Class information for:
Level 1: DYNAMIC THERMAL MANAGEMENT//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT DTM

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
13293 848 21.6 38%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
178 3       GAN//PHYSICS, APPLIED//GALLIUM NITRIDE 57874
3252 2             JUNCTION TEMPERATURE//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT 1976
13293 1                   DYNAMIC THERMAL MANAGEMENT//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT DTM 848

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 DYNAMIC THERMAL MANAGEMENT authKW 610730 2% 81% 21
2 COMPACT THERMAL MODEL authKW 512218 2% 68% 21
3 DYNAMIC THERMAL MANAGEMENT DTM authKW 300057 1% 83% 10
4 THERMAL SPREADING RESISTANCE authKW 243044 1% 75% 9
5 ELE ON DEVICES address 170448 3% 19% 25
6 MICROELECT COMP SCI address 163670 2% 22% 21
7 THERMAL PLACEMENT authKW 150028 1% 83% 5
8 THERMAL AWARE authKW 145819 1% 45% 9
9 THERMAL TRANSIENT TESTING authKW 128594 1% 71% 5
10 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES journal 128239 8% 6% 64

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Computer Science, Hardware & Architecture 15089 24% 0% 202
2 Engineering, Electrical & Electronic 11234 66% 0% 562
3 Engineering, Manufacturing 2111 9% 0% 75
4 Nanoscience & Nanotechnology 1873 17% 0% 140
5 Computer Science, Software Engineering 753 7% 0% 62
6 Engineering, Mechanical 545 9% 0% 76
7 Materials Science, Multidisciplinary 507 20% 0% 168
8 Computer Science, Interdisciplinary Applications 406 6% 0% 55
9 Physics, Applied 297 15% 0% 125
10 Thermodynamics 221 5% 0% 40

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ELE ON DEVICES 170448 3% 19% 25
2 MICROELECT COMP SCI 163670 2% 22% 21
3 MNT DEE 72014 0% 100% 2
4 DRTS 64811 0% 60% 3
5 MINIST EDUC CHINA DESIGN ELE OMAG 48008 0% 67% 2
6 PHYS ELE OTECHNOL 44303 1% 15% 8
7 DACYA 39130 1% 22% 5
8 ADV ELECT PACKAGING 36007 0% 100% 1
9 ADV OPT MAT 36007 0% 100% 1
10 ADV RELIBIL METHODS 36007 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 128239 8% 6% 64
2 MICROELECTRONICS JOURNAL 55677 9% 2% 77
3 JOURNAL OF ELECTRONIC PACKAGING 46685 5% 3% 40
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 44875 3% 6% 22
5 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 15303 4% 1% 38
6 IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS 14973 5% 1% 45
7 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 14191 3% 2% 23
8 MICROELECTRONICS RELIABILITY 13476 6% 1% 51
9 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 10055 2% 1% 19
10 SUSTAINABLE COMPUTING-INFORMATICS & SYSTEMS 9450 1% 4% 6

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 DYNAMIC THERMAL MANAGEMENT 610730 2% 81% 21 Search DYNAMIC+THERMAL+MANAGEMENT Search DYNAMIC+THERMAL+MANAGEMENT
2 COMPACT THERMAL MODEL 512218 2% 68% 21 Search COMPACT+THERMAL+MODEL Search COMPACT+THERMAL+MODEL
3 DYNAMIC THERMAL MANAGEMENT DTM 300057 1% 83% 10 Search DYNAMIC+THERMAL+MANAGEMENT+DTM Search DYNAMIC+THERMAL+MANAGEMENT+DTM
4 THERMAL SPREADING RESISTANCE 243044 1% 75% 9 Search THERMAL+SPREADING+RESISTANCE Search THERMAL+SPREADING+RESISTANCE
5 THERMAL PLACEMENT 150028 1% 83% 5 Search THERMAL+PLACEMENT Search THERMAL+PLACEMENT
6 THERMAL AWARE 145819 1% 45% 9 Search THERMAL+AWARE Search THERMAL+AWARE
7 THERMAL TRANSIENT TESTING 128594 1% 71% 5 Search THERMAL+TRANSIENT+TESTING Search THERMAL+TRANSIENT+TESTING
8 THERMAL IMPEDANCE 113775 2% 20% 16 Search THERMAL+IMPEDANCE Search THERMAL+IMPEDANCE
9 LEAKAGE TEMPERATURE DEPENDENCY 108022 0% 100% 3 Search LEAKAGE+TEMPERATURE+DEPENDENCY Search LEAKAGE+TEMPERATURE+DEPENDENCY
10 LOGI THERMAL SIMULATION 108022 0% 100% 3 Search LOGI+THERMAL+SIMULATION Search LOGI+THERMAL+SIMULATION

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 RAZAVI, M , MUZYCHKA, YS , KOCABIYIK, S , (2016) REVIEW OF ADVANCES IN THERMAL SPREADING RESISTANCE PROBLEMS.JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER. VOL. 30. ISSUE 4. P. 863 -879 22 71% 0
2 CODECASA, L , D'ALESSANDRO, V , MAGNANI, A , RINALDI, N , (2015) STRUCTURE-PRESERVING APPROACH TO MULTI-PORT DYNAMIC COMPACT MODELS OF NONLINEAR HEAT CONDUCTION.MICROELECTRONICS JOURNAL. VOL. 46. ISSUE 12. P. 1129 -1137 14 100% 1
3 BENEVENTI, F , BARTOLINI, A , TILLI, A , BENINI, L , (2014) AN EFFECTIVE GRAY-BOX IDENTIFICATION PROCEDURE FOR MULTICORE THERMAL MODELING.IEEE TRANSACTIONS ON COMPUTERS. VOL. 63. ISSUE 5. P. 1097 -1110 16 84% 3
4 JANICKI, M , BANASZCZYK, J , VERMEERSCH, B , DE MEY, G , NAPIERALSKI, A , (2011) GENERATION OF REDUCED DYNAMIC THERMAL MODELS OF ELECTRONIC SYSTEMS FROM TIME CONSTANT SPECTRA OF TRANSIENT TEMPERATURE RESPONSES.MICROELECTRONICS RELIABILITY. VOL. 51. ISSUE 8. P. 1351 -1355 14 100% 6
5 CODECASA, L , (2014) COMPACT ELECTRO-THERMAL MODELS OF INTERCONNECTS.MICROELECTRONICS JOURNAL. VOL. 45. ISSUE 12. P. 1777 -1785 16 80% 0
6 GERSTENMAIER, YC , KIFFE, W , WACHUTKA, G , (2009) COMBINATION OF THERMAL SUBSYSTEMS BY USE OF RAPID CIRCUIT TRANSFORMATION AND EXTENDED TWO-PORT THEORY.MICROELECTRONICS JOURNAL. VOL. 40. ISSUE 1. P. 26-34 14 100% 5
7 CODECASA, L , (2014) NONLINEAR DYNAMIC COMPACT THERMAL MODELS BY STRUCTURE-PRESERVING PROJECTION.MICROELECTRONICS JOURNAL. VOL. 45. ISSUE 12. P. 1764 -1769 13 93% 1
8 GERSTENMAIER, YC , CASTELLAZZI, A , WACHUTKA, GKM , (2006) ELECTROTHERMAL SIMULATION OF MULTICHIP-MODULES WITH NOVEL TRANSIENT THERMAL MODEL AND TIME-DEPENDENT BOUNDARY CONDITIONS.IEEE TRANSACTIONS ON POWER ELECTRONICS. VOL. 21. ISSUE 1. P. 45 -55 13 100% 32
9 LASANCE, CJM , (2008) TEN YEARS OF BOUNDARY-CONDITION-INDEPENDENT COMPACT THERMAL MODELING OF ELECTRONIC PARTS: A REVIEW.HEAT TRANSFER ENGINEERING. VOL. 29. ISSUE 2. P. 149 -168 14 78% 39
10 LEE, J , (2003) THERMAL PLACEMENT ALGORITHM BASED ON HEAT CONDUCTION ANALOGY.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. VOL. 26. ISSUE 2. P. 473-482 13 100% 26

Classes with closest relation at Level 1


Rank Class id link
1 9708 JUNCTION TEMPERATURE//REMOTE PHOSPHOR//HIGH POWER LED
2 12333 DISCRETE HEAT SOURCES//VERTICAL CHANNEL//DIPARTIMENTO ENERGET TERMOFLUIDODINAM PLICATA
3 21167 GAN ON DIAMOND//DEVICE THERMOG RELIABIL//CHANNEL TEMPERATURE
4 5040 IGBT//INSULATED GATE BIPOLAR TRANSISTOR IGBT//INSULATED GATE BIPOLAR TRANSISTORS
5 8314 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3 D INTEGRATION
6 20353 DYNAMIC POWER MANAGEMENT//PORTABLE MEDIA PLAYER//DISK POWER CONSUMPTION
7 3550 SRAM//PROCESS VARIATION//POWER GATING
8 31479 PASSIVE INTERMODULATION PIM//PASSIVE INTERMODULATION//PASSIVE INTERMODULATION DISTORTION PIM
9 17149 SUBSTRATE NOISE//SUBSTRATE COUPLING//POWER SUPPLY NOISE
10 37091 OPEN SOURCE OS//DEADLOCK DETECTION IN HARDWARE//API SPECIFICATION

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