Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 36044 | 87 | 15.4 | 21% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | ECONOMICS//EDUCATION & EDUCATIONAL RESEARCH//PSYCHOL | 3876184 |
| 310 | 3 | INFORMATION SCIENCE & LIBRARY SCIENCE//INFORMATION & MANAGEMENT//GOVERNMENT INFORMATION QUARTERLY | 40167 |
| 3788 | 2 | END USER SYSTEMS//HOME INFORMATION SERVICES//WORD PROCESSING & INFORMATION SYSTEMS | 970 |
| 36044 | 1 | ACID DECAPSULATION//ACOUSTIC BALL BOND INSPECTION//ACOUSTIC GHZ MICROSCOPY | 87 |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | ACID DECAPSULATION | authKW | 350985 | 1% | 100% | 1 |
| 2 | ACOUSTIC BALL BOND INSPECTION | authKW | 350985 | 1% | 100% | 1 |
| 3 | ACOUSTIC GHZ MICROSCOPY | authKW | 350985 | 1% | 100% | 1 |
| 4 | CONFIDENCE INTERVAL NOMOGRAMS | authKW | 350985 | 1% | 100% | 1 |
| 5 | CU TO CU BOND | authKW | 350985 | 1% | 100% | 1 |
| 6 | DECAPSULATION METHOD | authKW | 350985 | 1% | 100% | 1 |
| 7 | EPOXY MOLDING COMPOUNDS EMCS | authKW | 350985 | 1% | 100% | 1 |
| 8 | HIGH FREQUENCY SAM | authKW | 350985 | 1% | 100% | 1 |
| 9 | HIGH RESOLUTION SAM | authKW | 350985 | 1% | 100% | 1 |
| 10 | JOINT NORMALITY | authKW | 350985 | 1% | 100% | 1 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Engineering, Industrial | 2027 | 26% | 0% | 23 |
| 2 | Engineering, General | 1333 | 30% | 0% | 26 |
| 3 | Engineering, Electrical & Electronic | 190 | 29% | 0% | 25 |
| 4 | Operations Research & Management Science | 169 | 10% | 0% | 9 |
| 5 | Statistics & Probability | 144 | 10% | 0% | 9 |
| 6 | COMPUTER APPLICATIONS & CYBERNETICS | 132 | 1% | 0% | 1 |
| 7 | Engineering, Manufacturing | 88 | 6% | 0% | 5 |
| 8 | Nanoscience & Nanotechnology | 88 | 11% | 0% | 10 |
| 9 | Physics, Applied | 20 | 13% | 0% | 11 |
| 10 | Engineering, Aerospace | 16 | 2% | 0% | 2 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | SUPPLIER QUAL ASSURANCE AE SQA1 | 350985 | 1% | 100% | 1 |
| 2 | INGENIOUS MICROMFG SYST GRP | 175491 | 1% | 50% | 1 |
| 3 | MEMSC | 175491 | 1% | 50% | 1 |
| 4 | ASSEMBLY PACKAGING | 116994 | 1% | 33% | 1 |
| 5 | ELECT ASSEMBLY INNOVAT | 116994 | 1% | 33% | 1 |
| 6 | SOLDERING MAT | 87745 | 1% | 25% | 1 |
| 7 | IMTECH | 50139 | 1% | 14% | 1 |
| 8 | QUAL RELIABIL ASSURANCE | 50139 | 1% | 14% | 1 |
| 9 | MA COM | 38997 | 1% | 11% | 1 |
| 10 | ELECT DEVICES CO | 35097 | 1% | 10% | 1 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | PROCEEDINGS ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM | 214951 | 16% | 4% | 14 |
| 2 | SOVIET ENGINEERING RESEARCH | 39263 | 5% | 3% | 4 |
| 3 | ERICSSON REVIEW | 9054 | 2% | 1% | 2 |
| 4 | SOVIET JOURNAL OF NONDESTRUCTIVE TESTING-USSR | 8716 | 2% | 1% | 2 |
| 5 | ENGINEERING CYBERNETICS | 5659 | 1% | 2% | 1 |
| 6 | RELIABILITY ENGINEERING & SYSTEM SAFETY | 5335 | 9% | 0% | 8 |
| 7 | MICROELECTRONICS RELIABILITY | 5068 | 11% | 0% | 10 |
| 8 | F&M-FEINWERKTECHNIK & MESSTECHNIK | 3732 | 1% | 1% | 1 |
| 9 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 3624 | 2% | 1% | 2 |
| 10 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 3550 | 2% | 1% | 2 |
Author Key Words |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | ACID DECAPSULATION | 350985 | 1% | 100% | 1 | Search ACID+DECAPSULATION | Search ACID+DECAPSULATION |
| 2 | ACOUSTIC BALL BOND INSPECTION | 350985 | 1% | 100% | 1 | Search ACOUSTIC+BALL+BOND+INSPECTION | Search ACOUSTIC+BALL+BOND+INSPECTION |
| 3 | ACOUSTIC GHZ MICROSCOPY | 350985 | 1% | 100% | 1 | Search ACOUSTIC+GHZ+MICROSCOPY | Search ACOUSTIC+GHZ+MICROSCOPY |
| 4 | CONFIDENCE INTERVAL NOMOGRAMS | 350985 | 1% | 100% | 1 | Search CONFIDENCE+INTERVAL+NOMOGRAMS | Search CONFIDENCE+INTERVAL+NOMOGRAMS |
| 5 | CU TO CU BOND | 350985 | 1% | 100% | 1 | Search CU+TO+CU+BOND | Search CU+TO+CU+BOND |
| 6 | DECAPSULATION METHOD | 350985 | 1% | 100% | 1 | Search DECAPSULATION+METHOD | Search DECAPSULATION+METHOD |
| 7 | EPOXY MOLDING COMPOUNDS EMCS | 350985 | 1% | 100% | 1 | Search EPOXY+MOLDING+COMPOUNDS+EMCS | Search EPOXY+MOLDING+COMPOUNDS+EMCS |
| 8 | HIGH FREQUENCY SAM | 350985 | 1% | 100% | 1 | Search HIGH+FREQUENCY+SAM | Search HIGH+FREQUENCY+SAM |
| 9 | HIGH RESOLUTION SAM | 350985 | 1% | 100% | 1 | Search HIGH+RESOLUTION+SAM | Search HIGH+RESOLUTION+SAM |
| 10 | JOINT NORMALITY | 350985 | 1% | 100% | 1 | Search JOINT+NORMALITY | Search JOINT+NORMALITY |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | DHILLON, BS , (1992) RELIABILITY TESTING - BIBLIOGRAPHY.MICROELECTRONICS RELIABILITY. VOL. 32. ISSUE 8. P. 1115 -1135 | 45 | 68% | 3 |
| 2 | JANECZEK, K , ARAZNA, A , FUTERA, K , KOZIOL, G , (2016) FAILURE ANALYSIS OF EPOXY MOLDED IC PACKAGES.MICROELECTRONICS INTERNATIONAL. VOL. 33. ISSUE 2. P. 94 -101 | 6 | 100% | 0 |
| 3 | MUDHOLKAR, GS , WILDING, GE , (2005) TWO WILSON-HILFERTY TYPE APPROXIMATIONS FOR THE NULL DISTRIBUTION OF THE BLUM, KIEFER AND ROSENBLATT TEST OF BIVARIATE INDEPENDENCE.JOURNAL OF STATISTICAL PLANNING AND INFERENCE. VOL. 128. ISSUE 1. P. 31-41 | 4 | 80% | 0 |
| 4 | OBERHOFF, S , GOETZ, K , TROJAN, K , ZOELLER, M , GLUECK, J , (2016) APPLICATION OF HIGH FREQUENCY SCANNING ACOUSTIC MICROSCOPY FOR THE FAILURE ANALYSIS AND RELIABILITY ASSESSMENT OF MEMS SENSORS.MICROELECTRONICS RELIABILITY. VOL. 64. ISSUE . P. 656 -659 | 3 | 75% | 0 |
| 5 | ENDOH, H , NAOE, T , (2015) COPPER WIRE BONDING PACKAGE DECAPSULATION USING THE ANODIC PROTECTION METHOD.MICROELECTRONICS RELIABILITY. VOL. 55. ISSUE 1. P. 207 -212 | 2 | 100% | 1 |
| 6 | VAN DER MEULEN, EC , TRIVEDI, MC , MUDHOLKAR, GS , (1998) A GAMMA ANALOGUE OF THE WILSON-HILFERTY TRANSFORMATION.COMMUNICATIONS IN STATISTICS-SIMULATION AND COMPUTATION. VOL. 27. ISSUE 1. P. 21-37 | 3 | 75% | 0 |
| 7 | TOMIOKA, T , OKUMURA, Y , MASUI, H , TAKAMIYA, K , CHO, MG , (2016) SCREENING OF NANOSATELLITE MICROPROCESSORS USING CALIFORNIUM SINGLE-EVENT LATCH-UP TEST RESULTS.ACTA ASTRONAUTICA. VOL. 126. ISSUE . P. 334 -341 | 3 | 33% | 0 |
| 8 | NAM, JS , KIM, HE , KIM, KU , (2013) A NEW ACCELERATED ZERO-FAILURE TEST MODEL FOR ROLLING BEARINGS UNDER ELEVATED TEMPERATURE CONDITIONS.JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY. VOL. 27. ISSUE 6. P. 1801-1807 | 1 | 100% | 1 |
| 9 | PAN, A , HANSON, EG , LEE, MH , (2010) SOLDER JET PRINTHEAD FOR DEPOSITION OF MOLTEN METAL DROPS.JOURNAL OF IMAGING SCIENCE AND TECHNOLOGY. VOL. 54. ISSUE 1. P. - | 1 | 100% | 0 |
| 10 | AUBERT, A , DE MORAIS, LD , REBRASSE, JP , (2008) LASER DECAPSULATION OF PLASTIC PACKAGES FOR FAILURE ANALYSIS: PROCESS CONTROL AND ARTEFACT INVESTIGATIONS.MICROELECTRONICS RELIABILITY. VOL. 48. ISSUE 8-9. P. 1144 -1148 | 1 | 100% | 4 |
Classes with closest relation at Level 1 |