Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
11170 | 1003 | 16.5 | 51% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | SIMULTANEOUS SWITCHING NOISE | authKW | 1678554 | 7% | 84% | 66 |
2 | SIMULTANEOUS SWITCHING NOISE SSN | authKW | 1510331 | 6% | 81% | 61 |
3 | SIGNAL INTEGRITY | authKW | 1153433 | 11% | 33% | 115 |
4 | POWER INTEGRITY | authKW | 1002254 | 5% | 65% | 51 |
5 | SIGNAL INTEGRITY SI | authKW | 784771 | 4% | 66% | 39 |
6 | POWER DISTRIBUTION NETWORK PDN | authKW | 622668 | 3% | 68% | 30 |
7 | DECOUPLING CAPACITOR | authKW | 593590 | 4% | 50% | 39 |
8 | POWER BUS | authKW | 517522 | 2% | 100% | 17 |
9 | POWER INTEGRITY PI | authKW | 497218 | 2% | 78% | 21 |
10 | POWER PLANE | authKW | 487080 | 2% | 100% | 16 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 20955 | 82% | 0% | 827 |
2 | Telecommunications | 10579 | 27% | 0% | 275 |
3 | Engineering, Manufacturing | 6193 | 14% | 0% | 138 |
4 | Materials Science, Multidisciplinary | 1278 | 27% | 0% | 271 |
5 | Computer Science, Hardware & Architecture | 391 | 4% | 0% | 38 |
6 | Optics | 89 | 5% | 0% | 54 |
7 | Computer Science, Information Systems | 24 | 2% | 0% | 19 |
8 | Instruments & Instrumentation | 20 | 2% | 0% | 23 |
9 | Computer Science, Interdisciplinary Applications | 14 | 2% | 0% | 17 |
10 | Physics, Applied | 2 | 4% | 0% | 45 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | TERAHERTZ INTERCONNECT PACKAGE | 238657 | 1% | 56% | 14 |
2 | ELE OMAGNET COMPATIBIL | 212343 | 3% | 23% | 30 |
3 | UAQ EMC | 150303 | 2% | 25% | 20 |
4 | THEORET ELEKTROTECH | 149419 | 2% | 27% | 18 |
5 | ELECT CAD | 125674 | 2% | 26% | 16 |
6 | GRP COMPATIBILITAT ELE OMAGNET | 97414 | 0% | 80% | 4 |
7 | MASTER PROGRAM COMMUN ENGN | 97414 | 0% | 80% | 4 |
8 | ADV ASSEMBLY | 91327 | 0% | 100% | 3 |
9 | PACKAGING CORE COMPETENCE | 91327 | 0% | 100% | 3 |
10 | ELECT COMP AIDED DESIGN | 81177 | 0% | 67% | 4 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 485443 | 13% | 13% | 127 |
2 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 369586 | 19% | 6% | 194 |
3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 231909 | 10% | 8% | 101 |
4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 57894 | 3% | 7% | 27 |
5 | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 20814 | 5% | 1% | 51 |
6 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 18559 | 9% | 1% | 88 |
7 | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 3942 | 4% | 0% | 44 |
8 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1497 | 1% | 1% | 8 |
9 | APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY JOURNAL | 1408 | 1% | 1% | 8 |
10 | IEICE TRANSACTIONS ON ELECTRONICS | 1273 | 2% | 0% | 16 |
Author Key Words |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | SIMULTANEOUS SWITCHING NOISE | 1678554 | 7% | 84% | 66 | Search SIMULTANEOUS+SWITCHING+NOISE | Search SIMULTANEOUS+SWITCHING+NOISE |
2 | SIMULTANEOUS SWITCHING NOISE SSN | 1510331 | 6% | 81% | 61 | Search SIMULTANEOUS+SWITCHING+NOISE+SSN | Search SIMULTANEOUS+SWITCHING+NOISE+SSN |
3 | SIGNAL INTEGRITY | 1153433 | 11% | 33% | 115 | Search SIGNAL+INTEGRITY | Search SIGNAL+INTEGRITY |
4 | POWER INTEGRITY | 1002254 | 5% | 65% | 51 | Search POWER+INTEGRITY | Search POWER+INTEGRITY |
5 | SIGNAL INTEGRITY SI | 784771 | 4% | 66% | 39 | Search SIGNAL+INTEGRITY+SI | Search SIGNAL+INTEGRITY+SI |
6 | POWER DISTRIBUTION NETWORK PDN | 622668 | 3% | 68% | 30 | Search POWER+DISTRIBUTION+NETWORK+PDN | Search POWER+DISTRIBUTION+NETWORK+PDN |
7 | DECOUPLING CAPACITOR | 593590 | 4% | 50% | 39 | Search DECOUPLING+CAPACITOR | Search DECOUPLING+CAPACITOR |
8 | POWER BUS | 517522 | 2% | 100% | 17 | Search POWER+BUS | Search POWER+BUS |
9 | POWER INTEGRITY PI | 497218 | 2% | 78% | 21 | Search POWER+INTEGRITY+PI | Search POWER+INTEGRITY+PI |
10 | POWER PLANE | 487080 | 2% | 100% | 16 | Search POWER+PLANE | Search POWER+PLANE |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | WU, TL , CHUANG, HH , WANG, TK , (2010) OVERVIEW OF POWER INTEGRITY SOLUTIONS ON PACKAGE AND PCB: DECOUPLING AND EBG ISOLATION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 52. ISSUE 2. P. 346 -356 | 45 | 92% | 73 |
2 | WU, TL , BUESINK, F , CANAVERO, F , (2013) OVERVIEW OF SIGNAL INTEGRITY AND EMC DESIGN TECHNOLOGIES ON PCB: FUNDAMENTALS AND LATEST PROGRESS.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 55. ISSUE 4. P. 624 -638 | 49 | 61% | 22 |
3 | WANG, CD , WU, TL , (2013) MODEL AND MECHANISM OF MINIATURIZED AND STOPBAND-ENHANCED INTERLEAVED EBG STRUCTURE FOR POWER/GROUND NOISE SUPPRESSION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 55. ISSUE 1. P. 159-167 | 28 | 100% | 11 |
4 | ZHANG, MS , TAN, HZ , MAO, JF , (2014) A NOVEL LAYER STACK-UP WITH FREE CAVITY RESONANCE FOR HIGH-PERFORMANCE POWER NOISE SUPPRESSION.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 4. ISSUE 12. P. 1973 -1980 | 30 | 97% | 0 |
5 | SHI, YR , TANG, WC , LIU, S , WANG, C , ZHUANG, W , (2015) MODE ANALYSIS OF MINIATURIZED AND STOPBAND-ENHANCED COMPOSITE ELECTROMAGNETIC BANDGAP STRUCTURE FOR POWER/GROUND NOISE SUPPRESSION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 57. ISSUE 3. P. 532 -537 | 27 | 100% | 2 |
6 | SHI, LF , ZHANG, G , JIN, MM , CHEN, S , HU, XJ , (2016) NOVEL SUBREGIONAL EMBEDDED ELECTROMAGNETIC BANDGAP STRUCTURE FOR SSN SUPPRESSION.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 6. ISSUE 4. P. 613 -621 | 26 | 93% | 0 |
7 | ZHU, HR , MAO, JF , (2013) LOCALIZED PLANAR EBG STRUCTURE OF CSRR FOR ULTRAWIDEBAND SSN MITIGATION AND SIGNAL INTEGRITY IMPROVEMENT IN MIXED-SIGNAL SYSTEMS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 3. ISSUE 12. P. 2092-2100 | 26 | 93% | 8 |
8 | GUO, XC , JACKSON, DR , CHEN, J , (2014) A SEMIANALYTICAL MODEL FOR VIAS WITH ARBITRARILY SHAPED ANTIPADS BASED ON THE RECIPROCITY THEOREM.IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. VOL. 62. ISSUE 12. P. 3239 -3248 | 26 | 93% | 0 |
9 | KIM, M , KAM, DG , (2015) WIDEBAND AND COMPACT EBG STRUCTURE WITH BALANCED SLOTS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 5. ISSUE 6. P. 818 -827 | 23 | 100% | 0 |
10 | REN, LH , SHAO, P , QIU, KV , LIM, J , BROOKS, R , TIAN, XX , ZHANG, YJ , FAN, J , (2015) A HYBRID METHOD FOR SIGNAL INTEGRITY ANALYSIS OF TRACES AND VIAS IN AN INFINITELY LARGE PLATE PAIR.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 57. ISSUE 4. P. 885 -893 | 26 | 87% | 0 |
Classes with closest relation at Level 1 |