Class information for:
Level 1: WAFER BONDING//ANODIC BONDING//DIRECT BONDING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
5504 1615 19.4 59%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2642 2             THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA 3496
5504 1                   WAFER BONDING//ANODIC BONDING//DIRECT BONDING 1615

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 WAFER BONDING authKW 903751 10% 31% 154
2 ANODIC BONDING authKW 870623 5% 56% 82
3 DIRECT BONDING authKW 300909 2% 43% 37
4 SILICON WAFER BONDING authKW 287561 1% 89% 17
5 ROOM TEMPERATURE BONDING authKW 218752 1% 64% 18
6 SURFACE ACTIVATED BONDING authKW 201649 1% 67% 16
7 LOW TEMPERATURE BONDING authKW 175430 1% 40% 23
8 MEMS PACKAGING authKW 146667 1% 52% 15
9 HERMETICITY authKW 134422 1% 44% 16
10 EUTECTIC BONDING authKW 118322 1% 48% 13

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Physics, Applied 11499 54% 0% 871
2 Engineering, Electrical & Electronic 7610 41% 0% 658
3 Instruments & Instrumentation 7334 22% 0% 348
4 Nanoscience & Nanotechnology 6088 21% 0% 343
5 Materials Science, Multidisciplinary 3189 33% 0% 527
6 Materials Science, Coatings & Films 2299 9% 0% 145
7 Electrochemistry 897 7% 0% 111
8 Mechanics 704 8% 0% 132
9 Engineering, Mechanical 233 5% 0% 77
10 Physics, Condensed Matter 226 8% 0% 135

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 WAFER BONDING 75619 0% 67% 6
2 ADV MICROSYST INTEGRAT PACKAGING 37811 0% 100% 2
3 OPTOELECT OKI 37811 0% 100% 2
4 MODERN MFG QUAL ENGN 25206 0% 67% 2
5 ORION ELECT CO LTD 25206 0% 67% 2
6 ZENTRUM MIKROTECHNOL 25198 0% 22% 6
7 SP2M NRS 21265 0% 38% 3
8 PRECIS ENGN 19201 2% 3% 40
9 ADV ELECT COMPONENT SECT 18906 0% 100% 1
10 ADV MAT INTER E SCI 18906 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 39052 7% 2% 107
2 SENSORS AND ACTUATORS A-PHYSICAL 35128 8% 1% 136
3 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 28421 4% 2% 71
4 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 23724 4% 2% 58
5 IEEE TRANSACTIONS ON ADVANCED PACKAGING 16772 2% 3% 30
6 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 7666 1% 2% 23
7 PHILIPS JOURNAL OF RESEARCH 6828 1% 3% 11
8 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 6559 6% 0% 103
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 4050 1% 1% 17
10 SENSORS AND MATERIALS 2994 1% 1% 13

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 WAFER BONDING 903751 10% 31% 154 Search WAFER+BONDING Search WAFER+BONDING
2 ANODIC BONDING 870623 5% 56% 82 Search ANODIC+BONDING Search ANODIC+BONDING
3 DIRECT BONDING 300909 2% 43% 37 Search DIRECT+BONDING Search DIRECT+BONDING
4 SILICON WAFER BONDING 287561 1% 89% 17 Search SILICON+WAFER+BONDING Search SILICON+WAFER+BONDING
5 ROOM TEMPERATURE BONDING 218752 1% 64% 18 Search ROOM+TEMPERATURE+BONDING Search ROOM+TEMPERATURE+BONDING
6 SURFACE ACTIVATED BONDING 201649 1% 67% 16 Search SURFACE+ACTIVATED+BONDING Search SURFACE+ACTIVATED+BONDING
7 LOW TEMPERATURE BONDING 175430 1% 40% 23 Search LOW+TEMPERATURE+BONDING Search LOW+TEMPERATURE+BONDING
8 MEMS PACKAGING 146667 1% 52% 15 Search MEMS+PACKAGING Search MEMS+PACKAGING
9 HERMETICITY 134422 1% 44% 16 Search HERMETICITY Search HERMETICITY
10 EUTECTIC BONDING 118322 1% 48% 13 Search EUTECTIC+BONDING Search EUTECTIC+BONDING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 VALLIN, O , JONSSON, K , LINDBERG, U , (2005) ADHESION QUANTIFICATION METHODS FOR WAFER BONDING.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 50. ISSUE 4-5. P. 109 -165 147 79% 53
2 MASTEIKA, V , KOWAL, J , BRAITHWAITE, NS , ROGERS, T , (2014) A REVIEW OF HYDROPHILIC SILICON WAFER BONDING.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 3. ISSUE 4. P. Q42 -Q54 81 94% 17
3 PLOSSL, A , KRAUTER, G , (1999) WAFER DIRECT BONDING: TAILORING ADHESION BETWEEN BRITTLE MATERIALS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 25. ISSUE 1-2. P. 1 -88 158 63% 142
4 MIKI, N , (2005) WAFER BONDING TECHNIQUES FOR MEMS.SENSOR LETTERS. VOL. 3. ISSUE 4. P. 263-273 75 49% 13
5 KNOWLES, KM , VAN HELVOORT, ATJ , (2006) ANODIC BONDING.INTERNATIONAL MATERIALS REVIEWS. VOL. 51. ISSUE 5. P. 273 -311 66 50% 59
6 PASQUARIELLO, D , HJORT, K , (2002) PLASMA-ASSISTED INP-TO-SI LOW TEMPERATURE WAFER BONDING.IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. VOL. 8. ISSUE 1. P. 118 -131 44 66% 117
7 HE, R , FUJINO, M , YAMAUCHI, A , SUGA, T , (2015) NOVEL HYDROPHILIC SIO2 WAFER BONDING USING COMBINED SURFACE-ACTIVATED BONDING TECHNIQUE.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 54. ISSUE 3. P. - 24 100% 0
8 GOSELE, U , TONG, QY , (1998) SEMICONDUCTOR WAFER BONDING.ANNUAL REVIEW OF MATERIALS SCIENCE. VOL. 28. ISSUE . P. 215 -241 45 65% 113
9 HOWLADER, MMR , DEEN, MJ , SUGA, T , (2015) NANOBONDING: A KEY TECHNOLOGY FOR EMERGING APPLICATIONS IN HEALTH AND ENVIRONMENTAL SCIENCES.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 54. ISSUE 3. P. - 40 52% 1
10 CHRISTIANSEN, SH , SINGH, R , GOSELE, U , (2006) WAFER DIRECT BONDING: FROM ADVANCE SUBSTRATE ENGINEERING TO FUTURE APPLICATIONS IN MICRO/NANOELECTRONICS.PROCEEDINGS OF THE IEEE. VOL. 94. ISSUE 12. P. 2060 -2106 60 38% 85

Classes with closest relation at Level 1


Rank Class id link
1 25598 EPITAXIAL LIFT OFF//FILM BONDING//SURFACE ACOUSTIC WAVE SEMICONDUCTOR COUPLED DEVICE
2 8314 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION
3 27344 WET ETCHING OF GLASS//DEEP GLASS ETCHING//NI HARD MASK
4 11988 SMART CUT//ION CUT//GETTERING
5 27226 ANAL STRUCT MAT//UNITE RECH PHYS SOLIDE//PHYS MATIERE CONDENSEE NANOSCI LR ES 40 11
6 16594 FLUXLESS BONDING//AU SN//AU SN SOLDER
7 9810 PRESSURE SENSOR//PIEZORESISTANCE//CAPACITIVE PRESSURE SENSOR
8 27623 BENZOCYCLOBUTENE//INTERCONNECTION TECHNIQUE//WATER ABSORPTIONS
9 8369 THERMOELASTIC DAMPING//MEMS RESONATOR//MICROMECHANICAL RESONATORS
10 37133 SICGE//SI 6H SIC HETEROJUNCTION//SI 6H SIC

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