Class information for:
Level 1: POLYIMIDE//LEHRSTUHL MAT VERBUNDE//PMDA ODA

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
9272 1171 23.0 60%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
567 3       PLASMA POLYMERIZATION//PLASMA PROCESSES AND POLYMERS//RADIATION GRAFTING 16936
1149 2             RADIATION GRAFTING//SOLID STATE ENGN//PLASMA TREATMENT 9513
9272 1                   POLYIMIDE//LEHRSTUHL MAT VERBUNDE//PMDA ODA 1171

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 POLYIMIDE authKW 205392 16% 4% 182
2 LEHRSTUHL MAT VERBUNDE address 126066 2% 27% 18
3 PMDA ODA authKW 106466 1% 58% 7
4 FLEXIBLE COPPER CLAD LAMINATE FCCL authKW 104299 0% 100% 4
5 SILANE MODIFIED POLYVINYLIMIDAZOLE authKW 104299 0% 100% 4
6 PEEL STRENGTH authKW 88488 3% 11% 31
7 CU ADHESION authKW 78224 0% 100% 3
8 INKJET PRINTED AG authKW 78224 0% 100% 3
9 FLEXIBLE COPPER CLAD LAMINATE authKW 65182 0% 50% 5
10 ELECTROLESS PLATED NI authKW 58667 0% 75% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 10088 21% 0% 250
2 Materials Science, Multidisciplinary 2851 36% 0% 419
3 Physics, Applied 2614 32% 0% 372
4 Polymer Science 2348 18% 0% 207
5 Physics, Condensed Matter 841 16% 0% 185
6 Chemistry, Physical 573 17% 0% 203
7 Mechanics 514 8% 0% 96
8 Engineering, Chemical 442 9% 0% 110
9 Nanoscience & Nanotechnology 308 6% 0% 75
10 Physics, Atomic, Molecular & Chemical 94 5% 0% 57

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 LEHRSTUHL MAT VERBUNDE 126066 2% 27% 18
2 PRINTING PROC BIOINSPIRED 52149 0% 100% 2
3 ACI DEV TEAM 26075 0% 100% 1
4 ASSEMBLY TECHNOL DEV QUAL RELIABIL ENGN GRP 26075 0% 100% 1
5 BUSINESS CREAT DEV 26075 0% 100% 1
6 BUSINESS CREATING OFF 26075 0% 100% 1
7 CCMR CAS 26075 0% 100% 1
8 CHAIR MUTICOMPONENT MAT 26075 0% 100% 1
9 ELECT PRODUCT TECHNOL 26075 0% 100% 1
10 KSP RD B213 26075 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY 40342 6% 2% 72
2 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 17262 8% 1% 97
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS 9859 1% 5% 8
4 JOURNAL OF ADHESION 6817 2% 1% 23
5 PLASTICS TECHNOLOGY 2606 0% 10% 1
6 JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS 2040 0% 2% 5
7 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 2005 1% 1% 10
8 THIN SOLID FILMS 1725 4% 0% 50
9 SURFACE AND INTERFACE ANALYSIS 1688 2% 0% 21
10 ELECTRONIC MATERIALS LETTERS 1589 1% 1% 8

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 POLYIMIDE 205392 16% 4% 182 Search POLYIMIDE Search POLYIMIDE
2 PMDA ODA 106466 1% 58% 7 Search PMDA+ODA Search PMDA+ODA
3 FLEXIBLE COPPER CLAD LAMINATE FCCL 104299 0% 100% 4 Search FLEXIBLE+COPPER+CLAD+LAMINATE+FCCL Search FLEXIBLE+COPPER+CLAD+LAMINATE+FCCL
4 SILANE MODIFIED POLYVINYLIMIDAZOLE 104299 0% 100% 4 Search SILANE+MODIFIED+POLYVINYLIMIDAZOLE Search SILANE+MODIFIED+POLYVINYLIMIDAZOLE
5 PEEL STRENGTH 88488 3% 11% 31 Search PEEL+STRENGTH Search PEEL+STRENGTH
6 CU ADHESION 78224 0% 100% 3 Search CU+ADHESION Search CU+ADHESION
7 INKJET PRINTED AG 78224 0% 100% 3 Search INKJET+PRINTED+AG Search INKJET+PRINTED+AG
8 FLEXIBLE COPPER CLAD LAMINATE 65182 0% 50% 5 Search FLEXIBLE+COPPER+CLAD+LAMINATE Search FLEXIBLE+COPPER+CLAD+LAMINATE
9 ELECTROLESS PLATED NI 58667 0% 75% 3 Search ELECTROLESS+PLATED+NI Search ELECTROLESS+PLATED+NI
10 2 LAYER FCCL 52149 0% 100% 2 Search 2+LAYER+FCCL Search 2+LAYER+FCCL

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 BANG, SH , (2016) IMPROVEMENT OF NIMONB TO POLYIMIDE ADHESION BY INDUCTIVELY COUPLED NITROGEN PLASMA TREATMENT.APPLIED SURFACE SCIENCE. VOL. 360. ISSUE . P. 553 -558 29 88% 0
2 SHEN, FY , HUANG, SE , DOW, WP , (2013) SILVER METALLIZATION OF POLYIMIDE SURFACES USING ENVIRONMENTALLY FRIENDLY REDUCING AGENTS.ECS ELECTROCHEMISTRY LETTERS. VOL. 2. ISSUE 11. P. D45-D48 27 75% 3
3 LI, TL , HSU, SLC , (2010) PREPARATION AND PROPERTIES OF CONDUCTIVE POLYIMIDE NANOCOMPOSITES WITH ASSISTANCE OF A METALLO-ORGANIC COMPOUND.JOURNAL OF MATERIALS CHEMISTRY. VOL. 20. ISSUE 10. P. 1964 -1969 28 76% 7
4 KIM, H , JANG, J , (2000) CORROSION PROTECTION AND ADHESION PROMOTION FOR POLYIMIDE/COPPER SYSTEM USING SILANE-MODIFIED POLYMERIC MATERIALS.POLYMER. VOL. 41. ISSUE 17. P. 6553 -6561 27 93% 29
5 LIN, ZW , QI, SL , WU, DZ , (2012) FORMATION OF DOUBLE-SURFACE-SILVERED POLYIMIDE FILMS VIA A DIRECT ION-EXCHANGE SELF-METALLIZATION TECHNIQUE: THE CASE OF BPADA/ODA AND [AG(NH3)(2)](+).JOURNAL OF APPLIED POLYMER SCIENCE. VOL. 125. ISSUE 5. P. 3552-3559 23 79% 3
6 STRUNSKUS, T , GRUNZE, M , KOCHENDOERFER, G , WOLL, C , (1996) IDENTIFICATION OF PHYSICAL AND CHEMICAL INTERACTION MECHANISMS FOR THE METALS GOLD, SILVER, COPPER, PALLADIUM, CHROMIUM, AND POTASSIUM WITH POLYIMIDE SURFACES.LANGMUIR. VOL. 12. ISSUE 11. P. 2712-2725 33 79% 64
7 THOMPSON, DS , DAVIS, LM , THOMPSON, DW , SOUTHWARD, RE , (2009) SINGLE-STAGE SYNTHESIS AND CHARACTERIZATION OF REFLECTIVE AND CONDUCTIVE SILVER-POLYIMIDE FILMS PREPARED FROM SILVER(I) COMPLEXES WITH ODPA/4,4 '-ODA.ACS APPLIED MATERIALS & INTERFACES. VOL. 1. ISSUE 7. P. 1457-1466 24 77% 7
8 QI, SL , WU, ZP , WU, DZ , JIN, RG , (2008) CONTROLLED FORMATION OF OPTICALLY REFLECTIVE AND ELECTRICALLY CONDUCTIVE SILVERED SURFACES ON POLYIMIDE FILM VIA A DIRECT ION-EXCHANGE SELF-METALLIZATION TECHNIQUE USING SILVER AMMONIA COMPLEX CATION AS THE PRECURSOR.JOURNAL OF PHYSICAL CHEMISTRY B. VOL. 112. ISSUE 18. P. 5575-5584 27 69% 11
9 FAUPEL, F , WILLECKE, R , THRAN, A , (1998) DIFFUSION OF METALS IN POLYMERS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 22. ISSUE 1. P. 1 -55 45 47% 141
10 JANG, J , EARMME, T , (2001) INTERFACIAL STUDY OF POLYIMIDE/COPPER SYSTEM USING SILANE-MODIFIED POLYVINYLIMIDAZOLES AS ADHESION PROMOTERS.POLYMER. VOL. 42. ISSUE 7. P. 2871-2876 24 96% 13

Classes with closest relation at Level 1


Rank Class id link
1 10866 PHOTOGRAFTING//PHOTOGRAFTING POLYMERIZATION//ADV PACKAGING DEV SUPPORT
2 26748 AG INTERACTIONS WITH COOH//METAL PENETRATION THROUGH POLYMERS//METAL PENETRATION THROUGH SAMS
3 24420 DEPOSITION POLYMERIZATION//VAPOR DEPOSITION POLYMERIZATION//INTEGRATED SHADOW MASK
4 12450 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS COPPER
5 21018 C S AU FILM//HF DISSOCIATION//MOBILITY COALESCENCE
6 20444 BLISTER TEST//PEEL TEST//SHAFT LOADED BLISTER TEST
7 1218 POLYIMIDE//FLUORINATED POLYIMIDE//POLYETHER IMIDES
8 37106 MESOSCOPIC MODELLING//CHARGE INDUCED DEFECTS//ANODE WORK FUNCTION
9 21792 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY//MCM TESTING//THERMAL ENGN TECHNOL
10 16884 JOURNAL OF ADHESION//EPOXY METAL INTERPHASE//ULTRA LOW ANGLE MICROTOMY

Go to start page