Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
8369 | 1261 | 22.9 | 56% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
2 | 4 | MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER | 2836879 |
376 | 3 | SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS | 32422 |
308 | 2 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS//JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 18480 |
8369 | 1 | THERMOELASTIC DAMPING//MEMS RESONATOR//MICROMECHANICAL RESONATORS | 1261 |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | THERMOELASTIC DAMPING | authKW | 822392 | 3% | 77% | 44 |
2 | MEMS RESONATOR | authKW | 508748 | 3% | 51% | 41 |
3 | MICROMECHANICAL RESONATORS | authKW | 495840 | 4% | 40% | 51 |
4 | SQUEEZE FILM DAMPING | authKW | 429844 | 3% | 51% | 35 |
5 | ANCHOR LOSS | authKW | 296613 | 1% | 88% | 14 |
6 | RESONATOR | authKW | 295760 | 11% | 9% | 133 |
7 | THERMOELASTIC DISSIPATION | authKW | 220121 | 1% | 91% | 10 |
8 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | journal | 214946 | 12% | 6% | 154 |
9 | QUALITY FACTOR | authKW | 173917 | 7% | 8% | 85 |
10 | SUPPORT LOSS | authKW | 172184 | 1% | 89% | 8 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Instruments & Instrumentation | 24643 | 44% | 0% | 551 |
2 | Engineering, Electrical & Electronic | 14259 | 61% | 0% | 775 |
3 | Nanoscience & Nanotechnology | 13500 | 35% | 0% | 442 |
4 | Physics, Applied | 6588 | 47% | 0% | 589 |
5 | Mechanics | 4928 | 22% | 0% | 280 |
6 | Engineering, Mechanical | 4755 | 20% | 0% | 256 |
7 | Acoustics | 2068 | 8% | 0% | 100 |
8 | Materials Science, Multidisciplinary | 842 | 21% | 0% | 261 |
9 | Electrochemistry | 43 | 2% | 0% | 28 |
10 | Engineering, General | 24 | 2% | 0% | 20 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | CRANESSCI MEMS | 79239 | 0% | 55% | 6 |
2 | SIGNAL PROC VLSI | 60529 | 0% | 50% | 5 |
3 | SCOTTISH MICROELECT | 58285 | 1% | 14% | 17 |
4 | CRANESCI MEMS | 48427 | 0% | 100% | 2 |
5 | GMME CEMDATIC ETSIT | 48427 | 0% | 100% | 2 |
6 | MICROELECT EI | 48427 | 0% | 100% | 2 |
7 | MICROSYST PRECIS ENGN | 43042 | 0% | 44% | 4 |
8 | DYNAM MICROSYST | 32283 | 0% | 67% | 2 |
9 | ELECT DEVICE CO | 32283 | 0% | 67% | 2 |
10 | GRP NAM6 | 32283 | 0% | 67% | 2 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 214946 | 12% | 6% | 154 |
2 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 89535 | 11% | 3% | 143 |
3 | SENSORS AND ACTUATORS A-PHYSICAL | 59341 | 12% | 2% | 156 |
4 | MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 16624 | 4% | 1% | 48 |
5 | IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL | 8394 | 3% | 1% | 44 |
6 | SENSORS AND ACTUATORS | 2949 | 1% | 1% | 9 |
7 | MICROFLUIDICS AND NANOFLUIDICS | 2591 | 1% | 1% | 14 |
8 | JOURNAL OF THERMAL STRESSES | 2441 | 1% | 1% | 13 |
9 | IEEE ELECTRON DEVICE LETTERS | 2215 | 2% | 0% | 29 |
10 | JOURNAL OF SOUND AND VIBRATION | 1572 | 3% | 0% | 32 |
Author Key Words |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | THERMOELASTIC DAMPING | 822392 | 3% | 77% | 44 | Search THERMOELASTIC+DAMPING | Search THERMOELASTIC+DAMPING |
2 | MEMS RESONATOR | 508748 | 3% | 51% | 41 | Search MEMS+RESONATOR | Search MEMS+RESONATOR |
3 | MICROMECHANICAL RESONATORS | 495840 | 4% | 40% | 51 | Search MICROMECHANICAL+RESONATORS | Search MICROMECHANICAL+RESONATORS |
4 | SQUEEZE FILM DAMPING | 429844 | 3% | 51% | 35 | Search SQUEEZE+FILM+DAMPING | Search SQUEEZE+FILM+DAMPING |
5 | ANCHOR LOSS | 296613 | 1% | 88% | 14 | Search ANCHOR+LOSS | Search ANCHOR+LOSS |
6 | RESONATOR | 295760 | 11% | 9% | 133 | Search RESONATOR | Search RESONATOR |
7 | THERMOELASTIC DISSIPATION | 220121 | 1% | 91% | 10 | Search THERMOELASTIC+DISSIPATION | Search THERMOELASTIC+DISSIPATION |
8 | QUALITY FACTOR | 173917 | 7% | 8% | 85 | Search QUALITY+FACTOR | Search QUALITY+FACTOR |
9 | SUPPORT LOSS | 172184 | 1% | 89% | 8 | Search SUPPORT+LOSS | Search SUPPORT+LOSS |
10 | MICRORESONATORS | 161041 | 4% | 14% | 46 | Search MICRORESONATORS | Search MICRORESONATORS |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | ABDOLVAND, R , BAHREYNI, B , LEE, JEY , NABKI, F , (2016) MICROMACHINED RESONATORS: A REVIEW.MICROMACHINES. VOL. 7. ISSUE 9. P. - | 138 | 55% | 0 |
2 | GHAFFARI, S , NG, EJ , AHN, CH , YANG, YS , WANG, SS , HONG, VA , KENNY, TW , (2015) ACCURATE MODELING OF QUALITY FACTOR BEHAVIOR OF COMPLEX SILICON MEMS RESONATORS.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 24. ISSUE 2. P. 276 -288 | 35 | 78% | 4 |
3 | LI, P , HU, RF , (2011) A MODEL FOR SQUEEZE-FILM DAMPING OF PERFORATED MEMS DEVICES IN THE FREE MOLECULAR REGIME.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 21. ISSUE 2. P. - | 29 | 91% | 2 |
4 | TAI, YP , LI, P , FANG, YM , (2014) THERMOELASTIC DAMPING IN TORSION MICRORESONATORS WITH COUPLING EFFECT BETWEEN TORSION AND BENDING.JOURNAL OF SOUND AND VIBRATION. VOL. 333. ISSUE 5. P. 1509 -1525 | 27 | 87% | 3 |
5 | FANG, YM , LI, P , (2015) THERMOELASTIC DAMPING IN THIN MICRORINGS WITH TWO-DIMENSIONAL HEAT CONDUCTION.PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES. VOL. 69. ISSUE . P. 198 -206 | 25 | 93% | 1 |
6 | VAN BEEK, JTM , PUERS, R , (2012) A REVIEW OF MEMS OSCILLATORS FOR FREQUENCY REFERENCE AND TIMING APPLICATIONS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 22. ISSUE 1. P. - | 37 | 51% | 80 |
7 | BASU, J , BHATTACHARYYA, TK , (2011) MICROELECTROMECHANICAL RESONATORS FOR RADIO FREQUENCY COMMUNICATION APPLICATIONS.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. VOL. 17. ISSUE 10-11. P. 1557 -1580 | 30 | 77% | 19 |
8 | FANG, YM , LI, P , WANG, Z , (2013) THERMOELASTIC DAMPING IN THE AXISYMMETRIC VIBRATION OF CIRCULAR MICROPLATE RESONATORS WITH TWO-DIMENSIONAL HEAT CONDUCTION.JOURNAL OF THERMAL STRESSES. VOL. 36. ISSUE 8. P. 830-850 | 22 | 92% | 1 |
9 | HAJHASHEMI, MS , RASOULI, A , BAHREYNI, B , (2014) PERFORMANCE OPTIMIZATION OF HIGH ORDER RF MICRORESONATORS IN THE PRESENCE OF SQUEEZED FILM DAMPING.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 216. ISSUE . P. 266 -276 | 23 | 85% | 1 |
10 | LI, P , FANG, YM , XU, FF , (2014) ANALYTICAL MODELING OF SQUEEZE-FILM DAMPING FOR PERFORATED CIRCULAR MICROPLATES.JOURNAL OF SOUND AND VIBRATION. VOL. 333. ISSUE 9. P. 2688-2700 | 19 | 100% | 3 |
Classes with closest relation at Level 1 |