3 Physics, Condensed Matter 2015 30% 0% 198
4 Electrochemistry 1716 14% 0% 93
5 Materials Science, Multidisciplinary 812 27% 0% 176
6 Engineering, Electrical & Electronic 297 15% 0% 97
7 Nanoscience & Nanotechnology 180 6% 0% 43
8 Chemistry, Physical 135 13% 0% 83
9 Metallurgy & Metallurgical Engineering 41 4% 0% 24
10 Engineering, Manufacturing 8 1% 0% 6

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ABT MA INENBAU HBEREICH INGN WISSEN 46125 0% 100% 1
2 ALLGEMEINE ELEKTROTECH QUANTENELEKT 46125 0% 100% 1
3 AUSTRALIAN KEY MICROSCOPY MICROANAAL 46125 0% 100% 1
4 CHEM REACTOR TECHNOL 46125 0% 100% 1
5 CNRSURA 0022 46125 0% 100% 1
6 CNS TCS 46125 0% 100% 1
7 CRTTCNRS 46125 0% 100% 1
8 GEN PHYS LASERSPECT 46125 0% 100% 1
9 GG DEVYATYKH HIGH PUR SUBST 46125 0% 100% 1
10 GRUPO MAT ENGN SUPERF 46125 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 11599 13% 0% 87
2 THIN SOLID FILMS 6547 11% 0% 72
3 APPLIED SURFACE SCIENCE 5852 10% 0% 67
4 SOLID STATE TECHNOLOGY 4859 2% 1% 14
5 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 4663 6% 0% 38
6 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 1836 4% 0% 26
7 VIDE-SCIENCE TECHNIQUE ET APPLICATIONS 1526 1% 1% 4
8 JOURNAL OF THE INSTITUTE OF ENVIRONMENTAL SCIENCES 1439 0% 3% 1
9 CHEMICAL VAPOR DEPOSITION 1150 1% 1% 5
10 CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES 866 0% 1% 2

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 CVD W 205459 1% 64% 7 Search CVD+W Search CVD+W
2 TUNGSTEN THIN FILMS 138374 0% 100% 3 Search TUNGSTEN+THIN+FILMS Search TUNGSTEN+THIN+FILMS
3 CVD IRON 92249 0% 100% 2 Search CVD+IRON Search CVD+IRON
4 BLANKET TUNGSTEN 61498 0% 67% 2 Search BLANKET+TUNGSTEN Search BLANKET+TUNGSTEN
5 SINGLE WAFER REACTOR 61498 0% 67% 2 Search SINGLE+WAFER+REACTOR Search SINGLE+WAFER+REACTOR
6 A15 BETA W THIN FILMS 46125 0% 100% 1 Search A15+BETA+W+THIN+FILMS Search A15+BETA+W+THIN+FILMS
7 A15 CRYSTAL STRUCTURE 46125 0% 100% 1 Search A15+CRYSTAL+STRUCTURE Search A15+CRYSTAL+STRUCTURE
8 ALD W 46125 0% 100% 1 Search ALD+W Search ALD+W
9 AMORPHOUS LIKE TUNGSTEN SILICIDE 46125 0% 100% 1 Search AMORPHOUS+LIKE+TUNGSTEN+SILICIDE Search AMORPHOUS+LIKE+TUNGSTEN+SILICIDE
10 ARGON CAPTURING ENERGY 46125 0% 100% 1 Search ARGON+CAPTURING+ENERGY Search ARGON+CAPTURING+ENERGY

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 CREIGHTON, JR , PARMETER, JE , (1993) METAL CVD FOR MICROELECTRONIC APPLICATIONS - AN EXAMINATION OF SURFACE-CHEMISTRY AND KINETICS.CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES. VOL. 18. ISSUE 2. P. 175 -238 51 41% 61
2 KIM, SH , HWANG, ES , HA, SC , PYI, SH , SUN, HJ , LEE, JW , KAWK, N , KIM, JK , SOHN, H , KIM, J , (2005) CHARACTERIZATIONS OF PULSED CHEMICAL VAPOR DEPOSITED-TUNGSTEN THIN FILMS FOR ULTRAHIGH ASPECT RATIO W-PLUG PROCESS.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 152. ISSUE 6. P. C408-C417 20 74% 13
3 CHOI, HS , RHEE, SW , (1994) EFFECT OF CARRIER GASES ON THE CHEMICAL-VAPOR-DEPOSITION OF TUNGSTEN FROM WF6-SIH4.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 141. ISSUE 2. P. 475-479 21 100% 3
4 KUIJLAARS, KJ , KLEIJN, CR , VAN DEN AKKER, HEA , (1998) SIMULATION OF SELECTIVE TUNGSTEN CHEMICAL VAPOUR DEPOSITION.SOLID-STATE ELECTRONICS. VOL. 42. ISSUE 5. P. A43-A54 20 87% 6
5 BOZACK, MJ , (1992) REACTION OF TUNGSTEN HEXAFLUORIDE WITH SI AND TIN SURFACES.THIN SOLID FILMS. VOL. 221. ISSUE 1-2. P. 55-60 22 100% 1
6 CHANG, IS , HON, MH , (1998) GROWTH CHARACTERISTICS AND ELECTRICAL RESISTIVITY OF CHEMICAL VAPOR-DEPOSITED TUNGSTEN FILM.THIN SOLID FILMS. VOL. 333. ISSUE 1-2. P. 108-113 16 100% 5
7 HSIEH, CT , TING, JM , (2007) EFFECT OF GROWTH CONDITIONS ON THE STRUCTURE AND PROPERTIES OF TUNGSTEN FILMS PREPARED USING A THERMAL EVAPORATION PROCESS.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. VOL. 25. ISSUE 6. P. 1552-1556 18 67% 4
8 SLUITER, MHF , (2009) INTERSTITIALS IN TETRAHEDRALLY CLOSE-PACKED PHASES: C, N, O, AND F IN BETA-TUNGSTEN FROM FIRST PRINCIPLES.PHYSICAL REVIEW B. VOL. 80. ISSUE 22. P. - 18 60% 7
9 BELKACEM, A , ARNAL, Y , PELLETIER, J , ANDRE, E , OBERLIN, JC , (1994) PREPARATION OF LOW-RESISTIVITY TUNGSTEN THIN-FILMS DEPOSITED BY MICROWAVE-PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION FROM THE TUNGSTEN HEXAFLUORIDE HYDROGEN SYSTEM.THIN SOLID FILMS. VOL. 241. ISSUE 1-2. P. 301-304 18 90% 0
10 DEEPAK , GAUR, A , (2001) ROLE OF TEMPERATURE GRADIENTS IN BLANKET TUNGSTEN FOR MICROELECTRONIC CONTACTS.SEMICONDUCTOR SCIENCE AND TECHNOLOGY. VOL. 16. ISSUE 8. P. 665 -675 16 76% 0

Classes with closest relation at Level 1


Rank Class id link
1 24432 DIMETHYLALUMINUM HYDRIDE//DIMETHYLALUMINUMHYDRIDE DMAH//SELECTIVE AL CVD
2 29312 CROSS KELVIN RESISTOR CKR//CROSS BRIDGE KELVIN RESISTOR CBKR//POLYMETAL
3 29417 MAGNETOPLASMA ACCELERATOR//SCI GENIE SUR ES CNRS URA 1402//TUNGSTEN CARBON
4 22649 W TI THIN FILMS//W 10TI ALLOY//W 10WTTI ALLOY
5 8898 FREEFORM FABRICAT S//NEMISIS TEAM//LCVD
6 3226 TISI2//TITANIUM SILICIDE//SALICIDE
7 36508 110 PLANES//ATOMS MOVEMENT ENERGY//BIOCIDE GLASS
8 11277 PERFLUORINATED CARBOXYLATES//ZENTRUM MIKROTECHNOL//COPPER FILMS
9 13873 TDEAT//TITANIUM NITRIDE//CVD TIN
10 3427 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE

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