Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
14495 | 766 | 19.3 | 38% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | CRITICAL AREA | authKW | 748505 | 3% | 72% | 26 |
2 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | journal | 653021 | 21% | 10% | 160 |
3 | WAFER MAP | authKW | 306626 | 1% | 77% | 10 |
4 | YIELD MODEL | authKW | 292292 | 3% | 33% | 22 |
5 | KILL RATIO | authKW | 244153 | 1% | 88% | 7 |
6 | CRITICAL AREA ANALYSIS | authKW | 166090 | 1% | 83% | 5 |
7 | SEMICONDUCTOR YIELD | authKW | 166090 | 1% | 83% | 5 |
8 | WAFER BIN MAP | authKW | 159448 | 1% | 100% | 4 |
9 | DEFECT DENSITY DISTRIBUTION | authKW | 119586 | 0% | 100% | 3 |
10 | DEFECT REDUCT TECHNOL | address | 119586 | 0% | 100% | 3 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Engineering, Manufacturing | 22060 | 29% | 0% | 225 |
2 | Engineering, Electrical & Electronic | 10715 | 68% | 0% | 521 |
3 | Computer Science, Hardware & Architecture | 7281 | 17% | 0% | 134 |
4 | Physics, Applied | 2140 | 35% | 0% | 269 |
5 | Physics, Condensed Matter | 1887 | 27% | 0% | 208 |
6 | Operations Research & Management Science | 1179 | 9% | 0% | 71 |
7 | Engineering, Industrial | 891 | 6% | 0% | 47 |
8 | Computer Science, Artificial Intelligence | 689 | 8% | 0% | 64 |
9 | Computer Science, Interdisciplinary Applications | 642 | 8% | 0% | 64 |
10 | Nanoscience & Nanotechnology | 447 | 9% | 0% | 69 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | DEFECT REDUCT TECHNOL | 119586 | 0% | 100% | 3 |
2 | ADV TEST CHIP | 79724 | 0% | 100% | 2 |
3 | YIELD ENGN | 79724 | 0% | 100% | 2 |
4 | ADM OPERAT STRATEG INITIAT | 39862 | 0% | 100% | 1 |
5 | ADV CHIP TESTING | 39862 | 0% | 100% | 1 |
6 | ADV DFT TEAM | 39862 | 0% | 100% | 1 |
7 | ADV SILICON RD | 39862 | 0% | 100% | 1 |
8 | ADV TECHNOL INVESTMENT CO | 39862 | 0% | 100% | 1 |
9 | ALFRED P SLOAN MANAGEMENT MANAGEMENT SCI | 39862 | 0% | 100% | 1 |
10 | ATIC KHALIFA SEMICOND | 39862 | 0% | 100% | 1 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 653021 | 21% | 10% | 160 |
2 | IEEE DESIGN & TEST OF COMPUTERS | 21363 | 3% | 2% | 23 |
3 | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 15854 | 6% | 1% | 44 |
4 | SOLID STATE TECHNOLOGY | 14515 | 3% | 1% | 26 |
5 | MICRO | 11085 | 1% | 4% | 7 |
6 | MICROELECTRONICS RELIABILITY | 8712 | 5% | 1% | 39 |
7 | JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS | 4461 | 1% | 1% | 11 |
8 | JOURNAL OF INTELLIGENT MANUFACTURING | 4122 | 2% | 1% | 13 |
9 | IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 3411 | 2% | 1% | 13 |
10 | IEEE INTERNATIONAL SOLID STATE CIRCUITS CONFERENCE | 3411 | 0% | 3% | 3 |
Author Key Words |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | CRITICAL AREA | 748505 | 3% | 72% | 26 | Search CRITICAL+AREA | Search CRITICAL+AREA |
2 | WAFER MAP | 306626 | 1% | 77% | 10 | Search WAFER+MAP | Search WAFER+MAP |
3 | YIELD MODEL | 292292 | 3% | 33% | 22 | Search YIELD+MODEL | Search YIELD+MODEL |
4 | KILL RATIO | 244153 | 1% | 88% | 7 | Search KILL+RATIO | Search KILL+RATIO |
5 | CRITICAL AREA ANALYSIS | 166090 | 1% | 83% | 5 | Search CRITICAL+AREA+ANALYSIS | Search CRITICAL+AREA+ANALYSIS |
6 | SEMICONDUCTOR YIELD | 166090 | 1% | 83% | 5 | Search SEMICONDUCTOR+YIELD | Search SEMICONDUCTOR+YIELD |
7 | WAFER BIN MAP | 159448 | 1% | 100% | 4 | Search WAFER+BIN+MAP | Search WAFER+BIN+MAP |
8 | DEFECT DENSITY DISTRIBUTION | 119586 | 0% | 100% | 3 | Search DEFECT+DENSITY+DISTRIBUTION | Search DEFECT+DENSITY+DISTRIBUTION |
9 | SPATIAL DEFECTS | 119586 | 0% | 100% | 3 | Search SPATIAL+DEFECTS | Search SPATIAL+DEFECTS |
10 | YIELD LEARNING | 110381 | 1% | 46% | 6 | Search YIELD+LEARNING | Search YIELD+LEARNING |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | KOREN, I , KOREN, Z , (1998) DEFECT TOLERANCE IN VLSI CIRCUITS: TECHNIQUES AND YIELD ANALYSIS.PROCEEDINGS OF THE IEEE. VOL. 86. ISSUE 9. P. 1819 -1836 | 37 | 73% | 95 |
2 | ZHOU, QA , ZENG, L , ZHOU, SY , (2010) STATISTICAL DETECTION OF DEFECT PATTERNS USING HOUGH TRANSFORM.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 23. ISSUE 3. P. 370-380 | 18 | 86% | 2 |
3 | BARON, M , TAKKEN, A , YASHCHIN, E , LANZEROTTI, M , (2008) MODELING AND FORECASTING OF DEFECT-LIMITED YIELD IN SEMICONDUCTOR MANUFACTURING.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 21. ISSUE 4. P. 614-624 | 16 | 100% | 4 |
4 | STAPPER, CH , ROSNER, RJ , (1995) INTEGRATED-CIRCUIT YIELD MANAGEMENT AND YIELD ANALYSIS - DEVELOPMENT AND IMPLEMENTATION.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 8. ISSUE 2. P. 95-102 | 21 | 95% | 77 |
5 | LIN, JS , (2012) A NOVEL DESIGN OF WAFER YIELD MODEL FOR SEMICONDUCTOR USING A GMDH POLYNOMIAL AND PRINCIPAL COMPONENT ANALYSIS.EXPERT SYSTEMS WITH APPLICATIONS. VOL. 39. ISSUE 8. P. 6665 -6671 | 13 | 100% | 2 |
6 | WANG, CH , (2009) SEPARATION OF COMPOSITE DEFECT PATTERNS ON WAFER BIN MAP USING SUPPORT VECTOR CLUSTERING.EXPERT SYSTEMS WITH APPLICATIONS. VOL. 36. ISSUE 2. P. 2554-2561 | 19 | 70% | 12 |
7 | CHOI, G , KIM, SH , HA, C , BAE, SJ , (2012) MULTI-STEP ART1 ALGORITHM FOR RECOGNITION OF DEFECT PATTERNS ON SEMICONDUCTOR WAFERS.INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH. VOL. 50. ISSUE 12. P. 3274-3287 | 19 | 63% | 4 |
8 | KRUEGER, DC , MONTGOMERY, DC , (2014) MODELING AND ANALYZING SEMICONDUCTOR YIELD WITH GENERALIZED LINEAR MIXED MODELS.APPLIED STOCHASTIC MODELS IN BUSINESS AND INDUSTRY. VOL. 30. ISSUE 6. P. 691 -707 | 15 | 75% | 1 |
9 | PAPADOPOULOU, E , (2011) NET-AWARE CRITICAL AREA EXTRACTION FOR OPENS IN VLSI CIRCUITS VIA HIGHER-ORDER VORONOI DIAGRAMS.IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. VOL. 30. ISSUE 5. P. 704-717 | 15 | 79% | 2 |
10 | CHIEN, CF , HSU, SC , CHEN, YJ , (2013) A SYSTEM FOR ONLINE DETECTION AND CLASSIFICATION OF WAFER BIN MAP DEFECT PATTERNS FOR MANUFACTURING INTELLIGENCE.INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH. VOL. 51. ISSUE 8. P. 2324-2338 | 15 | 71% | 5 |
Classes with closest relation at Level 1 |