Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
26276 | 259 | 13.8 | 48% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
2 | 4 | MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER | 2836879 |
376 | 3 | SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS | 32422 |
308 | 2 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS//JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 18480 |
26276 | 1 | GAAS MMIC//POWER SENSOR//MICROWAVE POWER SENSOR | 259 |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | GAAS MMIC | authKW | 1364223 | 7% | 64% | 18 |
2 | POWER SENSOR | authKW | 1040731 | 6% | 55% | 16 |
3 | MICROWAVE POWER SENSOR | authKW | 943176 | 3% | 100% | 8 |
4 | MEMS MEMBRANE | authKW | 471588 | 2% | 100% | 4 |
5 | GAAS MICROMACHINING | authKW | 421058 | 2% | 71% | 5 |
6 | THERMOELECTRIC POWER SENSOR | authKW | 377269 | 2% | 80% | 4 |
7 | MEMS | address | 358326 | 21% | 6% | 55 |
8 | HETEROSTRUCTURE THERMOPILE | authKW | 353691 | 1% | 100% | 3 |
9 | RF POWER SENSOR | authKW | 353691 | 1% | 100% | 3 |
10 | GAAS MONOLITHIC MICROWAVE INTEGRATED CIRCUIT MMIC | authKW | 269475 | 2% | 57% | 4 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Instruments & Instrumentation | 3849 | 38% | 0% | 99 |
2 | Engineering, Electrical & Electronic | 3118 | 63% | 0% | 164 |
3 | Physics, Applied | 742 | 36% | 0% | 92 |
4 | Nanoscience & Nanotechnology | 579 | 17% | 0% | 43 |
5 | Materials Science, Multidisciplinary | 201 | 22% | 0% | 57 |
6 | Mechanics | 151 | 9% | 0% | 24 |
7 | Crystallography | 127 | 7% | 0% | 17 |
8 | Materials Science, Characterization, Testing | 17 | 1% | 0% | 3 |
9 | Physics, Multidisciplinary | 16 | 5% | 0% | 14 |
10 | Engineering, General | 14 | 2% | 0% | 6 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | MEMS | 358326 | 21% | 6% | 55 |
2 | DISPLAY NONOSYST | 117897 | 0% | 100% | 1 |
3 | JIANGSU PROV ENGN RF INTEGRAT MICROPACKAGE | 117897 | 0% | 100% | 1 |
4 | M2T MICROWAVE MICROSYST TECHNOL | 117897 | 0% | 100% | 1 |
5 | MICROELETROMECH SYST | 117897 | 0% | 100% | 1 |
6 | NOVITAS NANOELECT EXCELLANCE | 117897 | 0% | 100% | 1 |
7 | NSERC BC PACKERS CHAIR IND AUTOMAT | 117897 | 0% | 100% | 1 |
8 | COMMUNICAT ELECT COMMAND | 58947 | 0% | 50% | 1 |
9 | JSNN | 58947 | 0% | 50% | 1 |
10 | UMR 5001 | 58947 | 0% | 50% | 1 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 10307 | 8% | 0% | 22 |
2 | SENSORS AND ACTUATORS A-PHYSICAL | 8016 | 10% | 0% | 26 |
3 | IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 3387 | 6% | 0% | 16 |
4 | IEEE SENSORS JOURNAL | 2894 | 5% | 0% | 12 |
5 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 2812 | 3% | 0% | 8 |
6 | MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 1717 | 3% | 0% | 7 |
7 | IEEE INSTRUMENTATION & MEASUREMENT MAGAZINE | 1127 | 1% | 0% | 2 |
8 | SOLAR CELLS | 1107 | 1% | 0% | 3 |
9 | ELECTRONICS LETTERS | 1066 | 7% | 0% | 19 |
10 | IEEE ELECTRON DEVICE LETTERS | 631 | 3% | 0% | 7 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | YI, ZX , LIAO, XP , (2016) A HIGH DYNAMIC RANGE POWER SENSOR BASED ON GAAS MMIC PROCESS AND MEMS TECHNOLOGY.SOLID-STATE ELECTRONICS. VOL. 115. ISSUE . P. 39 -46 | 15 | 94% | 0 |
2 | ZHANG, ZQ , LIAO, XP , (2012) A THREE-CHANNEL THERMOELECTRIC RF MEMS POWER SENSOR FOR GAAS MMIC APPLICATIONS.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 182. ISSUE . P. 68 -71 | 13 | 93% | 1 |
3 | ZHANG, ZQ , GUO, Y , LI, F , GONG, YY , LIAO, XP , (2016) A SANDWICH-TYPE THERMOELECTRIC MICROWAVE POWER SENSOR FOR GAAS MMIC-COMPATIBLE APPLICATIONS.IEEE ELECTRON DEVICE LETTERS. VOL. 37. ISSUE 12. P. 1639 -1641 | 10 | 100% | 0 |
4 | YI, ZX , LIAO, XP , WU, H , (2015) ANALYSIS AND EXPERIMENT OF TEMPERATURE EFFECT ON THE THERMOELECTRIC POWER SENSOR.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 224. ISSUE . P. 99 -105 | 11 | 92% | 0 |
5 | ZHANG, ZQ , LIAO, XP , WANG, KY , (2015) A DIRECTIONAL INLINE-TYPE MILLIMETER-WAVE MEMS POWER SENSOR FOR GAAS MMIC APPLICATIONS.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 24. ISSUE 2. P. 253 -255 | 10 | 100% | 0 |
6 | ZHANG, ZQ , LIAO, XP , (2013) CHARACTERIZATION OF PACKAGED INLINE-TYPE RADIO FREQUENCY MICROELECTROMECHANICAL SYSTEMS POWER SENSORS.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 201. ISSUE . P. 294-301 | 15 | 68% | 0 |
7 | YI, ZX , LIAO, XP , WU, H , (2013) MODELING OF THE TERMINATING-TYPE POWER SENSORS FABRICATED BY GAAS MMIC PROCESS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 23. ISSUE 8. P. - | 10 | 100% | 0 |
8 | WANG, DB , BAI, WJ , ZHANG, CC , GUO, YY , CHEN, J , (2015) DEVELOPMENT RESEARCH OF THERMOCOUPLE-BASED MICROWAVE POWER SENSORS USING AC/DC SUBSTITUTION METHOD.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. VOL. 21. ISSUE 1. P. 21 -28 | 11 | 79% | 3 |
9 | ZHANG, ZQ , LIAO, XP , (2015) AN INSERTION THERMOELECTRIC RF MEMS POWER SENSOR FOR GAAS MMIC-COMPATIBLE APPLICATIONS.IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. VOL. 25. ISSUE 4. P. 265 -267 | 9 | 100% | 0 |
10 | WANG, DB , GAO, B , ZHAO, J , ZHANG, Y , GUO, YY , (2015) OPTIMIZATION OF THERMOELECTRIC MICROWAVE POWER SENSORS BASED ON THIN-MEMBRANE STRUCTURE.CHINESE JOURNAL OF ELECTRONICS. VOL. 24. ISSUE 4. P. 884 -888 | 9 | 100% | 0 |
Classes with closest relation at Level 1 |