Class information for:
Level 1: IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY//MCM TESTING//THERMAL ENGN TECHNOL

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
21792 405 18.5 27%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
9 4 COMPUTER SCIENCE, THEORY & METHODS//COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE//COMPUTER SCIENCE, INFORMATION SYSTEMS 1247339
264 3       COMPUTER SCIENCE, HARDWARE & ARCHITECTURE//IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS//ENGINEERING, ELECTRICAL & ELECTRONIC 44494
752 2             JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS//IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS//SOFT ERROR 12428
21792 1                   IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY//MCM TESTING//THERMAL ENGN TECHNOL 405

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY journal 337964 19% 6% 76
2 MCM TESTING authKW 169637 1% 75% 3
3 THERMAL ENGN TECHNOL address 150790 0% 100% 2
4 IBM JOURNAL OF RESEARCH AND DEVELOPMENT journal 133789 15% 3% 59
5 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING journal 104093 6% 6% 23
6 WIREABILITY authKW 100525 0% 67% 2
7 J AN MARINE SCI TECHNOL address 80416 1% 27% 4
8 AC BIST authKW 75395 0% 100% 1
9 ACTIVE EDGE STRIP SENSORS authKW 75395 0% 100% 1
10 ACTIVE SUBSTRATE TEST STRUCTURES authKW 75395 0% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 10140 27% 0% 111
2 Computer Science, Hardware & Architecture 6260 22% 0% 90
3 Engineering, Electrical & Electronic 4898 63% 0% 257
4 Computer Science, Software Engineering 2456 18% 0% 74
5 Computer Science, Theory & Methods 1302 16% 0% 65
6 Computer Science, Information Systems 1291 15% 0% 61
7 Materials Science, Multidisciplinary 743 32% 0% 128
8 Physics, Applied 138 15% 0% 59
9 Physics, Condensed Matter 44 8% 0% 31
10 Instruments & Instrumentation 39 4% 0% 16

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 THERMAL ENGN TECHNOL 150790 0% 100% 2
2 J AN MARINE SCI TECHNOL 80416 1% 27% 4
3 ASME ADV THERMAL 75395 0% 100% 1
4 COMPONENTI ELETTR CENT RD AGRATE 75395 0% 100% 1
5 DISCRETE DEVICES DEV 75395 0% 100% 1
6 ENGN 4TH 75395 0% 100% 1
7 HIGH END POWER SYST DEV 75395 0% 100% 1
8 ICC DIAGONAL 75395 0% 100% 1
9 MECH DESIGN COOLING 75395 0% 100% 1
10 MIDRANGE SYST 75395 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 337964 19% 6% 76
2 IBM JOURNAL OF RESEARCH AND DEVELOPMENT 133789 15% 3% 59
3 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 104093 6% 6% 23
4 SOLID STATE TECHNOLOGY 17931 5% 1% 21
5 JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS 17906 4% 1% 16
6 NEC RESEARCH & DEVELOPMENT 11077 2% 2% 8
7 ELECTROCOMPONENT SCIENCE AND TECHNOLOGY 8371 1% 4% 3
8 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 6984 1% 2% 6
9 ELECTRONICS 4823 1% 1% 5
10 GEC JOURNAL OF RESEARCH 3939 1% 2% 3

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 MCM TESTING 169637 1% 75% 3 Search MCM+TESTING Search MCM+TESTING
2 WIREABILITY 100525 0% 67% 2 Search WIREABILITY Search WIREABILITY
3 AC BIST 75395 0% 100% 1 Search AC+BIST Search AC+BIST
4 ACTIVE EDGE STRIP SENSORS 75395 0% 100% 1 Search ACTIVE+EDGE+STRIP+SENSORS Search ACTIVE+EDGE+STRIP+SENSORS
5 ACTIVE SUBSTRATE TEST STRUCTURES 75395 0% 100% 1 Search ACTIVE+SUBSTRATE+TEST+STRUCTURES Search ACTIVE+SUBSTRATE+TEST+STRUCTURES
6 AFFNIFTY 75395 0% 100% 1 Search AFFNIFTY Search AFFNIFTY
7 AGCM ATMOSPHERIC GENERAL CIRCULATION MODEL 75395 0% 100% 1 Search AGCM+ATMOSPHERIC+GENERAL+CIRCULATION+MODEL Search AGCM+ATMOSPHERIC+GENERAL+CIRCULATION+MODEL
8 AN ALL SILICON PIXEL TRACKER 75395 0% 100% 1 Search AN+ALL+SILICON+PIXEL+TRACKER Search AN+ALL+SILICON+PIXEL+TRACKER
9 ANALYSIS FINITE DIFFERENCE COMBINED SOLUTION 75395 0% 100% 1 Search ANALYSIS+FINITE+DIFFERENCE+COMBINED+SOLUTION Search ANALYSIS+FINITE+DIFFERENCE+COMBINED+SOLUTION
10 AND TRAVELING SALESMAN PROBLEM 75395 0% 100% 1 Search AND+TRAVELING+SALESMAN+PROBLEM Search AND+TRAVELING+SALESMAN+PROBLEM

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 ZORIAN, Y , (1997) FUNDAMENTALS OF MCM TESTING AND DESIGN-FOR-TESTABILITY.JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS. VOL. 10. ISSUE 1-2. P. 7 -14 13 87% 3
2 HAGGE, JK , WAGNER, RJ , (1992) HIGH-YIELD ASSEMBLY OF MULTICHIP MODULES THROUGH KNOWN-GOOD ICS AND EFFECTIVE TEST STRATEGIES.PROCEEDINGS OF THE IEEE. VOL. 80. ISSUE 12. P. 1965 -1994 19 58% 31
3 PIURI, V , LOMBARDI, F , PARK, N , (2001) TESTING AND EVALUATING THE QUALITY-LEVEL OF STRATIFIED MULTICHIP MODULE INSTRUMENTATION.IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT. VOL. 50. ISSUE 6. P. 1615 -1624 8 80% 0
4 HAGGE, JK , (1992) STATE-OF-THE-ART MULTICHIP MODULES FOR AVIONICS.IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY. VOL. 15. ISSUE 1. P. 29-42 16 53% 7
5 JENSEN, RJ , (1989) INTERCONNECTION AND PACKAGING OF HIGH-PERFORMANCE INTEGRATED-CIRCUITS.ADVANCES IN CHEMISTRY SERIES. VOL. . ISSUE 221. P. 441-504 25 38% 0
6 KIM, B , SWAMINATHAN, M , CHATTERJEE, A , SCHIMMEL, D , (1997) A NOVEL TEST TECHNIQUE FOR MCM SUBSTRATES.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING. VOL. 20. ISSUE 1. P. 2-12 6 100% 17
7 PARK, N , LOMBARDI, F , (2002) ANALYSIS OF STRATIFIED TESTING FOR MULTICHIP MODULE SYSTEMS.IEEE TRANSACTIONS ON RELIABILITY. VOL. 51. ISSUE 1. P. 100 -110 6 86% 0
8 CHOI, M , PARK, N , LOMBARDI, F , PIURI, V , (2002) QUALITY ENHANCEMENT OF RECONFIGURABLE MULTICHIP MODULE SYSTEMS BY REDUNDANCY UTILIZATION.IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT. VOL. 51. ISSUE 4. P. 740 -749 5 100% 1
9 MA, XJ , LOMBARDI, F , (2008) SUBSTRATE TESTING ON A MULTI-SITE/MULTI-PROBE ATE.JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS. VOL. 24. ISSUE 1-3. P. 193 -201 7 54% 5
10 LASKAR, AS , BLYTHE, S , (1993) EPOXY MULTICHIP MODULES - A SOLUTION TO THE PROBLEM OF PACKAGING AND INTERCONNECTION OF SENSORS AND SIGNAL-PROCESSING CHIPS.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 36. ISSUE 1. P. 1-27 13 46% 14

Classes with closest relation at Level 1


Rank Class id link
1 35757 SOLDERLESS TECHNOLOGY//PRESS FIT ASSEMBLY//AT&T TECHNICAL JOURNAL
2 26171 IBM SYST TECHNOL GRP//IBM JOURNAL OF RESEARCH AND DEVELOPMENT//390
3 14495 CRITICAL AREA//IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING//WAFER MAP
4 27623 BENZOCYCLOBUTENE//INTERCONNECTION TECHNIQUE//WATER ABSORPTIONS
5 34214 CHARGE DECAY MODELS//CHARGE MOTION ON SURFACES//ELE ON ION PHYS GRP
6 9272 POLYIMIDE//LEHRSTUHL MAT VERBUNDE//PMDA ODA
7 11170 SIMULTANEOUS SWITCHING NOISE//SIMULTANEOUS SWITCHING NOISE SSN//SIGNAL INTEGRITY
8 37119 2K X 2K//CHINA SCI TECHNOL INFRARED DETECTO//DEBYE CHARACTERISTIC TEMPERATURE
9 20299 ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//CONDUCTIVE ANODIC FILAMENT
10 34938 BRANCHED WAVEGUIDE//PHOTONIC DOT//CMOS MICROPROCESSOR

Go to start page