Class information for:
Level 1: THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
8314 1268 22.0 53%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
2642 2             THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA 3496
8314 1                   THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION 1268

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 THROUGH SILICON VIA TSV authKW 3002765 14% 72% 173
2 THROUGH SILICON VIA authKW 1435101 8% 58% 103
3 3 D INTEGRATION authKW 1113347 9% 40% 115
4 3D IC authKW 1096825 7% 52% 88
5 THROUGH SILICON VIAS TSVS authKW 872432 4% 72% 50
6 TSV authKW 701573 6% 41% 71
7 KEEP OUT ZONE KOZ authKW 337118 1% 100% 14
8 MICROBUMP authKW 319140 2% 49% 27
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY journal 308609 10% 10% 131
10 3 D PACKAGING authKW 294961 2% 58% 21

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Electrical & Electronic 19706 72% 0% 907
2 Computer Science, Hardware & Architecture 10885 17% 0% 211
3 Engineering, Manufacturing 6228 12% 0% 156
4 Physics, Applied 4340 38% 0% 488
5 Nanoscience & Nanotechnology 4331 20% 0% 257
6 Materials Science, Multidisciplinary 1910 29% 0% 368
7 Optics 258 7% 0% 93
8 Computer Science, Interdisciplinary Applications 230 4% 0% 54
9 Materials Science, Coatings & Films 146 3% 0% 37
10 Instruments & Instrumentation 129 4% 0% 51

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ADV DESIGN TEAM 102733 1% 53% 8
2 SILICON TEST SOLUT 100331 0% 83% 5
3 ELECT SYST INTEGRAT TECHNOL 75246 0% 63% 5
4 ASSEMBLY RELIABIL TECHNOL 54722 0% 45% 5
5 NEW DISPLAYS SYST PLICAT 54722 0% 45% 5
6 HIGH DENS INTERCONNECT GRP 54178 0% 75% 3
7 ULTRA PRECIS MECH SYST 54178 0% 75% 3
8 ICE CUBE 48160 0% 100% 2
9 MICRON 48160 0% 100% 2
10 MST EMC 48160 0% 100% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 308609 10% 10% 131
2 IEEE TRANSACTIONS ON ADVANCED PACKAGING 22829 2% 3% 31
3 IEEE DESIGN & TEST 21786 1% 8% 12
4 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 21436 4% 2% 55
5 MICROELECTRONIC ENGINEERING 15117 6% 1% 80
6 IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS 13347 4% 1% 52
7 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 12940 2% 2% 24
8 MICROELECTRONICS RELIABILITY 12035 5% 1% 59
9 ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS 7456 1% 3% 9
10 IET COMPUTERS AND DIGITAL TECHNIQUES 6708 1% 3% 11

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 THROUGH SILICON VIA TSV 3002765 14% 72% 173 Search THROUGH+SILICON+VIA+TSV Search THROUGH+SILICON+VIA+TSV
2 THROUGH SILICON VIA 1435101 8% 58% 103 Search THROUGH+SILICON+VIA Search THROUGH+SILICON+VIA
3 3 D INTEGRATION 1113347 9% 40% 115 Search 3+D+INTEGRATION Search 3+D+INTEGRATION
4 3D IC 1096825 7% 52% 88 Search 3D+IC Search 3D+IC
5 THROUGH SILICON VIAS TSVS 872432 4% 72% 50 Search THROUGH+SILICON+VIAS+TSVS Search THROUGH+SILICON+VIAS+TSVS
6 TSV 701573 6% 41% 71 Search TSV Search TSV
7 KEEP OUT ZONE KOZ 337118 1% 100% 14 Search KEEP+OUT+ZONE+KOZ Search KEEP+OUT+ZONE+KOZ
8 MICROBUMP 319140 2% 49% 27 Search MICROBUMP Search MICROBUMP
9 3 D PACKAGING 294961 2% 58% 21 Search 3+D+PACKAGING Search 3+D+PACKAGING
10 CU CU BONDING 247675 1% 86% 12 Search CU+CU+BONDING Search CU+CU+BONDING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 WANG, ZY , (2015) 3-D INTEGRATION AND THROUGH-SILICON VIAS IN MEMS AND MICROSENSORS.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 24. ISSUE 5. P. 1211 -1244 75 47% 3
2 MA, Q , WU, K , WANG, ZY , (2016) THERMAL STRESSES OF TSVS WITH SILICON POST CONDUCTORS AND POLYMER INSULATORS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 12. P. 1847 -1854 38 95% 0
3 HUANG, C , WU, D , WANG, ZY , (2016) THERMAL RELIABILITY TESTS OF AIR-GAP TSVS WITH COMBINED AIR-SIO2 LINERS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 5. P. 703 -711 37 90% 0
4 YAN, YY , XIONG, M , LIU, B , DING, YT , CHEN, ZM , (2016) LOW CAPACITANCE AND HIGHLY RELIABLE BLIND THROUGH-SILICON-VIAS (TSVS) WITH VACUUM-ASSISTED SPIN COATING OF POLYIMIDE DIELECTRIC LINERS.SCIENCE CHINA-TECHNOLOGICAL SCIENCES. VOL. 59. ISSUE 10. P. 1581 -1590 31 84% 0
5 THADESAR, PA , GU, XX , ALAPATI, R , BAKIR, MS , (2016) THROUGH-SILICON VIAS: DRIVERS, PERFORMANCE, AND INNOVATIONS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 7. P. 1009 -1019 32 74% 0
6 HUANG, C , PAN, LY , LIU, R , WANG, ZY , (2014) THERMAL AND ELECTRICAL PROPERTIES OF BCB-LINER THROUGH-SILICON VIAS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 4. ISSUE 12. P. 1936 -1946 30 81% 2
7 HUANG, C , LIU, R , WANG, ZY , (2015) THERMAL AND ELECTRICAL RELIABILITY TESTS OF AIR-GAP THROUGH-SILICON VIAS.IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. VOL. 15. ISSUE 1. P. 90 -100 29 83% 0
8 LU, QJ , ZHU, ZM , YANG, YT , DING, RX , (2015) ELECTRICAL MODELING AND CHARACTERIZATION OF SHIELD DIFFERENTIAL THROUGH-SILICON VIAS.IEEE TRANSACTIONS ON ELECTRON DEVICES. VOL. 62. ISSUE 5. P. 1544 -1552 23 85% 12
9 ZHAO, WS , ZHENG, J , CHEN, SC , WANG, X , WANG, GF , (2017) TRANSIENT ANALYSIS OF THROUGH-SILICON VIAS IN FLOATING SILICON SUBSTRATE.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 59. ISSUE 1. P. 207 -216 22 100% 0
10 HUANG, C , WU, K , WANG, ZY , (2016) LOW-CAPACITANCE THROUGH-SILICON-VIAS WITH COMBINED AIR/SIO2 LINERS.IEEE TRANSACTIONS ON ELECTRON DEVICES. VOL. 63. ISSUE 2. P. 739 -745 26 79% 1

Classes with closest relation at Level 1


Rank Class id link
1 5989 COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING
2 5504 WAFER BONDING//ANODIC BONDING//DIRECT BONDING
3 17149 SUBSTRATE NOISE//SUBSTRATE COUPLING//POWER SUPPLY NOISE
4 13293 DYNAMIC THERMAL MANAGEMENT//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT DTM
5 25993 PROBE CARD//COMPLIANT INTERCONNECTS//MEMS PROBE CARD
6 8930 UNDERFILL//FLIP CHIP//JOURNAL OF ELECTRONIC PACKAGING
7 27623 BENZOCYCLOBUTENE//INTERCONNECTION TECHNIQUE//WATER ABSORPTIONS
8 5076 BUFFER INSERTION//CLOCK SKEW//IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
9 13066 WIRE BONDING//THERMOSONIC WIRE BONDING//COPPER WIRE BONDING
10 11639 FLOORPLANNING//PLACEMENT//PHYSICAL DESIGN

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