Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
12204 | 924 | 20.1 | 56% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
19 | 4 | ASTRONOMY & ASTROPHYSICS//ASTROPHYSICAL JOURNAL//ASTRON | 523489 |
158 | 3 | NUCLEAR FUSION//PHYSICS, FLUIDS & PLASMAS//PLASMA PHYSICS AND CONTROLLED FUSION | 61209 |
1077 | 2 | PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 9920 |
12204 | 1 | RUN TO RUN CONTROL//VIRTUAL METROLOGY//IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 924 |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | RUN TO RUN CONTROL | authKW | 1388341 | 6% | 76% | 55 |
2 | VIRTUAL METROLOGY | authKW | 947004 | 4% | 87% | 33 |
3 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | journal | 854367 | 22% | 13% | 201 |
4 | VIRTUAL METROLOGY VM | authKW | 462636 | 2% | 100% | 14 |
5 | AUTOMATIC VIRTUAL METROLOGY AVM | authKW | 396545 | 1% | 100% | 12 |
6 | RUN TO RUN R2R CONTROL | authKW | 330454 | 1% | 100% | 10 |
7 | ADVANCED PROCESS CONTROL APC | authKW | 297403 | 1% | 75% | 12 |
8 | RUN TO RUN PROCESS CONTROL | authKW | 264363 | 1% | 100% | 8 |
9 | EWMA CONTROLLER | authKW | 198273 | 1% | 100% | 6 |
10 | PHOTORESIST PROCESSING | authKW | 179911 | 1% | 78% | 7 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Engineering, Manufacturing | 26926 | 30% | 0% | 273 |
2 | Physics, Applied | 6235 | 53% | 0% | 486 |
3 | Engineering, Electrical & Electronic | 5370 | 45% | 0% | 415 |
4 | Materials Science, Coatings & Films | 2708 | 13% | 0% | 117 |
5 | Physics, Condensed Matter | 2566 | 29% | 0% | 265 |
6 | Engineering, Industrial | 2036 | 8% | 0% | 77 |
7 | Automation & Control Systems | 1966 | 10% | 0% | 91 |
8 | Operations Research & Management Science | 1654 | 10% | 0% | 92 |
9 | Nanoscience & Nanotechnology | 676 | 10% | 0% | 92 |
10 | Computer Science, Artificial Intelligence | 262 | 5% | 0% | 46 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | MFG INFORMAT SYST | 112597 | 2% | 15% | 22 |
2 | ENGN ADV ELECT MAT PROC | 99136 | 0% | 100% | 3 |
3 | NISHI YODOGAWA KU | 74351 | 0% | 75% | 3 |
4 | AUTOMATED PRECIS MFG | 66091 | 0% | 100% | 2 |
5 | LARGE SCALE INTEGRAT | 66091 | 0% | 100% | 2 |
6 | MICROMECHATRON | 63543 | 1% | 38% | 5 |
7 | PSE GRP | 47576 | 1% | 24% | 6 |
8 | ADV MICROELECT TECHNOL | 44059 | 0% | 67% | 2 |
9 | ABELL CHAIR ENGN | 33045 | 0% | 100% | 1 |
10 | ADV MAT SEMICOND DEVICE TECHNOLL | 33045 | 0% | 100% | 1 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 854367 | 22% | 13% | 201 |
2 | JOURNAL OF PROCESS CONTROL | 12847 | 3% | 1% | 28 |
3 | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 9206 | 7% | 0% | 63 |
4 | SOLID STATE TECHNOLOGY | 8602 | 2% | 1% | 22 |
5 | MICRO | 6748 | 1% | 3% | 6 |
6 | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 6388 | 6% | 0% | 57 |
7 | IIE TRANSACTIONS | 5126 | 2% | 1% | 20 |
8 | JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS | 2168 | 0% | 2% | 4 |
9 | TECHNOMETRICS | 1923 | 1% | 1% | 9 |
10 | JOURNAL OF QUALITY TECHNOLOGY | 1879 | 1% | 1% | 8 |
Author Key Words |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | RUN TO RUN CONTROL | 1388341 | 6% | 76% | 55 | Search RUN+TO+RUN+CONTROL | Search RUN+TO+RUN+CONTROL |
2 | VIRTUAL METROLOGY | 947004 | 4% | 87% | 33 | Search VIRTUAL+METROLOGY | Search VIRTUAL+METROLOGY |
3 | VIRTUAL METROLOGY VM | 462636 | 2% | 100% | 14 | Search VIRTUAL+METROLOGY+VM | Search VIRTUAL+METROLOGY+VM |
4 | AUTOMATIC VIRTUAL METROLOGY AVM | 396545 | 1% | 100% | 12 | Search AUTOMATIC+VIRTUAL+METROLOGY+AVM | Search AUTOMATIC+VIRTUAL+METROLOGY+AVM |
5 | RUN TO RUN R2R CONTROL | 330454 | 1% | 100% | 10 | Search RUN+TO+RUN+R2R+CONTROL | Search RUN+TO+RUN+R2R+CONTROL |
6 | ADVANCED PROCESS CONTROL APC | 297403 | 1% | 75% | 12 | Search ADVANCED+PROCESS+CONTROL+APC | Search ADVANCED+PROCESS+CONTROL+APC |
7 | RUN TO RUN PROCESS CONTROL | 264363 | 1% | 100% | 8 | Search RUN+TO+RUN+PROCESS+CONTROL | Search RUN+TO+RUN+PROCESS+CONTROL |
8 | EWMA CONTROLLER | 198273 | 1% | 100% | 6 | Search EWMA+CONTROLLER | Search EWMA+CONTROLLER |
9 | PHOTORESIST PROCESSING | 179911 | 1% | 78% | 7 | Search PHOTORESIST+PROCESSING | Search PHOTORESIST+PROCESSING |
10 | RUN TO RUN | 179911 | 1% | 78% | 7 | Search RUN+TO+RUN | Search RUN+TO+RUN |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | RINGWOOD, JV , LYNN, S , BACELLI, G , MA, BB , RAGNOLI, E , MCLOONE, S , (2010) ESTIMATION AND CONTROL IN SEMICONDUCTOR ETCH: PRACTICE AND POSSIBILITIES.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 23. ISSUE 1. P. 87-98 | 69 | 74% | 9 |
2 | TAN, F , PAN, TH , LI, ZM , CHEN, S , (2015) SURVEY ON RUN-TO-RUN CONTROL ALGORITHMS IN HIGH-MIX SEMICONDUCTOR MANUFACTURING PROCESSES.IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS. VOL. 11. ISSUE 6. P. 1435 -1444 | 34 | 94% | 1 |
3 | GONG, QS , YANG, GK , PAN, CC , LEE, MS , (2016) STABILITY AND CONTROL PERFORMANCE ANALYSIS OF DOUBLE EWMA CONTROLLER WITH METROLOGY DELAY.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 29. ISSUE 1. P. 9 -16 | 22 | 96% | 0 |
4 | JIMENEZ-FERNANDEZ, VM , REYES-BETANZO, C , ANGELICA-CERDAN, M , HERNANDEZ-PAXTIAN, ZJ , VAZQUEZ-LEAL, H , ITZMOYOTL-TOXQUI, A , (2013) PREDICTION OF SILICON DRY ETCHING USING A PIECEWISE LINEAR ALGORITHM.JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS. VOL. 36. ISSUE 7. P. 941-950 | 28 | 80% | 0 |
5 | CHENG, FT , KAO, CA , CHEN, CF , TSAI, WH , (2015) TUTORIAL ON APPLYING THE VM TECHNOLOGY FOR TFT-LCD MANUFACTURING.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. VOL. 28. ISSUE 1. P. 55 -69 | 20 | 100% | 1 |
6 | TSENG, ST , MI, HC , LEE, IC , (2016) A MULTIVARIATE EWMA CONTROLLER FOR LINEAR DYNAMIC PROCESSES.TECHNOMETRICS. VOL. 58. ISSUE 1. P. 104 -115 | 22 | 85% | 0 |
7 | ZHENG, Y , WONG, DSH , WANG, YW , FANG, HJ , (2014) TAKAGI-SUGENO MODEL BASED ANALYSIS OF EWMA RTR CONTROL OF BATCH PROCESSES WITH STOCHASTIC METROLOGY DELAY AND MIXED PRODUCTS.IEEE TRANSACTIONS ON CYBERNETICS. VOL. 44. ISSUE 7. P. 1155 -1168 | 23 | 82% | 3 |
8 | LIN, CH , TSENG, ST , WANG, HF , (2013) MODIFIED EWMA CONTROLLER SUBJECT TO METROLOGY DELAY.IIE TRANSACTIONS. VOL. 45. ISSUE 4. P. 409 -421 | 21 | 91% | 0 |
9 | HSU, CY , WU, JZ , (2016) ERROR-SMOOTHING EXPONENTIALLY WEIGHTED MOVING AVERAGE FOR IMPROVING CRITICAL DIMENSION PERFORMANCE IN PHOTOLITHOGRAPHY PROCESS.INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING-THEORY APPLICATIONS AND PRACTICE. VOL. 23. ISSUE 5. P. 372 -381 | 19 | 90% | 0 |
10 | LEE, AC , KUO, TW , MA, CT , (2012) COMBINED PRODUCT AND TOOL DISTURBANCE ESTIMATOR FOR THE MIX-PRODUCT PROCESS AND ITS APPLICATION TO THE REMOVAL RATE ESTIMATION IN CMP PROCESS.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING. VOL. 13. ISSUE 4. P. 471-481 | 18 | 95% | 4 |
Classes with closest relation at Level 1 |