Class information for:
Level 1: THERMAL INTERFACE MATERIAL//THERMAL CONDUCTIVITY//THERMAL PASTE

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
8345 1263 29.6 68%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
263 3       IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION//PARTIAL DISCHARGE//POLYMER ELECTROLYTE 44523
871 2             CARBON NANOTUBES//NANOCOMPOSITES//CONDUCTIVE POLYMER COMPOSITES 11528
8345 1                   THERMAL INTERFACE MATERIAL//THERMAL CONDUCTIVITY//THERMAL PASTE 1263

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 THERMAL INTERFACE MATERIAL authKW 339249 3% 35% 40
2 THERMAL CONDUCTIVITY authKW 332369 29% 4% 360
3 THERMAL PASTE authKW 265927 1% 100% 11
4 SOFT TOOLING PROCESS authKW 120876 0% 100% 5
5 CRETEIL VAL DE MARNE CERTES address 77359 0% 80% 4
6 FLASH RADIOMETRY authKW 72526 0% 100% 3
7 METAL FILLED POLYMERS authKW 72526 0% 100% 3
8 POLYMER ENGN MECH ENGN TECHNOL address 72526 0% 100% 3
9 THERMAL CONDUCTIVE COMPOSITES authKW 72526 0% 100% 3
10 UMR CNRS6607 address 72526 0% 100% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Composites 23471 20% 0% 252
2 Polymer Science 8012 30% 0% 384
3 Thermodynamics 1755 10% 0% 127
4 Materials Science, Multidisciplinary 1300 25% 0% 312
5 Engineering, Manufacturing 655 4% 0% 53
6 Engineering, Mechanical 627 8% 0% 101
7 Nanoscience & Nanotechnology 511 8% 0% 97
8 Physics, Applied 320 13% 0% 165
9 Materials Science, Characterization, Testing 295 2% 0% 26
10 Mechanics 282 6% 0% 78

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 CRETEIL VAL DE MARNE CERTES 77359 0% 80% 4
2 POLYMER ENGN MECH ENGN TECHNOL 72526 0% 100% 3
3 UMR CNRS6607 72526 0% 100% 3
4 AEROSP 4 48350 0% 100% 2
5 ETUD RECH THERM 48350 0% 100% 2
6 POLYMER SCI PLAST PROC 48350 0% 100% 2
7 RD MAT ECODESIGN SECT 48350 0% 100% 2
8 MULTIFUNCT STRUCT COMPOSITE 48346 0% 50% 4
9 POLYMER CHEM PHYSMINIST EDUC ENGN 43513 0% 60% 3
10 SHANGHAI ELECT INSULAT THERMAL AGING 36591 1% 9% 16

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 POLYMER COMPOSITES 18679 4% 1% 56
2 COMPOSITES SCIENCE AND TECHNOLOGY 10616 4% 1% 54
3 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING 9809 3% 1% 42
4 JOURNAL OF ELECTRONIC PACKAGING 7046 2% 2% 19
5 JOURNAL OF APPLIED POLYMER SCIENCE 6353 8% 0% 107
6 JOURNAL OF COMPOSITE MATERIALS 4297 2% 1% 29
7 COMPOSITES PART B-ENGINEERING 3029 2% 1% 24
8 JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS 2710 1% 1% 11
9 POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING 2119 1% 1% 17
10 POLYMERS FOR ADVANCED TECHNOLOGIES 2024 1% 1% 17

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 THERMAL INTERFACE MATERIAL 339249 3% 35% 40 Search THERMAL+INTERFACE+MATERIAL Search THERMAL+INTERFACE+MATERIAL
2 THERMAL CONDUCTIVITY 332369 29% 4% 360 Search THERMAL+CONDUCTIVITY Search THERMAL+CONDUCTIVITY
3 THERMAL PASTE 265927 1% 100% 11 Search THERMAL+PASTE Search THERMAL+PASTE
4 SOFT TOOLING PROCESS 120876 0% 100% 5 Search SOFT+TOOLING+PROCESS Search SOFT+TOOLING+PROCESS
5 FLASH RADIOMETRY 72526 0% 100% 3 Search FLASH+RADIOMETRY Search FLASH+RADIOMETRY
6 METAL FILLED POLYMERS 72526 0% 100% 3 Search METAL+FILLED+POLYMERS Search METAL+FILLED+POLYMERS
7 THERMAL CONDUCTIVE COMPOSITES 72526 0% 100% 3 Search THERMAL+CONDUCTIVE+COMPOSITES Search THERMAL+CONDUCTIVE+COMPOSITES
8 THERMAL PROPERTIES 72374 13% 2% 168 Search THERMAL+PROPERTIES Search THERMAL+PROPERTIES
9 HYBRID FILLER 56237 1% 21% 11 Search HYBRID+FILLER Search HYBRID+FILLER
10 POLYMER MATRIX COMPOSITES PMCS 55693 6% 3% 81 Search POLYMER+MATRIX+COMPOSITES+PMCS Search POLYMER+MATRIX+COMPOSITES+PMCS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 CHEN, HY , GINZBURG, VV , YANG, J , YANG, YF , LIU, W , HUANG, Y , DU, LB , CHEN, B , (2016) THERMAL CONDUCTIVITY OF POLYMER-BASED COMPOSITES: FUNDAMENTALS AND APPLICATIONS.PROGRESS IN POLYMER SCIENCE. VOL. 59. ISSUE . P. 41 -85 114 43% 6
2 GU, JW , MENG, XD , TANG, YS , LI, Y , ZHUANG, Q , KONG, J , (2017) HEXAGONAL BORON NITRIDE/POLYMETHYL-VINYL SILOXANE RUBBER DIELECTRIC THERMALLY CONDUCTIVE COMPOSITES WITH IDEAL THERMAL STABILITIES.COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING. VOL. 92. ISSUE . P. 27 -32 41 75% 2
3 BURGER, N , LAACHACHI, A , FERRIOL, M , LUTZ, M , TONIAZZO, V , RUCH, D , (2016) REVIEW OF THERMAL CONDUCTIVITY IN COMPOSITES: MECHANISMS, PARAMETERS AND THEORY.PROGRESS IN POLYMER SCIENCE. VOL. 61. ISSUE . P. 1 -28 69 40% 2
4 VADIVELU, MA , KUMAR, CR , JOSHI, GM , (2016) POLYMER COMPOSITES FOR THERMAL MANAGEMENT: A REVIEW.COMPOSITE INTERFACES. VOL. 23. ISSUE 9. P. 847 -872 52 59% 0
5 HUSSAIN, ARJ , ALAHYARI, AA , EASTMAN, SA , THIBAUD-ERKEY, C , JOHNSTON, S , SOBKOWICZ, MJ , (2017) REVIEW OF POLYMERS FOR HEAT EXCHANGER APPLICATIONS: FACTORS CONCERNING THERMAL CONDUCTIVITY.APPLIED THERMAL ENGINEERING. VOL. 113. ISSUE . P. 1118 -1127 44 65% 0
6 RAMDANI, N , DERRADJI, M , WANG, J , MOKHNACHE, E , LIU, WB , LIU, YG , DONG, W , (2016) EXPERIMENTAL AND MODELING OF THERMAL AND DIELECTRIC PROPERTIES OF ALUMINUM NITRIDE-REINFORCED POLYBENZOXAZINE HYBRIDS.JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY. VOL. 126. ISSUE 2. P. 561 -570 35 78% 0
7 GU, JW , LIANG, CB , ZHAO, XM , GAN, B , QIU, H , GUO, YQ , YANG, XT , ZHANG, QY , WANG, DY , (2017) HIGHLY THERMALLY CONDUCTIVE FLAME-RETARDANT EPOXY NANOCOMPOSITES WITH REDUCED IGNITABILITY AND EXCELLENT ELECTRICAL CONDUCTIVITIES.COMPOSITES SCIENCE AND TECHNOLOGY. VOL. 139. ISSUE . P. 83 -89 29 56% 1
8 RAJESHWARI, P , DEY, TK , (2016) FINITE ELEMENT MODELLING AND EXPERIMENTAL INVESTIGATION ON EFFECTIVE THERMAL CONDUCTIVITY OF ALN (NANO) PARTICLES REINFORCED HDPE POLYMER NANOCOMPOSITES.THERMOCHIMICA ACTA. VOL. 638. ISSUE . P. 103 -112 39 67% 0
9 TANG, DH , SU, JQ , KONG, MQ , ZHAO, ZG , YANG, Q , HUANG, YJ , LIAO, X , NIU, YH , (2016) PREPARATION AND PROPERTIES OF EPOXY/BN HIGHLY THERMAL CONDUCTIVE COMPOSITES REINFORCED WITH SIC WHISKER.POLYMER COMPOSITES. VOL. 37. ISSUE 9. P. 2611 -2621 33 70% 1
10 DONNAY, M , TZAVALAS, S , LOGAKIS, E , (2015) BORON NITRIDE FILLED EPOXY WITH IMPROVED THERMAL CONDUCTIVITY AND DIELECTRIC BREAKDOWN STRENGTH.COMPOSITES SCIENCE AND TECHNOLOGY. VOL. 110. ISSUE . P. 152 -158 21 84% 23

Classes with closest relation at Level 1


Rank Class id link
1 19640 EXPANDED GRAPHITE//GRAPHITE NANOSHEETS//GRAPHITE NANOPLATELET
2 6278 HOLLAND COMP//THERMAL CONDUCTIVITY//THERMAL INTERFACE MATERIAL
3 17664 THIN INTERPHASES//NEUTRAL INCLUSIONS//IMPERFECT INTERFACE
4 2396 CONDUCTIVE POLYMER COMPOSITES//CARBON BLACK//PTC EFFECT
5 4682 EMBEDDED CAPACITOR//MINIST EDUC NANOMAT//DIELECTRIC PROPERTIES
6 16768 THERMAL CONTACT CONDUCTANCE//THERMAL CONTACT RESISTANCE//MOVING HEAT SOURCES
7 37119 2K X 2K//CHINA SCI TECHNOL INFRARED DETECTO//DEBYE CHARACTERISTIC TEMPERATURE
8 576 CARBON NANOTUBES//NANOCOMPOSITES//MULTI WALLED CARBON NANOTUBES
9 13602 THERMAL DIFFUSIVITY//GUARDED HOT PLATE//TRANSIENT HOT WIRE
10 16192 COPPER DIAMOND COMPOSITES//CU DIAMOND COMPOSITES//DIAMOND CU COMPOSITES

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