Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
35757 | 92 | 16.3 | 28% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | ECONOMICS//EDUCATION & EDUCATIONAL RESEARCH//PSYCHOL | 3876184 |
677 | 3 | DNA BARCODING//SPECIES IDENTIFICATION//GMO | 9162 |
4171 | 2 | AT&T TECHNICAL JOURNAL//FUNCT TERMINAL CIRCUITS GRP//SOLDERLESS TECHNOLOGY | 515 |
35757 | 1 | SOLDERLESS TECHNOLOGY//PRESS FIT ASSEMBLY//AT&T TECHNICAL JOURNAL | 92 |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | SOLDERLESS TECHNOLOGY | authKW | 663818 | 2% | 100% | 2 |
2 | PRESS FIT ASSEMBLY | authKW | 442544 | 2% | 67% | 2 |
3 | AT&T TECHNICAL JOURNAL | journal | 428200 | 29% | 5% | 27 |
4 | APPLICATION OF AUTHORIZED ECONOMIC OPERATOR PROGRAM | authKW | 331909 | 1% | 100% | 1 |
5 | AUTHORISED ECONOMIC OPERATOR AEO | authKW | 331909 | 1% | 100% | 1 |
6 | AUTHORIZED ECONOMIC OPERATOR PROGRAM | authKW | 331909 | 1% | 100% | 1 |
7 | AUTOMATED MDF | authKW | 331909 | 1% | 100% | 1 |
8 | AUTOMOBILE ELECTRONIC CONTROL UNITS | authKW | 331909 | 1% | 100% | 1 |
9 | COMPLIANT PIN | authKW | 331909 | 1% | 100% | 1 |
10 | ELASTICPLASTIC PROPERTIES | authKW | 331909 | 1% | 100% | 1 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Computer Science, Hardware & Architecture | 2497 | 29% | 0% | 27 |
2 | Telecommunications | 1384 | 33% | 0% | 30 |
3 | Engineering, Manufacturing | 350 | 11% | 0% | 10 |
4 | Management | 215 | 11% | 0% | 10 |
5 | Engineering, Industrial | 168 | 8% | 0% | 7 |
6 | Operations Research & Management Science | 124 | 9% | 0% | 8 |
7 | Business | 72 | 5% | 0% | 5 |
8 | Polymer Science | 49 | 10% | 0% | 9 |
9 | Robotics | 48 | 2% | 0% | 2 |
10 | Engineering, Electrical & Electronic | 45 | 15% | 0% | 14 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | INTERCONNECT POWER COMP AIDED ENGN DESIGN | 331909 | 1% | 100% | 1 |
2 | ASSEMBLY PACKAGING | 110635 | 1% | 33% | 1 |
3 | TRADE LOGIST | 110635 | 1% | 33% | 1 |
4 | FG TECH PHYS POLYMERPHYS 2 | 82976 | 1% | 25% | 1 |
5 | MUSASHINO ELECT COMMUN COMMUN SWITCHING S | 18438 | 1% | 6% | 1 |
6 | LEHRSTUHL KUNSTSTOFFTECH | 13274 | 1% | 4% | 1 |
7 | ROBOT VIS | 13274 | 1% | 4% | 1 |
8 | FAK MATH NATURWISSEN | 8509 | 1% | 3% | 1 |
9 | NANOMECH | 7525 | 4% | 1% | 4 |
10 | TECH ASSISTANCE SUPPORT | 6913 | 1% | 2% | 1 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | AT&T TECHNICAL JOURNAL | 428200 | 29% | 5% | 27 |
2 | WESTERN ELECTRIC ENGINEER | 41487 | 1% | 13% | 1 |
3 | ELECTRONICSWEEK | 11852 | 1% | 4% | 1 |
4 | POST OFFICE ELECTRICAL ENGINEERS JOURNAL | 5104 | 1% | 2% | 1 |
5 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 4115 | 4% | 0% | 4 |
6 | INDUSTRIAL ENGINEER | 3727 | 1% | 1% | 1 |
7 | INDUSTRIAL ENGINEERING | 2821 | 2% | 0% | 2 |
8 | HARVARD BUSINESS REVIEW | 2177 | 4% | 0% | 4 |
9 | JOURNAL OF KOREA TRADE | 2022 | 1% | 1% | 1 |
10 | PACKAGING TECHNOLOGY AND SCIENCE | 1906 | 2% | 0% | 2 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | COHEN, MI , CAMPBELL, RL , (1988) ROBOTICS TECHNOLOGIES - A KEY ELEMENT IN ACHIEVING MANUFACTURING EXCELLENCE.AT&T TECHNICAL JOURNAL. VOL. 67. ISSUE 2. P. 2-4 | 7 | 88% | 0 |
2 | BOZA, LB , POWERS, TL , (1987) PRODUCT REALIZATION SYSTEMS.AT&T TECHNICAL JOURNAL. VOL. 66. ISSUE 5. P. 3-4 | 6 | 100% | 1 |
3 | FELLNER, T , ZUKOWSKI, E , WILDE, J , KUCK, H , RICHTER, H , SCHOBER, M , BUCKMULLER, P , (2012) MODELING OF THERMOPLASTIC MATERIALS FOR THE PROCESS-SIMULATION OF PRESS-FIT INTERCONNECTIONS ON MOULDED INTERCONNECTED DEVICES.JOURNAL OF ELECTRONIC PACKAGING. VOL. 134. ISSUE 3. P. - | 3 | 60% | 0 |
4 | WEDEL, J , LUMSDEN, K , (1995) THE INFLUENCE OF LEAD-TIME REDUCTIONS ON DECISIONS AND RULES IN THE PRODUCTION PLANNING PROCESS.INTERNATIONAL JOURNAL OF PRODUCTION ECONOMICS. VOL. 41. ISSUE 1-3. P. 399-404 | 3 | 100% | 1 |
5 | ANDERSIN, H , REINIKKA, M , WICKSTROM, LA , (1994) ENTERPRISE INTEGRATION - METRICS FOR IMPROVEMENT AND BENCHMARKING.TOWARDS WORLD CLASS MANUFACTURING 1993. VOL. 17. ISSUE . P. 227-241 | 3 | 100% | 0 |
6 | ROSENTHAL, CW , DISHMAN, JM , (1987) COMPUTER-AIDED ENGINEERING AND DESIGN FOR INTERCONNECTION TECHNOLOGY.AT&T TECHNICAL JOURNAL. VOL. 66. ISSUE 4. P. 57 -69 | 4 | 100% | 1 |
7 | KANAI, T , UMEMURA, S , INAGAKI, S , HOSOKAWA, S , (1992) HIGH-DENSITY PIN BOARD MATRIX SWITCHES FOR AUTOMATED MDF SYSTEMS.IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY. VOL. 15. ISSUE 5. P. 893 -903 | 3 | 100% | 1 |
8 | TOHMYOH, H , YAMANOBE, K , SAKA, M , UTSUNOMIYA, J , NAKAMURA, T , NAKANO, Y , (2008) ANALYSIS OF SOLDERLESS PRESS-FIT INTERCONNECTIONS DURING THE ASSEMBLY PROCESS.JOURNAL OF ELECTRONIC PACKAGING. VOL. 130. ISSUE 3. P. - | 2 | 67% | 1 |
9 | MENRAD, A , GOEDECKE, T , WAGNER, MH , (2014) DROP TEST OF PLASTIC PACKAGINGS - CORRELATION WITH MATERIAL PARAMETERS AND CHANGE OF PACKAGING BEHAVIOUR AFTER IMPACT OF STANDARD LIQUIDS.PACKAGING TECHNOLOGY AND SCIENCE. VOL. 27. ISSUE 6. P. 479 -493 | 2 | 50% | 0 |
10 | PINNEL, MR , KNAUSENBERGER, WH , (1987) INTERCONNECTION SYSTEM REQUIREMENTS AND MODELING.AT&T TECHNICAL JOURNAL. VOL. 66. ISSUE 4. P. 45-56 | 4 | 57% | 0 |
Classes with closest relation at Level 1 |