Class information for:
Level 1: ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS COPPER

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
12450 905 20.5 50%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
330 3       ELECTROCHEMISTRY//ELECTRODEPOSITION//ELECTROCOAGULATION 38062
544 2             PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 14700
12450 1                   ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS COPPER 905

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELECTROLESS COPPER PLATING authKW 622036 5% 42% 44
2 ELECTROLESS COPPER DEPOSITION authKW 435331 2% 65% 20
3 ELECTROLESS COPPER authKW 278605 2% 52% 16
4 AUTOCATALYTIC METALLIZATION authKW 134957 0% 100% 4
5 ELECTROLESS METALLIZATION authKW 119953 1% 44% 8
6 COATING OF NON STOICHIOMETRIC COPPER SULPHIDE authKW 101218 0% 100% 3
7 COBALT SULPHIDE COATINGS authKW 101218 0% 100% 3
8 IN SITU STRAIN MONITORING authKW 101218 0% 100% 3
9 ELECTROLESS PLATING authKW 92537 6% 5% 54
10 PLATING AND SURFACE FINISHING journal 78414 6% 4% 57

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 27058 39% 0% 356
2 Electrochemistry 11939 31% 0% 279
3 Metallurgy & Metallurgical Engineering 1746 15% 0% 139
4 Materials Science, Multidisciplinary 651 21% 0% 193
5 Physics, Applied 632 19% 0% 175
6 Chemistry, Physical 188 13% 0% 114
7 Physics, Condensed Matter 154 9% 0% 81
8 Chemistry, Multidisciplinary 77 9% 0% 82
9 Nanoscience & Nanotechnology 60 4% 0% 34
10 Polymer Science 30 3% 0% 31

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROSYST TECHNOL CMST ELIS 67478 0% 100% 2
2 TFCG 49609 1% 29% 5
3 2PT PAISAGENS PATRIMONIO TERR 33739 0% 100% 1
4 ADV DISPLAY TECHNOL MAGNETOELECT 33739 0% 100% 1
5 ADV OPTOELECT SCI 33739 0% 100% 1
6 BGA MFG GRP 33739 0% 100% 1
7 BTT PTH 33739 0% 100% 1
8 BTT PTH RD 33739 0% 100% 1
9 CATALYSOS 33739 0% 100% 1
10 CHIM MATRIERE CONDENSEE BORDEAUX 33739 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 PLATING AND SURFACE FINISHING 78414 6% 4% 57
2 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 36038 4% 3% 36
3 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 22979 16% 0% 143
4 CIRCUIT WORLD 20494 1% 6% 11
5 TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA 3990 0% 4% 3
6 SURFACE & COATINGS TECHNOLOGY 3160 5% 0% 43
7 CHEMIJA 2610 1% 2% 5
8 ELECTROCHEMICAL AND SOLID STATE LETTERS 1995 2% 0% 16
9 JOURNAL OF APPLIED ELECTROCHEMISTRY 1854 2% 0% 18
10 JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY 1682 1% 0% 13

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ELECTROLESS COPPER PLATING 622036 5% 42% 44 Search ELECTROLESS+COPPER+PLATING Search ELECTROLESS+COPPER+PLATING
2 ELECTROLESS COPPER DEPOSITION 435331 2% 65% 20 Search ELECTROLESS+COPPER+DEPOSITION Search ELECTROLESS+COPPER+DEPOSITION
3 ELECTROLESS COPPER 278605 2% 52% 16 Search ELECTROLESS+COPPER Search ELECTROLESS+COPPER
4 AUTOCATALYTIC METALLIZATION 134957 0% 100% 4 Search AUTOCATALYTIC+METALLIZATION Search AUTOCATALYTIC+METALLIZATION
5 ELECTROLESS METALLIZATION 119953 1% 44% 8 Search ELECTROLESS+METALLIZATION Search ELECTROLESS+METALLIZATION
6 COATING OF NON STOICHIOMETRIC COPPER SULPHIDE 101218 0% 100% 3 Search COATING+OF+NON+STOICHIOMETRIC+COPPER+SULPHIDE Search COATING+OF+NON+STOICHIOMETRIC+COPPER+SULPHIDE
7 COBALT SULPHIDE COATINGS 101218 0% 100% 3 Search COBALT+SULPHIDE+COATINGS Search COBALT+SULPHIDE+COATINGS
8 IN SITU STRAIN MONITORING 101218 0% 100% 3 Search IN+SITU+STRAIN+MONITORING Search IN+SITU+STRAIN+MONITORING
9 ELECTROLESS PLATING 92537 6% 5% 54 Search ELECTROLESS+PLATING Search ELECTROLESS+PLATING
10 ABS RESIN MATERIAL 67478 0% 100% 2 Search ABS+RESIN+MATERIAL Search ABS+RESIN+MATERIAL

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 ZENKIEWICZ, M , MORACZEWSKI, K , RYTLEWSKI, P , (2011) AUTOCATALYTIC METALLIZATION OF POLYMERIC MATERIALS.POLIMERY. VOL. 56. ISSUE 7-8. P. 541-548 31 69% 1
2 OLIVERA, S , MURALIDHARA, HB , VENKATESH, K , GOPALAKRISHNA, K , VIVEK, CS , (2016) PLATING ON ACRYLONITRILE-BUTADIENE-STYRENE (ABS) PLASTIC: A REVIEW.JOURNAL OF MATERIALS SCIENCE. VOL. 51. ISSUE 8. P. 3657 -3674 30 47% 3
3 TAMASAUSKAITE-TAMASIUNAITE, L , NARUSKEVICIUS, L , ZIELIENE, A , SIMKUNAITE-STANYNIENE, B , VALIULIENE, G , SUDAVICIUS, A , (2011) EQCM STUDY OF INFLUENCE OF ANION NATURE ON ELECTROCHEMICAL REDUCTION OF BISMUTH SULFIDE IN NICKEL PLATING SOLUTION.MATERIALS SCIENCE-MEDZIAGOTYRA. VOL. 17. ISSUE 1. P. 27-31 18 95% 0
4 UZUNLAR, E , WILSON, Z , KOHL, PA , (2013) ELECTROLESS COPPER DEPOSITION USING SN/AG CATALYST ON EPOXY LAMINATES.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 160. ISSUE 12. P. D3237-D3246 25 56% 7
5 XIANG, SS , LI, WP , QIAN, ZY , ZHU, LQ , LIU, HC , (2016) THE EFFECT OF 2-MERCAPTOBENZOTHIAZOLE ON LASER-ASSISTED ELECTROLESS COPPER PLATING.RSC ADVANCES. VOL. 6. ISSUE 45. P. 38647 -38652 15 88% 0
6 PAULIUKAITE, R , STALNIONIS, G , JUSYS, Z , VASKELIS, A , (2006) EFFECT OF CU(II) LIGANDS ON ELECTROLESS COPPER DEPOSITION RATE IN FORMALDEHYDE SOLUTIONS: AN EQCM STUDY.JOURNAL OF APPLIED ELECTROCHEMISTRY. VOL. 36. ISSUE 11. P. 1261-1269 18 90% 14
7 LEE, CL , SYU, CC , (2011) AG NANOPARTICLE AS A NEW ACTIVATOR FOR CATALYZING ELECTROLESS COPPER BATH WITH 2,2 '-BIPYRIDYL.ELECTROCHIMICA ACTA. VOL. 56. ISSUE 24. P. 8880-8883 17 81% 5
8 YANG, HL , TSAI, YL , LEE, CL , (2012) EFFECT OF SINGLE CRYSTAL AG ELECTRODE STRUCTURE ON ELECTROLESS COPPER DEPOSITION ACTIVATION.ECS ELECTROCHEMISTRY LETTERS. VOL. 1. ISSUE 1. P. D1-D3 16 80% 1
9 CACHO, LM , BUENO, JJP , VONG, YM , STREMSDOERFER, G , BELTRAN, FJE , VEGA, JM , (2015) NOVEL GREEN PROCESS TO MODIFY ABS SURFACE BEFORE ITS METALLIZATION: OPTOPHYSIC TREATMENT.JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH. VOL. 12. ISSUE 2. P. 313 -323 15 75% 1
10 TAMASAUSKAITE-TAMASIUNAITE, L , ZIELIENE, A , NARUSKEVICIUS, L , SIMKUNAITE-STANYNIENE, B , (2011) EQCN STUDY OF ELECTROCHEMICAL MODIFICATION OF BISMUTH SULPHIDE FILMS IN CO2+ CONTAINING ELECTROLYTE.TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING. VOL. 89. ISSUE 5. P. 255-260 14 82% 0

Classes with closest relation at Level 1


Rank Class id link
1 18399 LASER MICRO CLADDING//LASER INDUCED CHEMICAL LIQUID PHASE DEPOSITION//LCLD
2 2145 ELECTROLESS PLATING//ELECTROLESS//ELECTROLESS NICKEL
3 5989 COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING
4 9272 POLYIMIDE//LEHRSTUHL MAT VERBUNDE//PMDA ODA
5 13408 NI W ALLOY//INDUCED CODEPOSITION//SECT AMORPHOUS SYST
6 31580 NANOELECTRODE ENSEMBLES//BRUSH NANOELECTRODE ENSEMBLES//COORDINATED BIOSENSOR
7 26984 AGGLOMERATION SUPPRESSION//NSF LOW POWER ELECT//SILVER METALLIZATION
8 11277 PERFLUORINATED CARBOXYLATES//ZENTRUM MIKROTECHNOL//COPPER FILMS
9 10866 PHOTOGRAFTING//PHOTOGRAFTING POLYMERIZATION//ADV PACKAGING DEV SUPPORT
10 28859 CENOSPHERES//BARREL SPUTTERING SYSTEM//FLY ASH CENOSPHERES

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