Class information for:
Level 1: OHMIC CONTACT//PD GE//SOLID PHASE REGROWTH

Basic class information

Class id #P Avg. number of
references
Database coverage
of references
6381 1491 17.3 55%



Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes

The table includes all classes above and classes immediately below the current class.



Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
47 3       PHYSICS, APPLIED//JOURNAL OF CRYSTAL GROWTH//PHYSICS, CONDENSED MATTER 93961
579 2             IEEE TRANSACTIONS ON ELECTRON DEVICES//SOLID-STATE ELECTRONICS//ENGINEERING, ELECTRICAL & ELECTRONIC 14235
6381 1                   OHMIC CONTACT//PD GE//SOLID PHASE REGROWTH 1491

Terms with highest relevance score



rank Term termType Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with
term in
class
1 OHMIC CONTACT authKW 234746 7% 11% 105
2 PD GE authKW 85324 0% 83% 5
3 SOLID PHASE REGROWTH authKW 81908 0% 67% 6
4 N TYPE GAAS authKW 73716 0% 60% 6
5 PD SI authKW 54606 0% 67% 4
6 AU MO TI GE PD METALLIZATION authKW 40956 0% 100% 2
7 PD BASED CONTACTS authKW 40956 0% 100% 2
8 PDGE authKW 40956 0% 100% 2
9 INXGA1 XAS authKW 23028 0% 19% 6
10 N GAAS authKW 22330 0% 18% 6

Web of Science journal categories



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with
term in
class
1 Physics, Applied 16769 67% 0% 997
2 Materials Science, Coatings & Films 4575 13% 0% 193
3 Engineering, Electrical & Electronic 3861 31% 0% 462
4 Physics, Condensed Matter 3776 27% 0% 410
5 Materials Science, Multidisciplinary 1385 24% 0% 353
6 Nanoscience & Nanotechnology 428 7% 0% 99
7 Electrochemistry 111 3% 0% 44
8 Physics, Multidisciplinary 91 5% 0% 80
9 Microscopy 61 1% 0% 12
10 Metallurgy & Metallurgical Engineering 43 3% 0% 42

Address terms



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with
term in
class
1 OURCE IL SUBMICRON STRUCT 21837 0% 27% 4
2 BRANCH SCI TECH BELMICROSYST 20478 0% 100% 1
3 CNS RPT 20478 0% 100% 1
4 CST SPS 20478 0% 100% 1
5 DEUT BUNDESPOST FOR UNGS 20478 0% 100% 1
6 E FISHKILL PROD ASSURANCE 20478 0% 100% 1
7 ELECT ENGN ELECT MAT 20478 0% 100% 1
8 ELECT ENGN MICROELE S 20478 0% 100% 1
9 HOCHSTFREQUENZTECH 20478 0% 100% 1
10 MICROELECT FEI 20478 0% 100% 1

Journals



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with
term in
class
1 SOLID-STATE ELECTRONICS 17887 6% 1% 93
2 JOURNAL OF APPLIED PHYSICS 9435 15% 0% 223
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 6644 5% 0% 74
4 JOURNAL OF ELECTRONIC MATERIALS 6535 4% 1% 56
5 INSTITUTE OF PHYSICS CONFERENCE SERIES 4377 3% 0% 46
6 APPLIED PHYSICS LETTERS 3802 10% 0% 146
7 MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY 3754 2% 1% 37
8 THIN SOLID FILMS 3075 5% 0% 75
9 SEMICONDUCTOR SCIENCE AND TECHNOLOGY 2583 2% 0% 32
10 IEEE TRANSACTIONS ON ELECTRON DEVICES 1988 3% 0% 39

Author Key Words



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with
term in
class
LCSH search Wikipedia search
1 OHMIC CONTACT 234746 7% 11% 105 Search OHMIC+CONTACT Search OHMIC+CONTACT
2 PD GE 85324 0% 83% 5 Search PD+GE Search PD+GE
3 SOLID PHASE REGROWTH 81908 0% 67% 6 Search SOLID+PHASE+REGROWTH Search SOLID+PHASE+REGROWTH
4 N TYPE GAAS 73716 0% 60% 6 Search N+TYPE+GAAS Search N+TYPE+GAAS
5 PD SI 54606 0% 67% 4 Search PD+SI Search PD+SI
6 AU MO TI GE PD METALLIZATION 40956 0% 100% 2 Search AU+MO+TI+GE+PD+METALLIZATION Search AU+MO+TI+GE+PD+METALLIZATION
7 PD BASED CONTACTS 40956 0% 100% 2 Search PD+BASED+CONTACTS Search PD+BASED+CONTACTS
8 PDGE 40956 0% 100% 2 Search PDGE Search PDGE
9 INXGA1 XAS 23028 0% 19% 6 Search INXGA1+XAS Search INXGA1+XAS
10 N GAAS 22330 0% 18% 6 Search N+GAAS Search N+GAAS

Core articles

The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.



Rank Reference # ref. in
cl.
Shr. of ref. in
cl.
Citations
1 SHEN, TC , GAO, GB , MORKOC, H , (1992) RECENT DEVELOPMENTS IN OHMIC CONTACTS FOR III-V COMPOUND SEMICONDUCTORS.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. VOL. 10. ISSUE 5. P. 2113-2132 115 84% 139
2 IVEY, DG , JIAN, P , (1995) METALLURGY OF OHMIC CONTACTS TO INP.CANADIAN METALLURGICAL QUARTERLY. VOL. 34. ISSUE 2. P. 85-113 81 91% 7
3 BLANK, TV , GOL'DBERG, YA , (2007) MECHANISMS OF CURRENT FLOW IN METAL-SEMICONDUCTOR OHMIC CONTACTS.SEMICONDUCTORS. VOL. 41. ISSUE 11. P. 1263 -1292 106 38% 71
4 KIM, TJ , HOLLOWAY, PH , (1997) OHMIC CONTACTS TO GAAS EPITAXIAL LAYERS.CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES. VOL. 22. ISSUE 3. P. 239 -273 70 76% 15
5 MURAKAMI, M , (2002) DEVELOPMENT OF REFRACTORY OHMIC CONTACT MATERIALS FOR GALLIUM ARSENIDE COMPOUND SEMICONDUCTORS.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS. VOL. 3. ISSUE 1. P. 1 -27 53 80% 38
6 BACA, AG , REN, F , ZOLPER, JC , BRIGGS, RD , PEARTON, SJ , (1997) A SURVEY OF OHMIC CONTACTS TO III-V COMPOUND SEMICONDUCTORS.THIN SOLID FILMS. VOL. 308. ISSUE . P. 599-606 46 75% 112
7 KOOP, EJ , IQBAL, MJ , LIMBACH, F , BOUTE, M , VAN WEES, BJ , REUTER, D , WIECK, AD , KOOI, BJ , VAN DER WAL, CH , (2013) ON THE ANNEALING MECHANISM OF AUGE/NI/AU OHMIC CONTACTS TO A TWO-DIMENSIONAL ELECTRON GAS IN GAAS/ALXGA1-XAS HETEROSTRUCTURES.SEMICONDUCTOR SCIENCE AND TECHNOLOGY. VOL. 28. ISSUE 2. P. - 25 96% 1
8 SANDS, T , (1988) COMPOUND SEMICONDUCTOR CONTACT METALLURGY.MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY. VOL. 1. ISSUE 3-4. P. 289-312 66 75% 3
9 BARASKAR, A , GOSSARD, AC , RODWELL, MJW , (2013) LOWER LIMITS TO METAL-SEMICONDUCTOR CONTACT RESISTANCE: THEORETICAL MODELS AND EXPERIMENTAL DATA.JOURNAL OF APPLIED PHYSICS. VOL. 114. ISSUE 15. P. - 29 66% 5
10 GOLDBERG, YA , (1994) OHMIC METAL III-V-SEMICONDUCTOR CONTACTS - FABRICATION METHODS AND PROPERTIES (REVIEW).SEMICONDUCTORS. VOL. 28. ISSUE 10. P. 935-943 39 81% 11

Classes with closest relation at Level 1



Rank Class id link
1 25730 ERBIUM ARSENIDE//ERSB//RARE EARTH GROUP V COMPOUND
2 29312 CROSS KELVIN RESISTOR CKR//CROSS BRIDGE KELVIN RESISTOR CBKR//POLYMETAL
3 21606 ATSUGI ELECT COMMUN S FUNCT DEVICE DEV//SINGLE VOLTAGE SUPPLY//CAPACITANCE NONLINEARITY
4 8713 OHMIC CONTACT//P GAN//P TYPE GAN
5 23027 ACCEPTOR DIFFUSION//CHEM PHYS LUCAS HTS S//ZINC DIFFUSION
6 2100 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY//WEBSTER//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
7 31429 METHODOLOGY OF MEASUREMENT//MATH PHYS SEMICOND//MICROWAVE SOLID STATE GRP
8 22649 W TI THIN FILMS//W 10TI ALLOY//W 10WTTI ALLOY
9 6921 MEV ION IMPLANTATION//COLD IMPLANTS//ELECTRON ANNEALING
10 22642 LEAD FREE SOLDERING ALLOYS//EDSHAMMAR POLYHEDRON//FERRIMAGNETIC CURIE TEMPERATURE

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