Class information for:
Level 1: LITHOGRAPHY SIMULATION//VUV LITHOG//RESIST REFLOW PROCESS

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
33481 124 11.2 64%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
314 3       ULTRAMICROSCOPY//MICROSCOPY//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 39933
720 2             JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B//CHEMICALLY AMPLIFIED RESIST//JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY 12751
33481 1                   LITHOGRAPHY SIMULATION//VUV LITHOG//RESIST REFLOW PROCESS 124

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 LITHOGRAPHY SIMULATION authKW 2770327 24% 38% 30
2 VUV LITHOG address 1508308 6% 88% 7
3 RESIST REFLOW PROCESS authKW 738764 2% 100% 3
4 RESIST REFLOW authKW 562864 3% 57% 4
5 LITHO CURE LITHO ETCH authKW 492509 2% 100% 2
6 LITHO FREEZE LITHO ETCH authKW 492509 2% 100% 2
7 MULTI EXPOSURES authKW 492509 2% 100% 2
8 THERMAL REFLOW PROCESS authKW 492509 2% 100% 2
9 THERMAL RESIST FLOW authKW 492509 2% 100% 2
10 CHEMICALLY AMPLIFIED RESIST authKW 475818 16% 10% 20

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Physics, Multidisciplinary 722 35% 0% 44
2 Physics, Applied 534 43% 0% 53
3 Nanoscience & Nanotechnology 184 14% 0% 17
4 Engineering, Electrical & Electronic 80 17% 0% 21
5 Engineering, Manufacturing 59 4% 0% 5
6 Automation & Control Systems 58 5% 0% 6
7 Optics 50 10% 0% 12
8 Operations Research & Management Science 9 2% 0% 3
9 Engineering, General 8 2% 0% 3
10 Computer Science, Cybernetics 7 1% 0% 1

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 VUV LITHOG 1508308 6% 88% 7
2 INFORMAT COMMUN ELECT ENGN 316598 7% 14% 9
3 LETI D2NT LLIT 246255 1% 100% 1
4 OHMI 123126 1% 50% 1
5 SEMICONDUCTOR SCI 82084 1% 33% 1
6 PROC ANAL CONTROL GRP 61562 1% 25% 1
7 SEMICOND R D 61562 1% 25% 1
8 PHOTOMASK TEAM 14484 1% 6% 1
9 DOW ELECT MAT 13679 1% 6% 1
10 SYST ANAL GRP 13307 2% 3% 2

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF THE KOREAN PHYSICAL SOCIETY 29604 35% 0% 43
2 MICROLITHOGRAPHY WORLD 18939 2% 4% 2
3 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 2877 15% 0% 19
4 JAPANESE JOURNAL OF APPLIED PHYSICS 2234 10% 0% 12
5 JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS 1011 1% 0% 1
6 MICROELECTRONIC ENGINEERING 867 5% 0% 6
7 CURRENT APPLIED PHYSICS 513 2% 0% 3
8 JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY 506 2% 0% 2
9 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 350 3% 0% 4
10 MICROELECTRONICS RELIABILITY 315 2% 0% 3

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 LITHOGRAPHY SIMULATION 2770327 24% 38% 30 Search LITHOGRAPHY+SIMULATION Search LITHOGRAPHY+SIMULATION
2 RESIST REFLOW PROCESS 738764 2% 100% 3 Search RESIST+REFLOW+PROCESS Search RESIST+REFLOW+PROCESS
3 RESIST REFLOW 562864 3% 57% 4 Search RESIST+REFLOW Search RESIST+REFLOW
4 LITHO CURE LITHO ETCH 492509 2% 100% 2 Search LITHO+CURE+LITHO+ETCH Search LITHO+CURE+LITHO+ETCH
5 LITHO FREEZE LITHO ETCH 492509 2% 100% 2 Search LITHO+FREEZE+LITHO+ETCH Search LITHO+FREEZE+LITHO+ETCH
6 MULTI EXPOSURES 492509 2% 100% 2 Search MULTI+EXPOSURES Search MULTI+EXPOSURES
7 THERMAL REFLOW PROCESS 492509 2% 100% 2 Search THERMAL+REFLOW+PROCESS Search THERMAL+REFLOW+PROCESS
8 THERMAL RESIST FLOW 492509 2% 100% 2 Search THERMAL+RESIST+FLOW Search THERMAL+RESIST+FLOW
9 CHEMICALLY AMPLIFIED RESIST 475818 16% 10% 20 Search CHEMICALLY+AMPLIFIED+RESIST Search CHEMICALLY+AMPLIFIED+RESIST
10 LITHO ETCH LITHO ETCH 328338 2% 67% 2 Search LITHO+ETCH+LITHO+ETCH Search LITHO+ETCH+LITHO+ETCH

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 KIM, SK , (2012) SENSITIVITY OF PROCESS PARAMETERS ON PATTERN FORMATION OF LITHO-CURE-LITHO-ETCH PROCESS.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 51. ISSUE 6. P. - 13 68% 1
2 KIM, SK , (2006) THERMAL EFFECT STUDY FOR A CHEMICALLY AMPLIFIED RESIST.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 49. ISSUE 3. P. 1211-1216 7 100% 1
3 OH, HK , (2002) PROCESS STUDY OF A 200 NM LASER PATTERN GENERATOR.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 41. ISSUE 6. P. 839-842 7 100% 1
4 LEE, JE , PARK, SW , AN, I , OH, HK , LEE, CH , (2005) LENS ABERRATION EFFECT ON THE LINE WIDTH FOR DIFFERENT PATTERN SHAPES AND DUTY RATIOS.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 47. ISSUE 1. P. 47-53 6 100% 31
5 KIM, SK , KIM, TS , (2006) SIMULATOR FOR THE DESIGN CONSIDERED CRITICAL DIMENSION BIAS IN RESIST REFLOW PROCESS.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 48. ISSUE 6. P. 1661-1665 6 100% 0
6 KIM, SK , (2003) EXPOSURE SIMULATION MODEL FOR CHEMICALLY AMPLIFIED RESISTS.OPTICAL REVIEW. VOL. 10. ISSUE 4. P. 335-338 6 100% 6
7 KIM, SK , (2007) ORTHOGONAL FUNCTIONAL METHOD FOR OPTICAL PROXIMITY CORRECTION OF THERMAL PROCESSES IN OPTICAL LITHOGRAPHY.JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS. VOL. 46. ISSUE 12. P. 7662-7665 5 100% 1
8 KIM, SK , (2011) EXPOSED PATTERN INTERACTION OF LITHO-CURE-LITHO-ETCH PROCESS IN COMPUTATIONAL LITHOGRAPHY.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 59. ISSUE 2. P. 425 -430 6 67% 0
9 KIM, SK , OH, HK , JUNG, YD , AN, I , (2009) IMPACT OF POLARIZATION INSIDE A RESIST FOR ARF IMMERSION LITHOGRAPHY.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 54. ISSUE 4. P. 1685-1691 5 83% 0
10 KIM, SK , OH, HK , (2007) PROCESS EXTENSION TECHNIQUES FOR OPTICAL LITHOGRAPHY: THERMAL TREATMENT, POLARIZATION AND DOUBLE PATTERNING.JOURNAL OF THE KOREAN PHYSICAL SOCIETY. VOL. 51. ISSUE 4. P. 1413-1418 5 83% 0

Classes with closest relation at Level 1


Rank Class id link
1 25108 IMMERSION LITHOGRAPHY//DOUBLE PATTERNING//JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
2 10360 OPTICAL LITHOGRAPHY//PHASE SHIFTING MASK//OPTICAL PROXIMITY CORRECTION
3 3013 CHEMICALLY AMPLIFIED RESIST//LINE EDGE ROUGHNESS//JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
4 36840 CHAIR CONTROL ROBOT COMP SCI//ASSOCIATIONIST THEORY//AUDIO INTERPRETATION
5 22144 EUV LITHOG//EXTREME ULTRAVIOLET LITHOGRAPHY//EUVL
6 29705 COLOR FILTER//BLACK MATRIX//MOLAR EXTINCTION COEFFICIENCY
7 14389 ABSORBING FILMS//ROTATING POLARIZER ANALYZER ELLIPSOMETER//ULTRATHIN DIELECTRIC LAYER
8 28214 E MAINTENANCE//E MAINTENANCE FRAMEWORK//GSIP
9 8140 SOLID STATE TECHNOLOGY//DRY DEVELOPMENT//WT ADDITIVITY
10 12204 RUN TO RUN CONTROL//VIRTUAL METROLOGY//IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

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