Class information for:
Level 1: WET ETCHING OF GLASS//DEEP GLASS ETCHING//NI HARD MASK

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
27344 232 18.0 62%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2642 2             THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA 3496
27344 1                   WET ETCHING OF GLASS//DEEP GLASS ETCHING//NI HARD MASK 232

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 WET ETCHING OF GLASS authKW 658090 2% 100% 5
2 DEEP GLASS ETCHING authKW 263236 1% 100% 2
3 NI HARD MASK authKW 263236 1% 100% 2
4 GLASS ETCHING authKW 210584 2% 40% 4
5 DEEP WET ETCHING authKW 175489 1% 67% 2
6 ADV PLASMA SUR E address 131618 0% 100% 1
7 AL2O3 MASK authKW 131618 0% 100% 1
8 ALN MASK authKW 131618 0% 100% 1
9 APTAMER IMMOBILIZED BEAD AFFINITY CHROMATOGRAPHY authKW 131618 0% 100% 1
10 AUTOMAT MECAN INFORMAT IND HUMA address 131618 0% 100% 1

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Nanoscience & Nanotechnology 3421 41% 0% 95
2 Instruments & Instrumentation 2311 31% 0% 73
3 Physics, Applied 1510 52% 0% 120
4 Engineering, Electrical & Electronic 1343 45% 0% 104
5 Materials Science, Multidisciplinary 694 39% 0% 91
6 Mechanics 559 18% 0% 41
7 Materials Science, Ceramics 411 9% 0% 20
8 Materials Science, Coatings & Films 371 9% 0% 22
9 Optics 62 8% 0% 19
10 Engineering, Mechanical 33 5% 0% 11

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV PLASMA SUR E 131618 0% 100% 1
2 AUTOMAT MECAN INFORMAT IND HUMA 131618 0% 100% 1
3 FAK MA INENBAU HGEBIET GLAS KERAMIKTECHNOL 131618 0% 100% 1
4 FLOW IPT 131618 0% 100% 1
5 FT TECHNOL DEV 131618 0% 100% 1
6 HGEBIET GLAS KERAM TECHNOL 131618 0% 100% 1
7 INTEGRATED OPTOELECT MICROPT GRP 131618 0% 100% 1
8 MATHIES GRP 131618 0% 100% 1
9 MEMS NEMS NANOTECHNOL 131618 0% 100% 1
10 OPT COMMUN PROD 131618 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 38119 17% 1% 40
2 GLASS SCIENCE AND TECHNOLOGY 5958 2% 1% 4
3 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 3177 4% 0% 9
4 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 3141 3% 0% 8
5 SENSORS AND ACTUATORS A-PHYSICAL 2583 6% 0% 14
6 MICROELECTRONIC ENGINEERING 1557 5% 0% 11
7 MICROMACHINES 923 1% 0% 2
8 INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS 896 1% 0% 2
9 MICROSCALE THERMOPHYSICAL ENGINEERING 653 0% 0% 1
10 GLASS SCIENCE AND TECHNOLOGY-GLASTECHNISCHE BERICHTE 546 0% 0% 1

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 WET ETCHING OF GLASS 658090 2% 100% 5 Search WET+ETCHING+OF+GLASS Search WET+ETCHING+OF+GLASS
2 DEEP GLASS ETCHING 263236 1% 100% 2 Search DEEP+GLASS+ETCHING Search DEEP+GLASS+ETCHING
3 NI HARD MASK 263236 1% 100% 2 Search NI+HARD+MASK Search NI+HARD+MASK
4 GLASS ETCHING 210584 2% 40% 4 Search GLASS+ETCHING Search GLASS+ETCHING
5 DEEP WET ETCHING 175489 1% 67% 2 Search DEEP+WET+ETCHING Search DEEP+WET+ETCHING
6 AL2O3 MASK 131618 0% 100% 1 Search AL2O3+MASK Search AL2O3+MASK
7 ALN MASK 131618 0% 100% 1 Search ALN+MASK Search ALN+MASK
8 APTAMER IMMOBILIZED BEAD AFFINITY CHROMATOGRAPHY 131618 0% 100% 1 Search APTAMER+IMMOBILIZED+BEAD+AFFINITY+CHROMATOGRAPHY Search APTAMER+IMMOBILIZED+BEAD+AFFINITY+CHROMATOGRAPHY
9 BOEM BUFFERED OXIDE ETCHANT METHOD 131618 0% 100% 1 Search BOEM+BUFFERED+OXIDE+ETCHANT+METHOD Search BOEM+BUFFERED+OXIDE+ETCHANT+METHOD
10 BURIED CHANNEL TECHNOLOGY 131618 0% 100% 1 Search BURIED+CHANNEL+TECHNOLOGY Search BURIED+CHANNEL+TECHNOLOGY

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 ZAMURUYEV, KO , ZRODNIKOV, Y , DAVIS, CE , (2017) PHOTOLITHOGRAPHY-FREE LASER-PATTERNED HF ACID-RESISTANT CHROMIUM-POLYIMIDE MASK FOR RAPID FABRICATION OF MICROFLUIDIC SYSTEMS IN GLASS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 27. ISSUE 1. P. - 16 67% 0
2 ILIESCU, C , CHEN, BT , MIAO, J , (2008) ON THE WET ETCHING OF PYREX GLASS.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 143. ISSUE 1. P. 154 -161 16 67% 37
3 LEE, HW , BIEN, DCS , BADARUDDIN, SAM , TEH, AS , (2013) SILVER (AG) AS A NOVEL MASKING MATERIAL IN GLASS ETCHING FOR MICROFLUIDICS APPLICATIONS.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. VOL. 19. ISSUE 2. P. 253-259 14 67% 4
4 LEE, HW , BIEN, DCS , BADARUDDIN, SAM , TEH, AS , (2010) THIN FILM AG MASKING FOR DEEP GLASS MICROMACHINING.ELECTROCHEMICAL AND SOLID STATE LETTERS. VOL. 13. ISSUE 11. P. H399-H402 15 65% 1
5 JIN, JY , YOO, S , BAE, JS , KIM, YK , (2014) DEEP WET ETCHING OF BOROSILICATE GLASS AND FUSED SILICA WITH DEHYDRATED AZ4330 AND A CR/AU MASK.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 24. ISSUE 1. P. - 15 52% 4
6 MAZURCZYK, R , EL KHOURY, G , DUGAS, V , HANNES, B , LAURENCEAU, E , CABRERA, M , KRAWCZYK, S , SOUTEYRAND, E , CLOAREC, JP , CHEVOLOT, Y , (2008) LOW-COST, FAST PROTOTYPING METHOD OF FABRICATION OF THE MICROREACTOR DEVICES IN SODA-LIME GLASS.SENSORS AND ACTUATORS B-CHEMICAL. VOL. 128. ISSUE 2. P. 552-559 12 63% 33
7 CEYSSENS, F , PUERS, R , (2009) DEEP ETCHING OF GLASS WAFERS USING SPUTTERED MOLYBDENUM MASKS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 19. ISSUE 6. P. - 10 77% 13
8 MALEK, CK , ROBERT, L , BOY, JJ , BLIND, P , (2007) DEEP MICROSTRUCTURING IN GLASS FOR MICROFLUIDIC APPLICATIONS.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. VOL. 13. ISSUE 5-6. P. 447 -453 13 57% 9
9 LIN, LC , JING, XM , WANG, QD , JIANG, F , CAO, LQ , YU, DQ , (2016) INVESTIGATION OF FUSED SILICA GLASS ETCHING USING C4F8/AR INDUCTIVELY COUPLED PLASMAS FOR THROUGH GLASS VIA (TGV) APPLICATIONS.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. VOL. 22. ISSUE 1. P. 119 -127 9 64% 0
10 NAGARAH, JM , WAGENAAR, DA , (2012) ULTRADEEP FUSED SILICA GLASS ETCHING WITH AN HF-RESISTANT PHOTOSENSITIVE RESIST FOR OPTICAL IMAGING APPLICATIONS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 22. ISSUE 3. P. - 13 46% 8

Classes with closest relation at Level 1


Rank Class id link
1 21663 LIBWE//LASER ETCHING//LASER INDUCED BACKSIDE WET ETCHING
2 2184 MICROCHIP ELECTROPHORESIS//MICROCHIP//MICROFLUIDIC CHIP
3 20620 GLASS PRESSING//GLASS MOLDING//TV PANEL
4 35406 NEUTRAL LOOP DISCHARGE//NLD PLASMA//MAGNETIC NEUTRAL LINE
5 1352 ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
6 5504 WAFER BONDING//ANODIC BONDING//DIRECT BONDING
7 21006 FLUIDIC INTERCONNECT//MICRONANO INNOVAT MINI//CIRCULAR MICROFLUIDICS
8 36431 FM SIGNAL PROCESSING//ANTICOLLISION PROCESSES//ART FRE CNRS
9 27888 ETCHING FACTOR//SPRAY ETCHING//42 ALLOY
10 11311 SU 8//MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS//JOURNAL OF MICROMECHANICS AND MICROENGINEERING

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